RLT0510-2-R075F DELTA | Alldatasheet
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SPECIFICATION FOR APPROV AL DOCUMENT : SRK220000NH REVISION : A2 PAGE : 1 OF 9 1/8W, 0402, Low Resistance Chip Resistor (Lead / Halogen Free) 1. Scope This specification applies to1.0mm x 0.5mm size 1/8W, fixed thick film low resistance value chip resistors rectangular type. 2. Type Designation (1) (2) (3) (4) Where (1) Size No . (2) Power Rating: 2 = 1/8W (3) Resistance value: For example -- R075 = 0.075 Ω R100 = 0.100 Ω The “R” shall be used as a decimal point (4) Resistance tolerance: 3. Outline Dimensions L W a a t b Code Letter Dimension L 1.00 ± 0.10 W 0.50 ± 0.10 t 0.35 +0.15/-0.10 a 0.25 ± 0.10 b 0.30 ± 0.10 Unit : mm
SPECIFICATION FOR APPROV AL DOCUMENT : SRK220000NH REVISION : A2 PAGE : 2 OF 9 4. Ratings 4-1 Specification Table 1 Power Rating* 1/8W Resistance Tolerance 1%(F), 2%(G), 5%(J) Resistance Range 0.065 ~ <0.60 Ω 0.60 ~ 1.0 Ω Temperature Coefficient of Resistance(ppm/ ℃) ±300 ±200 Operating Temperature Range -55 ℃ to 125 ℃ Note*: Power Rating is based on continuous full load operation at rated ambient temperature of 70 ℃. For resistor operated at ambient temperature in excess of 70 ℃,the maximum load shall be derated in accordance with the following curve. 4-2 Rated V oltage RPV ×= Where V : Rated voltage (V) P : Rated power (W) R : Nominal resistance ( Ω ) 4-3 Operating and Storage Temperature Range -55 to +125 ℃ RATED LOAD(%) AMBIENT TEMPERATURE( ) ℃ -55 70 125 100
SPECIFICATION FOR APPROV AL DOCUMENT : SRK220000NH REVISION : A2 PAGE : 3 OF 9 5. Characteristics Item Specification and Requirement Test Method (JIS 5201) Temperature Coefficient of Resistance (TCR) As follow table 1. Room temperature Room temperature+100 Short Time Overload △ R:±1.0% Without damage by flashover, spark, arcing, burning or breakdown (1) Applied voltage: 2.5 x rated voltage (2) Test time: 5 seconds Insulation Resistance Over 100 M Ω on Overcoat layer face up Over 1,000 M Ω on Substrate side face up (1) Setup as figure 1 (2) Test voltage: 100V DC ±15V DC (3) Test time: 60 + 10 / - 0 seconds V oltage Proof Resistance range:±1.0% Without damage by flashover, spark, arcing, burning or breakdown (1) Setup as figure 1 (2) Test voltage: 100VAC (rms.) (3) Test time: 60 + 10 / - 0 seconds Insulation Plate Spring Sample Electrode Metal B lock Measurement Point B Pressure Rod (Metal) Measurement Point A Substrate Over coat Film Figure 1 : Measurment Setup (R=0.5 mm) A B V oltage Supply Substrate Side
SPECIFICATION FOR APPROV AL DOCUMENT : SRK220000NH REVISION : A2 PAGE : 4 OF 9 5-2 Mechanical Item Specification and Requirement Test Method (JIS 5201) Solderability The surface of terminal immersed shall be minimum of 95% covered with a new coating of solder Solder bath: After immersing in flux, dip in 245 ± 5 ℃ molten solder bath for 2 ± 0.5 seconds Resistance to Solder Heat △ R: ± 1.0% Without distinct deformation in appearance (1) Pre-heat: 100~110 for 30 seconds (2) Immersed at solder bath of 270 ± 5 ℃ for 10 ± 1 seconds (3) Measuring resistance 1 hour after test Bending Test △ R: ± 1.0% Without mechanical damage such as break Bending value: 3 mm for 30 ± 1 seconds
SPECIFICATION FOR APPROV AL DOCUMENT : SRK220000NH REVISION : A2 PAGE : 5 OF 9 5-3 Endurance Item Specification and Requirement Test Method (JIS 5201) Rapid Change of Temperature △ R:±1.0% Without distinct damage in appearance (1) Repeat 5 cycle as follow: (-55 ± 3 ℃,30minutes) → (Room temperature, 2~3 minutes) → (+125 ± 2 ℃,30minutes) → (Room temperature 2~3 minutes) (2) Measuring resistance 1 hour after test Moisture with Load △ R: ±5.0% Without distinct damage in appearance (1) Environment condition: 40 ± 2 ℃,90~95% RH (2) Applied V oltage: rated voltage (3) Test period: (1.5 hour ON) → (0.5 hour OFF) cycled for total 1,000 + 48 / - 0 hours (4) Measuring resistance 1 hour after test Load Life △ R: ±5.0% Without distinct damage in appearance (1) Test temperature: 70 ± 3 (2) Applied V oltage: rated voltage (3) Test period: (1.5 hour ON) → (0.5 hour OFF) cycled for total 1,000 + 48 / - 0 hours (4) Measuring resistance 1 hour after test Low Temperature Store △ R: ± 5.0% Without distinct damage in appearance (1) Store temperature: -55 ± 3 ℃ for total 1,000 + 48 / - 0 hours (2) Measuring resistance 1 hour after test High Temperature Store △ R: ± 5.0% Without distinct damage in appearance (1) Store temperature: +125 ± 2 ℃ for total 1,000 + 48 / - 0 hours (2) Measuring resistance 1 hour after test
SPECIFICATION FOR APPROV AL DOCUMENT : SRK220000NH REVISION : A2 PAGE : 6 OF 9 6. Recommend Land Pattern Dimensions 7. Construction Drawing A 0.6~1.0 B 2.0~2.4 C 0.6~1.0 Unit : mm C A B Thin electrode fil m :NiCr+NiCu Thick film Resistor Dielectric coating Alumina substrate ( A l2O 3 ) Resin coating(Epoxy) Side Electrode : Cu+Ni+Sn plating
SPECIFICATION FOR APPROV AL DOCUMENT : SRK220000NH REVISION : A2 PAGE : 7 OF 9 8. Packaging 8-1 Dimensions 8-1-1 Tape packaging dimensions Remark: Leader tape length ≧30 cm( 150 Hollow carrier cavity) 8-1-2 Reel dimensions 2.0 ¯13.0 ±0.2 20min. 9.0 ±0.3 Unit : mm ¯180+0/-3 ¯60.0 +0/ -1 ¯56.0 ±1 13 ±1. 4 D=3.5±0.05 C=1.75±0.1 Chip 0. 42 ±0. 05 B A 4.0±0.1 8.0±0.3 D C Carrier cavity Pulling direction Unit : mm Sprocket hole 2.0±0.05 A= 0.68 ±0. 05 B= 1.18 ±0 .05 ¯1.5 ±0.1
SPECIFICATION FOR APPROV AL DOCUMENT : SRK220000NH REVISION : A2 PAGE : 8 OF 9 8-2 Peel force of top cover tape The peel speed shall be about 300 mm/min. The peel force of top cover tape shall be between 0.1 to 0.7 N. 8-3 Numbers of taping 10,000 pieces /reel 8-4 Label making The following items shall be marked on the reel. (1) Type designation. (2) Quantity (3) Manufacturing date code (4) Manufacturer’s name 165 ~ 180° Top Cover Tape 0.1~0.7 N
SPECIFICATION FOR APPROV AL DOCUMENT : SRK220000NH REVISION : A2 PAGE : 9 OF 9 9. Carenote 9-1 Care note for storage (1) Chip resistor shall be stored in a room where temperature and humidity must be controlled. (temperature 5 to 35 ℃, humidity 45 to 85% RH) However, a humidity keep it low, as it is possible. (2) Chip resistor shall be stored as direct sunshine doesn’t hit on it. (3) Chip resistor shall be stored with no moisture, dust, a material that will make solderability inferior, and a harmful gas (Chloridation hydrogen, sulfurous acid gas, and sulfuration hydrogen) 9-2 Carenote for operating and handling (1) It is necessary to protect the edge and protection coat of resistors from mechanical stress. (2) Handle with care when printing circuit board (PCB) is divided or fixed on support body, because bending of printing circuit board (PCB) mounting will make mechanical stress for resistors. (3) Resistors shall be used with in rated range shown in specification. Especially, if voltage more than specified value will be loaded to resistor, there is a case it will make damage for machine because of temperature rise depending on generating of heat, and increase resistance value or breaks. (4) In case that resistor is loaded a rated voltage, it is necessary to confirms temperature of a resistor and to reduce a load power according to load reduction curve, because a temperature rise of a resistor depends on influence of heat from mounting density and neighboring element. (5) Observe Limiting element voltage and maximum overload voltage specified in each specification (6) If there is possibility that a large voltage (pulse voltage, shock voltage) charge to resistor, it is necessary that operating condition shall be set up before use.