RK701 DFI | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 3
Technical content
Resolution Dual Displays Multiple Expansion RICH I/O 2GB/4GB/8GB DDR4 Memory Down Supports 4K / 2K reso- lution 1 eDP/LVDS +
1 DP/TMDS
2 PCIe 3.0, 1 PCIe 2.0 1 Realtek GbE, 1 USB 3.2, 4 USB 2.0 Rockchip Processor QsevenRK701 Bottom View Front View
www.dfi.com eMMC 8G SPI ROM (Option) uSD Socket (Option) Debug Header DIP Switch MRAM 1Mb MR25H10 Camera-IF Connector (Option) MECHANICAL DRAWING BLCOK DIAGRAM Rockchip RK3568 Quad Core Cortex-A55 Up to 2GHz MXM 230pin Golden Finger PHY 10/100/1000 RTL8211F-CG PCIe 3.0 Clock Gen PI6C557-03BLE RGMII 1 DDR4 32bit eMMC FSPI SD UART2 SPI1_CS0_M1 MIPI-CSI GPIO x4 PCIe Clock SATA (0) I2S eDP / LVDS USB 2.0 4x DP / TMDS UART1_M0 TX/RT/RTS/CTS SATA (1) I2C CAN2_M0 USB 3.2 (for 1 USB-A port only) PCIe 3.0 2x UART4_M1 TX/RX MDI PCIe Clock PCIe Gen2 (Optional) SPI2_M0x5 SPI3_M1x4 / pin 185-192 Pin69,71 SPI0_M1 SPI0 TPM 2.0 SLB9672 (Optional) RTC S35390A Rockchip RK809 PMIC I2C5_M0 I2C0 I2S1 VBAT (3V) DDR4 x16 Max 3200MHz
www.dfi.com SPECIFICATION SYSTEM Processor Rockchip RK3568 quad-core Cortex-A55 @2.0GHz Rockchip RK3568J quad-core Cortex-A55 @1.8GHz Memory 2GB/4GB/8GB DDR4 Memory Down 3200MHZ GRAPHICS Controller G52 2EE Display 1 x eDP/LVDS 1 x DP/TMDS HDMI: resolution up to 4096 x 2160 @30HZ LVDS: resolution up to1024 x 600 @60Hz eDP: resolution up to 3840 x 2160 @60Hz Dual Displays eDP/LVDS + DP/TMDS EXPANSION Interface 2 x PCIe x1 (Gen 3) 1 x PCIe x1 (Gen 2) 1 x uSD (available upon request) 1 x I2C 2 x SPI (SPI0 set to TPM 2.0) 1 x CAN bus 2 x UART 1 x MIPI-CSI (available upon request) AUDIO Interface HD Audio ETHERNET Controller 1 x RTL8211F-CG I/O USB 1 x USB 3.2 4 x USB 2.0 SATA 2 x SATA 3.0 (up to 6Gb/s, SATA 1 Co-Lay PCIE Gen 2) eMMC Supports up to 128GB eMMC, NC as default eMMC 5.1, BGA-153 Ball 8~128G(MLC mode) GPIO 1 x 4-bit GPIO SECURITY TPM TPM 2.0 POWER Type 5V, 5VSB, VCC_RTC Consumption TBD OS SUPPORT OS Support (UEFI Only) Linux ENVIRONMENT Temperature Operating: 0 to 60°C, -40 to 85°C Humidity Operating: 5 to 90% RH Storage: 5 to 90% RH MTBF TBD MECHANICAL Dimensions Qseven form factor Compliance Qseven specification revision 2.1 STANDARDS AND CERTIFICATIONS Certification CE, FCC Class B, RoHS PACKING LIST OPTIONAL ITEMS
ORDERING INFORMATION
Model Name P/N CPU Memory eDP USB 3.2 USB 2.0 eMMC Operating Temp. RK701-BC41-RK3568 770-RK7011-000G RK3568 4 GB LVDS 1 4 16GB 0 to 60°C RK701-BC81-RK3568 770-RK7011-100G RK3568 8 GB LVDS 1 4 16GB 0 to 60°C RK701-TC81-RK3568J 770-RK7011-200G RK3568J 8 GB LVDS 1 4 16GB -40 to 85°C
- 1 RK700 board
- 1 Heat sink
- Qseven Carrier Board
- Heat spreader DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © October 31, 2024 DFI Inc.