RHR1K160 INTERSIL | Alldatasheet

Document overview

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Technical content

Features

  • Thermal Impedance SPICE Model
  • Thermal Impedance SABER™ Model
  • Avalanche Energy Rated
  • Planar Construction
  • Related Literature - TB334, “Guidelines for Soldering Surface Mount Components to PC Boards”

Applications

  • Switching Power Supplies
  • Power Switching Circuits
  • General Purpose Packaging JEDEC MS-012AA

Ordering Information

RHR1K160 MS-012AA RHR1K160 NOTE: When ordering, use the entire part number. For ordering in tape and reel, add the suffix 96 to the part number, i.e. RHR1K16096. ANODE (2) CATHODE (8)NC (1) CATHODE (7) CATHODE (6) CATHODE (5) ANODE (3) NC (4) BRANDING DASH 1 2 3 4 Absolute Maximum Ratings TA = 25oC, Unless Otherwise Specified RHR1K160 UNITS TA = 65oC Square Wave, 20kHz Halfwave, 1 Phase, 60Hz 10 A Maximum Temperature for Soldering 300 260 oC oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Data Sheet January 2000

Electrical SpecificationsTA = 25oC, Unless Otherwise Specified SYMBOL TEST CONDITION MIN TYP MAX UNITS VF IF = 1A - - 2.1 V IF = 1A, TA = 150oC - - 1.7 V IR VR = 600V - - 100 µA VR = 600V, TA = 150oC - - 500 µA trr IF = 1A, dIF/dt = 200A/µs- - 2 5 n s ta IF = 1A, dIF/dt = 200A/µs - 10.5 - ns tb IF = 1A, dIF/dt = 200A/µs- 5 - n s Q RR IF = 1A, dIF/dt = 200A/µs - 20 - nC C J VR = 10V, IF = 0A - 10 - pF R θJA Pad Area = 0.769 in2 (Note 1) - - 50 oC/W Pad Area = 0.054 in2 (Note 2) (Figure 13) - - 177 oC/W Pad Area = 0.0115 in2 (Note 2) (Figure 13) - - 217 oC/W DEFINITIONS VF = Instantaneous forward voltage (pw = 300µs, D = 2%). IR = Instantaneous reverse current. trr= Reverse recovery time (See Figure 10), summation of ta +tb. ta = Time to reach peak reverse current (See Figure 10). tb = Time from peak IRM to projected zero crossing of IRM based on a straight line from peak IRM through 25% of IRM (See Figure 10). Q rr = Reverse recovery charge. C J = Junction Capacitance. R θJA = Thermal resistance junction to ambient. pw = Pulse width. D = Duty cycle. NOTES: 1. Measured using FR-4 copper board at 3.2 seconds. 2. Measured using FR-4 copper board at 1000 seconds. RHR1K160

FIGURE 7. JUNCTION CAPACITANCE vs REVERSE VOLTAGE FIGURE 8. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE FIGURE 9. trr TEST CIRCUIT FIGURE 10. t rr WAVEFORMS AND DEFINITIONS

0.25 IRM

each of the listed pad areas. RTHERM4 remain constant for each of the thermal models. FIGURE 14. TRANSIENT THERMAL IMPEDANCE vs MOUNTING PAD AREA

All Intersil semiconductor products are manufactured, assembled and tested underISO9000 quality systems certification. from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. TABLE 1. THERMAL MODELS

8 LEAD JEDEC MS-012AA SMALL OUTLINE PLASTIC PACKAGE

A A 1 E e b D L h x 45o 0o-8o c 0.004 IN 0.10 mm 0.155 4.0 0.275 7.0 0.050 1.27 0.024 0.6 0.060 1.52 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE-MOUNTED APPLICATIONS SYMBOL INCHES MILLIMETERS NOTESMIN MAX MIN MAX A 0.0532 0.0688 1.35 1.75 - A1 0.004 0.0098 0.10 0.25 - b 0.013 0.020 0.33 0.51 - c 0.0075 0.0098 0.19 0.25 - D 0.189 0.1968 4.80 5.00 2 E 0.2284 0.244 5.80 6.20 - E1 0.1497 0.1574 3.80 4.00 3 e 0.050 BSC 1.27 BSC - H 0.0099 0.0196 0.25 0.50 - L 0.016 0.050 0.40 1.27 4 NOTES: 1. All dimensions are within allowable dimensions of Rev. C of JEDEC MS-012AA outline dated 5-90. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.006 inches (0.15mm) per side. 3. Dimension “E 1” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.010 inches (0.25mm) per side. 4. “L ” is the length of terminal for soldering. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. Controlling dimension: Millimeter. 7. Revision 8 dated 5-99. USER DIRECTION OF FEED LC 2.0mm 4.0mm 1.75mm 1.5mm DIA. HOLE 8.0mm 12mm COVER TAPE 330mm 50mm 13mm 18.4mm 12.4mmGENERAL INFORMATION 1. 2500 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION “A” SPECIFICATIONS. ACCESS HOLE 40mm MIN.