RL1005-2-R075F DAESAN | Alldatasheet
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- Construction and Physical Dimensions
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SPECIFICATION FOR APPROV AL DOCUMENT : SR120000NH REVISION : A2 PAGE : 2 OF 8 4. Ratings 4-1 Specification Power Rating* 1/8 W Resistance Range 0.020 Ω ~ <0.070 Ω 0.070 Ω ~ 1 Ω Resistance Tolerance ±1% , ±2% , ±5% ±1% , ±2% , ±5% Temperature Coefficient of Resistance 0~500ppm/ ℃ ±100ppm/ ℃ Note*: Power Rating is based on continuous full load operation at rated ambient temperature of 70 For resistors operated at ambient temperature in excess of 70 ℃, the maximum load shall be derated in accordance with the following curve. Figure 2 Derating Curve 4-2 Rated V oltage The rated voltage shall be determined by the following expression. RPV ×= Where V ：Rated voltage (V) R ：Nominal resistance value ( Ω ) P：Rated dissipation (W) 4-3 Operating and Storage Temperature Range -55 to +125 ℃ -55 70 125 ℃ 100 Percentage of the rated dissipation Ambient temperature
SPECIFICATION FOR APPROV AL DOCUMENT : SR120000NH REVISION : A2 PAGE : 3 OF 8 5. Characteristics Test Item Condition of Test Requirements Short Time Overload 2.5 * Rated power for 5 seconds Refer to JIS C 5201-1 4.13 Without significant damage by flashover ( spark, arching ), burning or breakdown etc. Insulation Resistance The resistor shall be cramped in the metal block and tested , as shown below. Test voltage : 100 ± 15VDC for 1 minute Refer to JIS C 5201-1 4.6 Mounting condition G . Between Electrode and Protection Film 100M Ω or over Between Electrode and Substrate 1,000M Ω or over V oltage Proof The voltage : 100V AC (rms.) for 1 minute Refer to JIS C 5201-1 4.7 Without damage by flashover, fire or breakdown, as shown below. Thermal Shock -55 ~125 ℃ 5 cycles, 15 min at each extreme condition Refer to JIS C 5201-1 4.19 Ω ) Without distinct damage in appearance Low Temperature Storage Kept at -55 ℃, 1,000 hours Refer to JIS C 5201-1 4.23.4 Without distinct damage in appearance High Temperature Exposure Kept at 125 ℃ for 1,000 hours Refer to JIS C 5201-1 4.23.2 Without distinct damage in appearance Solderability Temperature of Solder : 245 ± 5 ℃ Immersion Duration : 2 ± 0.5 second Refer to JIS C 5201-1 4.17 Uniform coating of solder cover minimum of 95% surface being immersed Resistance to Soldering Heat Dipped into solder at 270 ± 5℃ for 10 ± 1 seconds Refer to JIS C 5201-1 4.18 Ω ) Without distinct deformation in appearance
SPECIFICATION FOR APPROV AL DOCUMENT : SR120000NH REVISION : A2 PAGE : 4 OF 8 Test Item Condition of Test Requirements Load Life Rated voltage for 1.5 hours followed by a pause 0.5 hour at 70 ± 2℃. Cycle repeated 1000 hours Refer to JIS C 5201-1 4.25 Ω ) Without distinct damage in appearance Damp Heat with Load 60 ± 2 ℃ with relative humidity 90% to 95%. D.C. rated voltage for 1.5 hours ON and 30 minutes OFF. Cycle repeated 1,000 hours Refer to JIS C 5201-1 4.24 Ω ) Without distinct damage in appearance Mechanical Shock 100 G’s for 6milliseconds. 5 pulse s Refer to JIS C 5201-1 4.21 Without mech anical damage such as break Bending Test Glass-Epoxy board thickness : 1.6mm Bending width : 2mm Between the fulcrums : 90mm Refer to JIS C 5201-1 4.33 ΔR : ±(0.5%+0.0005 Ω ) Without mech anical damage such as break
SPECIFICATION FOR APPROV AL DOCUMENT : SR120000NH REVISION : A2 PAGE : 5 OF 8 Mounting of the test sample onto the test board shall be either of following methods. (1) Mounting by solder dipping Epoxy based glue shall be applied in the middle of two lands of the test board. The resistor shall be mounted in such a way that the electrodes of resistors will be evenly placed in the land area and then adhesive resin shall be cured. After applying the Resin Flux with 25 weight % Methyl Alcohol, the board shall be soldered by dipping into a molten solder bath with 260 ± 5℃ for 3 to 5 seconds (2) Mounting by Reflow soldering Solder paste with approximate 200 μm thickness shall be applied to the land of test board. The resistor shall be mounted in such way that the electrodes of resistors will be evenly placed in the land area and then shall be soldered under the circumstance that the surface temperature of the board shall be raised 245 ± 5℃(peak) for 5 to 10 seconds in an upper-heater oven. Material : Glass Fabric Epoxy Resin ( Refer to JIS C 6484 ) Board thickness : 1.6mm Copper foil thickness : 0.035mm Solder Resist Coating Test board A ( for substrate bending test) a b c f 0.6 2.0 0.7 (2.0) Unit : mm 100 c b af Land 4.5
SPECIFICATION FOR APPROV AL DOCUMENT : SR120000NH REVISION : A2 PAGE : 6 OF 8 Test board B ( for another test) 58.5 50.5 2.0 16.5 1.9 1.24 0.6 25.0 3.0 3.0 0.7 1.32 1.65 1.65 5.08 1.32 Unit : mm
SPECIFICATION FOR APPROV AL DOCUMENT : SR120000NH REVISION : A2 PAGE : 7 OF 8 6. Packaging 6-1 Dimensions 6-1-1 Tape packaging dimensions ※ Pre-emptied holes : 150 holes (or 30cm) or more. Code letter a b Unit : mm Dimension 0.68 ± 0.05 1.18 ± 0.05 6-1-2 Reel Dimensions (Plastic reel : Correspond with EIAJ RRV08B) Label 105 x 50 13 ± 0.2 28 ± 0.8 9 ± 0.3 13 ± 1.4 180 +0 105 Unit : mm 60 +1 1.5 0.1 0.0 Carrier cavity Sprocket hole CHIP 1.75 ±0.1 8.0 ± 0.3 3.5 ± 0.05 0.42 ± 0.05 Pull Direction 4.0 ± 0.1 B A
SPECIFICATION FOR APPROV AL DOCUMENT : SR120000NH REVISION : A2 PAGE : 8 OF 8 6-2 Peel force of top cover tape The peel speed shall be about 300 mm / min. The peel force of top cover tape shall be between 0.1 to 0.7 N. 6-3 Numbers of taping 10,000 pieces / reel 6-4 Making The following items shall be marked on the reel. (1) Type designation (2) Quantity (3) Manufacturing date code (4) Manufacturer’s name (5) The country of origin 165 ~ 180° Top Cover Tape 0.1~0.7 N