RL32646C-R003-F DELTA | Alldatasheet

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sensing resistors used in electronic equipment. Figure 1. Construction and Dimensions

SPECIFICATION FOR APPROV AL DOCUMENT : SM6C0000NH REVISION : A1 PAGE : 2 OF 7 4. Specification Characteristics Feature Power Rating* 1W Resistance Value 3 ~ 100m Ω Temperature Coefficient of Resistance ±100ppm/ ℃ Operation Temperature Range -55 ℃ ~ +170 ℃ Resistance Tolerance ±1% , ±2% , ±5% Insulation Resistance Over 100M Ω Maximum Working V oltage (V) ( P*R) 1/2 Note * : Power rating is based on continuous full load operation at rated ambient temperature of 70 For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be derated in accordance with the following curve. -55 100 170 RATED LOAD(%) AMBIENT TEMPERA TURE( ℃) Figure 2.：Power Temperature Derating Cur ve

SPECIFICATION FOR APPROV AL DOCUMENT : SM6C0000NH REVISION : A1 PAGE : 3 OF 7 5. Reliability Performance Test Item Condition of Test Requirements Short Time Overload 2.5 x Rated power for 5 seconds Refer to JIS C 5201-1 4.13 Without significant damage by flashover ( spark, arching ), burning or breakdown etc. Thermal Shock -55 ~150 ℃ 1,000 cycles, 15 min at each extreme condition Refer to JIS C 5201-1 4.19 Without distinct damage in appearance Low Temperature Storage Kept at -55 ℃, 1,000 hours Refer to JIS C 5201-1 4.23.4 Without distinct damage in appearance Resistance to Soldering Heat Dipped into solder at 270 ± 5 ℃ for 20 ± 1 seconds Refer to JIS C 5201-1 4.18 Without distinct damage in appearance Load Life Rated voltage for 1.5hours followed by a pause 0.5hour at 70 ± 3 ℃ Cycle repeated 1,000 hours Refer to JIS C 5201-1 4.25 Without distinct damage in appearance Damp Heat with Load 40 ± 2 ℃ with relative humidity 90% to 95%. D.C. rated voltage for 1.5 hours ON 30 minutes OFF. Cycle repeated 1,000 hours Refer to JIS C 520 1-1 4.24 Without distinct damage in appearance High Temperature Exposure Kept at 170 ℃ for 1,000 hours Refer to JIS C 5201-1 4.23.2 Without distinct damage in appearance Solderability Temperature of Solder : 245 ± 5 ℃ Immersion Duration : 3 ± 0.5 second Refer to JIS C 5201-1 4.17 Uniform coating of solder cover minimum of 95% surface being immersed

SPECIFICATION FOR APPROV AL DOCUMENT : SM6C0000NH REVISION : A1 PAGE : 4 OF 7 Test Item Condition of Test Requirements Mechanical Shock 100 G’s for 6milliseconds. 5 pulse s Refer to JIS C 5201-1 4.21 Without mechanical damage such as break Substrate Bending Glass-Epoxy board thickness : 1.6 mm Bending width : 2mm Between the fulcrums : 90mm Refer to JIS C 5201-1 4.33 Without mechanical damage such as break

SPECIFICATION FOR APPROV AL DOCUMENT : SM6C0000NH REVISION : A1 PAGE : 5 OF 7 6. Recommended Solder Pad Dimensions W L D 3264 4.00 8.00 2.00 Unit : mm Note : We recommend there is no circuit design between pads to avoid circuit short Cu Trace W L D Sensing Trace

SPECIFICATION FOR APPROV AL DOCUMENT : SM6C0000NH REVISION : A1 PAGE : 6 OF 7 7. Packaging 7-1 Dimensions 7-1-1 Tape packaging dimensions 7-1-2 Reel dimensions 13.0±0.5 178.0±2.0 60.2±0.5 13.2±1.5 2.0±0.5 +0.5 4.00 16.0±0.2 Unit : mm 2.0 ± 0.05 Cavity 4.0 ± 0.1 0.3 max. 1.5 max. B A A = 3.60 ± 0.20 B = 6.80 ± 0.20 1.5 ± 0.1 +0.1 -0.0 1.5 1.75 ± 0.10 Pulling direction 4.0 ± 0.1 12.0 ± 0.3 Unit : mm 5.50 ± 0.05 Feed forward hole

SPECIFICATION FOR APPROV AL DOCUMENT : SM6C0000NH REVISION : A1 PAGE : 7 OF 7 7-2 Peel Strength of Top Cover Tape The peel speed shall be about 300mm/min. The peel force of top cover tape shall between 0.1 to 0.7N 7-3 Number of Taping 2,000 pieces / reel 7-4 Label marking The following items shall be marked on the reel. (1) Type designation (2) Quantity (3) Manufacturing date code (4) Manufacturer’s name (5) The country of origin 165 ~ 180 ° Carrier tape 0.1 ~ 0.7N Top Cover Tape