RHFL4913XX25_V01 STMICROELECTRONICS | Alldatasheet
Document overview
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- PDF pages: 20
Technical content
Datasheet sections
- 1 Diagram
- 2 Pin configuration
- 3 Maximum ratings
- 4 Electrical characteristics
- 5 Device description
- 5.1 Low pin count package limitations
- 5.2 SENSE pin
- 5.3 Inhibit ON-OFF control
- 5.4 Overtemperature protection
- 5.5 Overcurrent protection
- 5.6 OCM pin
- 5.7 Alternate to
- 6 Application information
- 6.1 Remote sensing operation
- 7 Notes about FLAT-16P package
- 7.1 Radiation performance
- 7.2 Die information
- 8 Package information
- 8.1 Flat-16 package information
- 8.2 SMD5C package information
- 8.3 TO-257 package information
- 9 Ordering information
Features
- 2 and 3 A low dropout voltage
- Embedded overtemperature and overcurrent protection
- Adjustable current limitation
- Output overload monitoring/signalling
- Fixed 2.5 V, 3.3 V, 5.0 V output voltages
- Inhibit (ON/OFF) TTL-compatible control
- Programmable output short-circuit current
- Remote sensing operation
- Rad-hard: tested up to 300 krad Mil Std 883E Method 1019.6 low dose rate conditions
- Heavy Ion, SEL immune
- QML-V qualified, DLA SMD are 5962F02534 / 02535 / 02536
Description
The RHFL4913XX25, RHFL4913XX33 and RHFL4913XX50 belong to a high- performance rad-hard positive fixed voltage regulator family. Available in various hermetic ceramic packages, they are suitable for harsh environments. Input supply range is up to 12 V. These devices are QML-V qualified, DLA SMD are 5962F02534 / 02535 / 02536. Maturity status link RHFL4913XX25, RHFL4913XX33 and RHFL4913XX50 Rad-hard positive fixed voltage regulator RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Datasheet DS3260 - Rev 15 - February 2021 For further information contact your local STMicroelectronics sales office.
1 Diagram
Figure 1. Block diagram for package SMD.5 and TO-257 Figure 2. Block diagram for package FLAT-16P
2 Pin configuration
Figure 3. Pin configuration (top view for FLAT-16P, bottom view for SMD.5) Table 1. Pin description
- The upper metallic package lid and the bottom metallization are neither connected to regulator die nor to
package terminals, hence electrically floating.
- The upper metallic package lid is neither connected to regulator die nor to package terminals, hence
3 Maximum ratings
Table 2. Recommended maximum operating ratings
- Internally limited to about maximum +175 °C by thermal shutdown circuit.
Note: Exceeding maximum ratings may damage the device. Table 3. Thermal data
4 Electrical characteristics
TJ = 25 °C, VI = VO + 2.5 V, CI = CO = 1 µF, unless otherwise specified. Table 4. Electrical characteristics
Electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit Vd Dropout voltage IO = 400 mA, TJ = -55 °C 300 400 mV IO = 400 mA, TJ = +25 °C 350 450 IO = 400 mA, TJ = +125 °C 450 550 IO = 1 A, TJ = -55 °C 550 IO = 1 A, TJ = +25 °C 650 IO = 1 A, TJ = +125 °C 800 IO = 2 A, TJ = +25 °C 750 IO = 2 A, TJ = +125 °C 950 VINH(ON) Inhibit voltage IO = 5 mA, TJ = -55 to +125 °C 0.8 V VINH(OFF) Inhibit voltage IO = 5 mA, TJ = -55 to +125 °C 2.4 SVR Supply voltage rejection (1) VI = VO + 2.5 V ± 1 V, IO = 5 mA f = 120 Hz 60 70 dB VI = VO + 2.5 V ± 1 V, IO = 5 mA f = 33 kHz 30 40 ISH Shutdown input current VINH = 5 V 15 µA VOCM OCM pin voltage Sinked IOCM = 24 mA active low 0.38 V tPLH tPHL Inhibit propagation delay (1) VI = VO + 2.5 V, VINH = 2.4 V, IO = 400 mA, ON-OFF 20 µs OFF-ON 100 µs eN Output noise voltage (1) B = 10 Hz to 100 kHz, IO = 5 mA to 2 A 40 µVrms 1. These values are guaranteed by design. For each application it is strongly recommended to comply with the maximum current limit of the package used. Figure 4. Application diagram for remote sensing operation
5 Device description
The RHFL4913 fixed voltage contains a PNP type power element controlled by a signal resulting from amplified comparison between the internal temperature compensated band-gap cell and the fraction of the desired output voltage value. This fractional value is obtained from an internal-to-die resistor divider bridge set by STMicroelectronics. The device is protected by several functional blocks.
5.1 Low pin count package limitations
Some functions (INHIBIT, OCM, SENSE) are not available due to lack of pins. Corresponding die pads are by default connected inside silicon.
5.2 SENSE pin
The load voltage is applied by a Kelvin line connected to SENSE pin: Voltage feedback comes from the internal divider resistor bridge. Therefore possible output voltages are set by manufacturer mask metal options. SENSE pin is not available in 3-pin packages.
5.3 Inhibit ON-OFF control
By setting the INHIBIT pin TTL high, the device switches off the output current and voltage. The device is ON when the INHIBIT pin is set low. Since the INHIBIT pin is pulled down internally, it can be left floating in cases where the inhibit function is not used. INHIBIT pin is not available in 3-pin packages.
5.4 Overtemperature protection
A temperature detector internally monitors the power element junction temperature. The device turns off when a temperature of approximately 175 °C is reached, returning to ON mode when back to approximately 40 °C. It should be noted that when the internal temperature detector reaches 175 °C, the active power element can be at 225 °C: the device reliability cannot be guaranteed in case of extensive operation under these conditions.
5.5 Overcurrent protection
ISC pin. An internal non-fold back short-circuit limitation is set with ISHORT > 3.8 A (VO is 0 V). This value can be reduced by an external resistor connected between ISC pin and VI pin,with a typical value range of 25 kΩ to 200 kΩ. This adjustment feature is not available in 3-pin packages. To keep excellent VO regulation, it is necessary to set ISHORT 1.6 times greater than the maximum desired application IO. When IO reaches ISHORT – 300 mA, the current limiter overrules regulation and VO starts to drop and the OCM flag is risen. When no current limitation adjustment is required, ISC pin must be left unbiased (as it is in 3 pin-packages).
5.6 OCM pin
The OCM pin goes low when the current limit becomes active, otherwise VOCM = VI. It is buffered and can sink 10 mA. The OCM pin is internally pulled up by a 5 kΩ resistor. Not available in 3-pin packages.
5.7 Alternate to
The RHFL4913 fixed (and custom) voltages replace all 3-terminal industry devices, providing essential benefits
- Lower dropout
- High radiation performance
- Better SVR
- Saving the high stability external setting resistors RHFL4913XX25, RHFL4913XX33, RHFL4913XX50 Device description DS3260 - Rev 15 page 7/20
6 Application information
The RHFL4913 fixed voltage is functional as soon as VI-VO voltage difference is slightly above the power element saturation voltage. A minimum 0.5 mA IO ensures perfect “no-load” regulation. All available VI pins must always be externally interconnected, same thing for all available VO pins, otherwise device stability and reliability cannot be granted. All NC pins can be connected to ground. The INHIBIT function switches off the output current in an electronic way, that is very quickly. According to Lenz’s law, external circuitry reacts with –LdI/dt terms which can be of high amplitude in case some series-inductance exists. The effect would be a large transient voltage developed on both device terminals. It is necessary to protect the device with Schottky diodes preventing negative voltage excursions. In the worst case, a 14 V Zener diode shall protect the device input. The device has been designed for high stability and low dropout operation: minimum 1 μF input and output tantalum capacitors are therefore mandatory. Capacitor ESR range is from 0.01 Ω to over 20 Ω. Such range turns out to be useful when ESR increases at low temperature. When large transient currents are expected, larger value capacitors are necessary. In case of high current operation with expected short-circuit events, caution must be considered relatively to capacitors. They must be connected as close as possible to device terminals. As some tantalum capacitors may permanently fail when submitted to high charge-up surge currents, it is recommended to decouple them with 470 nF polyester capacitors. Being the RHFL4913 fixed voltage manufactured with very high speed bipolar technology 6 GHz fT transistors), the PCB lay-out must be performed with extreme care, very low inductance, low mutually coupling lines, otherwise high frequency parasitic signals may be picked-up by the device resulting into self-oscillation. User’s benefit is a SVR performance extended to far higher frequencies.
6.1 Remote sensing operation
In case the load is located far from the regulator, it is recommended to comply with the scheme below. To obtain the best regulation, it is in addition essential to care about:
- The wire connecting R2 to the load end must not be crossed by the load current (Kelvin sense) The noise captured by the wires between the load and the chip could bring a noisy output voltage. In case this happens, it is recommended that shielded cables are used for these connections. The external wrap must be used for connecting the ground of the chip with the load ground. It is also recommended to place 1 μF tantalum capacitors between output and ground close to the device and another next to the load. RHFL4913XX25, RHFL4913XX33, RHFL4913XX50
Application information
7 Notes about FLAT-16P package
needed, in order to optimize heat removal performance. of some PCBs. TCE= 4.7 ppm/K; Thermal conductivity= 150 W/mK.
7.1 Radiation performance
post radiation parameters are within datasheet pre-rad limits.
7.2 Die information
- Max. die dimensions: 2.794 mm by 3.861 mm or 110 mils by 152 mils
- Die thickness: 357 μm +/- 50 μm
- Pad size: 184 μm by 184 μm
- Metallization: Aluminum 4% silicon alloy
- Die backside: Bare silicon
- Die backside potential: Ground
Figure 5. Die size Note: Die SENSE pad is active in the RHFL4913 fixed die. It shall not be left unbonded. It should be bonded to V O pin.
8 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
8.1 FLAT-16P package information
Figure 6. FLAT-16P package outline
Package information
DS3260 - Rev 15 page 10/20
Table 5. FLAT-16P package mechanical data
Figure 7. SMD.5 package outline Table 6. SMD.5 package mechanical data
8.3 TO-257 package information
Figure 8. TO-257 package outline Table 7. TO-257 package mechanical data
9 Ordering information
Table 8. Order codes Table 9. ST part number-SMD equivalent part number
Ordering information
DS3260 - Rev 15 page 14/20
ST part number SMD part number RHFL4913ESY5005V 5962F0253602VZC RHFL4913ESY5006V 5962F0253602VZA L491325DIE2V 5962F0253402V9A L491333DIE2V 5962F0253502V9A L491350DIE2V 5962F0253602V9A Table 10. Environmental characteristics DS3260 - Rev 15 page 15/20
Revision history
Table 11. Document revision history 05-Oct-2004 4 Mistake in pin description SMD.5 on table 3. 28-Oct-2004 5 New order codes added - tables 4 and 5. 27-May-2005 6 The features, tables 4, 5 and the figures 1, 2 updated. page 16 and Table 6 on page 17. and SMD.5 mechanical data on page 14. 20-Nov-2009 10 Modified: Table 5 on page 16. 19-Oct-2010 11 Modified: Section 7 on page 11. 08-Feb-2011 12 Added: note Table 1 on page 4. 02-May-2019 14 Updated the description.