RL36370-R002-F DELTA | Alldatasheet
Document overview
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Technical content
current sensing resistors used in electronic equipment.
- Outline Designation and Marking
Figure 1. Construction and Dimensions
DOCUMENT : SRG00000NH REVISION : A0 P A G E : 2 O F 6 SPECIFICATION FOR APPROV AL 3-2 Marking Resistance value is marked on the top surface. Ex.) 2m Ω → R002 10mΩ → R010 4. Ratings 4-1 Specification Power Rating* 3 W Resistance Value 1 mΩ ~ <2 mΩ 2 ~ 10mΩ Temperature Coefficient of Resistance 0~+150 ppm/℃ ±100ppm/℃ Resistance Tolerance ± 1%,± 2%,± 5% Insulation Resistance Over 100MΩ Rated V oltage (V) ( P*R)1/2 Note * : Power rating is based on continuous full load operation at rated ambient temperature of 70℃. For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be derated in accordance with the following curve. AMBIENT TEMPERATURE( )℃ 0 17070 100 RATED LOAD(%) -55 Figure 2.：Power Temperature Derating Curve 4-2 Operation and Storage Temperature Range -55℃ to +170℃
SPECIFICATION FOR APPROV AL DOCUMENT : SRG00000NH REVISION : A0 P A G E : 3 O F 6 5. Life test Test Item Condition of Test Requirements Short Time Overload 5 * Rated power for 5 seconds Refer to JIS C 5201-1 4.13 Thermal Shock -55 ~150℃ 1,000 cycles, 15 min at each extreme condition Refer to JIS C 5201-1 4.19 Low Temperature Storage Kept at -55℃, 1,000 hours Refer to JIS C 5201-1 4.23.4 Resistance to Soldering Heat Dipped into solder at 270 ± 5℃ for 20 ± 1 seconds Refer to JIS C 5201-1 4.29 Load Life Rated voltage for 1.5hours followed by a pause 0.5hour at 70 ± 3℃. Cycle repeated 1000 hours Refer to JIS C 5201-1 4.25 Damp Heat with Load 40 ± 2℃ with relative humidity 90% to 95%. Cycle repeated 1,000 hours Refer to JIS C 5201-1 4.24 High Temperature Exposure Kept at 170℃ for 1,000 hours Refer to JIS C 5201-1 4.23.2 Solderability Temperature of Solder : 245 ± 5℃ Immersion Duration : 3 ± 0.5 seconds Refer to JIS C 5201-1 4.17 Uniform coating of solder cover minimum of 95% surface being immersed Mechanical Shock 100 G’s for 6milliseconds. 5 pulses Refer to JIS C 5201-1 4.21 Bending Test Glass-Epoxy board thickness : 1.6mm Bending width : 2mm Between the fulcrums : 90mm Refer to JIS C 5201-1 4.33
DOCUMENT : SRG00000NH REVISION : A0 P A G E : 4 O F 6 SPECIFICATION FOR APPROV AL 6. Recommended Solder Pad Dimensions 3637 a b c d e Unit : mm 7. Packaging 7-1 Dimensions 7-1-1 Tape packaging dimensions Symbol Ao Bo Ko Po P1 P2 Symbol T E F Do D1 W
DOCUMENT : SRG00000NH REVISION : A0 P A G E : 5 O F 6 SPECIFICATION FOR APPROV AL 7-1-2 Reel dimensions A 17.4 ± 1.0 F 20.2 ± 0.1 C 99 ± 1.0 H 2.5 ± 0.5 D 380 ± 0.5 Unit : mm F G H D B A C
DOCUMENT : SRG00000NH REVISION : A0 P A G E : 6 O F 6 SPECIFICATION FOR APPROV AL 7-2 Peel Strength of Top Cover Tape The peel speed shall be about 300mm/minute The peel force of top cover tape shall between 0.1 to 0.7N 7-3 Number of Taping 1,000 pieces / reel 7-4 Label marking The following items shall be marked on the reel. (1) Type designation (2) Quantity (3) Manufacturing date code (4) Manufacturer’s name (5) The country of origin 165 ~ 180° Top Cover Tape Carrier tape 0.1 ~ 0.7N