RH21G100F251CG

RH21G100J251CT WALSIN | Alldatasheet

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Multilayer Ceramic Capacitors Approval Sheet Page 1 of 12 ASC_Microwave_High_ Reliability_(RH)_023B Jun. 2019 *Contents in this sheet are subject to change without prior notice. MULTILAYER CERAMIC CAPACITORS Microwave Series + High Reliability (RH) 0402 to 0805 Sizes (200V to 250V) X8G Dielectric RoHS Compliance

Multilayer Ceramic Capacitors Approval Sheet Page 2 of 12 ASC_Microwave_High_ Reliability_(RH)_023B Jun. 2019 1. INTRODUCTION MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. WTC RH series MLCC are used at high frequencies generally and have a small temperature coefficient of capacitance, typical within the ±30ppm/° C required for X8G classification and have internal electrodes of excellent conductivity. Thus, WTC RH series MLCC will have the feature of low ESR and high Q characteristics. WTC RH series have high reliability characteristic, life test condition: 150 ℃ / 2000hrs / 2xRated Voltage. 4. HOW TO ORDER RH 21 G 100 J 251 C T Series RH =High reliability & Ultra High Q & Low ESR Size 15 =0402 (1005) 18 =0603 (1608) 11 =0505 (1414) 21 =0805 (2012) Dielectric G =X8G Capacitance Two significant digits followed by no. of zeros. And R is in place of decimal point. eg. : 0R5=0.5pF 1R0=1.0pF 100=10x10 =10pF Tolerance A=±0.05pF B =±0.1pF C =±0.25pF F=±1% G =±2% J=±5% Rated voltage Two significant digits followed by no. of zeros. And R is in place of decimal point. eg. : 201 =200 VDC 251 =250 VDC Termination C =Cu/Ni/Sn Packaging T=7” reeled G = 13” reeled 2. FEATURES b. High Q and low ESR performance at high frequency. c. Ultra low capacitance to 0.1pF. d. Ultra high reliability ( 150 ℃ / 2000hrs / 2x Rated Voltage). e. Can offer high precision tolerance to ±0.05pF. f. Quality improvement of telephone calls for low 3. APPLICATIONS a. Telecommunication products & equipments: Mobile phone, WLAN, Base station, Small cell. b. RF module: Power amplifier, VCO. c. Tuners. d. High quality concern wireless device.

Multilayer Ceramic Capacitors Approval Sheet Page 3 of 12 ASC_Microwave_High_ Reliability_(RH)_023B Jun. 2019 5. EXTERNAL DIMENSIONS 6. GENERAL ELECTRICAL DATA Dielectric X8G Size 0402, 0505, 0603, 0805 Capacitance* 0.1pF to 10pF Capacitance tolerance Cap ≤5pF: A (±0.05pF ), B (±0.1pF), C (±0.25pF) 5pF<Cap<10pF: B (±0.1pF), C (±0.25pF) Rated voltage (WVDC) 200V, 250V Q* Q ≥800+20C Insulation resistance at Ur ≥10G Ω or RxC ≥100 Ω-F whichever is smaller. Operating temperature -55 to +150° C Capacitance change ±30ppm/° C Termination Ni/Sn (lead-free termination) * Measured at the conditions of 25° C ambient temperature and 30~70% related humidity. 7. PACKAGING DIMENSION AND QUANTITY Size Thickness (mm)/Symbol Paper tape 7” reel 13” reel 0402 (1005) 0.50±0.05 N 10,000 50,000 0603 (1608) 0.80±0.07 S 4,000 15,000 0805 (2012) 0.85±0.10 T 4,000 15,000 Size Thickness (mm)/Symbol Plastic tape 7” reel 13” reel 0505 (1414) 1.15±0.15 J 3,000 - Unit: pieces T W L MB MB Fig. 1 The outline of MLCC Size Inch (mm) L (mm) W (mm) T (mm)/Symbol Remark M B (mm) 0505 (1414) 1.40 # Reflow soldering only is recommended.

Multilayer Ceramic Capacitors Approval Sheet Page 4 of 12 ASC_Microwave_High_ Reliability_(RH)_023B Jun. 2019 8. CAPACITANCE RANGE DIELECTRIC X8G SIZE 0402 Tolerance RATED VOLTAGE (VDC) 200 Capacitance 0.1pF (0R1) N B 0.2pF (0R2) N A, B 0.3pF (0R3) N A, B 0.4pF (0R4) N A, B 0.5pF (0R5) N A, B, C 0.6pF (0R6) N A, B, C 0.7pF (0R7) N A, B, C 0.8pF (0R8) N A, B, C 0.9pF (0R9) N A, B, C 1.0pF (1R0) N A, B, C 1. 1pF (1R 1) N A, B, C 1. 2pF (1R 2) N A, B, C 1. 3pF (1R 3) N A, B, C 1. 4pF (1R 4) N A, B, C 1.5pF (1R5) N A, B, C 1. 6pF (1R 6) N A, B, C 1. 7pF (1R 7) N A, B, C 1.8 pF (1R8) N A, B, C 1. 9pF (1R 9) N A, B, C 2.0pF ( 2R0) N A, B, C 2.1pF ( 2R 1) N A, B, C 2.2pF ( 2R 2) N A, B, C 2.3pF ( 2R 3) N A, B, C 2.4pF ( 2R 4) N A, B, C 2.5pF ( 2R5) N A, B, C 2.6pF ( 2R 6) N A, B, C 2.7pF ( 2R 7) N A, B, C 2.8pF ( 2R8) N A, B, C 2.9pF ( 2R 9) N A, B, C 3.0pF ( 3R0) N A, B, C 1. The letter in cell is expressed the symbol of product thickness. 2. For more information about products with special capacitance or other data, please contact WTC local representative.

Multilayer Ceramic Capacitors Approval Sheet Page 5 of 12 ASC_Microwave_High_ Reliability_(RH)_023B Jun. 2019 DIELECTRIC X8G SIZE 0505 0603 0805 Tolerance RATED VOLTAGE (VDC) 250 250 250 Capacitance 0.3pF (0R3) S T B 0.4pF (0R4) J S T B 0.5pF (0R5) J S T A, B, C 0.6pF (0R6) J S T A, B, C 0.7pF (0R7) J S T A, B, C 0.8pF (0R8) J S T A, B, C 0.9pF (0R9) J S T A, B, C 1.0pF (1R0) J S T A, B, C 1. 1pF (1R 1) J S T A, B, C 1. 2pF (1R 2) J S T A, B, C 1. 3pF (1R 3) J S T A, B, C 1. 4pF (1R 4) J S T A, B, C 1.5pF (1R5) J S T A, B, C 1. 6pF (1R 6) J S T A, B, C 1. 7pF (1R 7) J S T A, B, C 1.8pF (1R8) J S T A, B , C 1. 9pF (1R 9) J S T A, B, C 2.0pF ( 2R0) J S T A, B, C 2.1pF ( 2R 1) J S T A, B, C 2.2pF ( 2R 2) J S T A, B, C 2.3pF ( 2R 3) J S T A, B, C 2.4pF ( 2R 4) J S T A, B, C 2.5pF ( 2R5) J S T A, B, C 2.6pF ( 2R 6) J S T A, B, C 2.7pF ( 2R 7) J S T A, B, C 2.8pF ( 2R8) J S T A, B, C 2.9pF ( 2R 9) J S T A, B, C 3.0pF ( 3R0) J S T A, B, C 3.1pF ( 3R 1) J S T A, B, C 3.2pF ( 3R 2) J S T A, B, C 3.3pF ( 3R 3) J S T A, B, C 3.4pF ( 3R 4) J S T A, B, C 3.5pF ( 3R5) J S T A, B, C 3.6pF ( 3R 6) J S T A, B, C 3.7pF ( 3R 7) J S T A, B, C 3.8pF ( 3R8) J S T A, B, C 3.9pF ( 3R 9) J S T A, B, C 4.0pF ( 4R0) J S T A, B, C 4.1pF ( 4R 1) J S T A, B, C 4.2pF ( 4R 2) J S T A, B, C 4.3pF ( 4R 3) J S T A, B, C 4.4pF ( 4R 4) J S T A, B, C 4.5pF ( 4R5) J S T A, B, C 4.6pF (4R 6) J S T A, B, C 4.7pF (4R7) J S T A, B, C 4. 8pF (4R8 ) J S T A, B, C 4.9pF (4R9 ) J S T A, B, C 5.0pF (5R0 ) J S T A, B, C 5.1pF (5R1 ) J S T B, C 5.2pF (5R2 ) J S T B, C 5.3pF (5R3 ) J S T B, C 5.4pF (5R4 ) J S T B, C 5.5pF (5R5 ) J S T B, C 5.6pF (5R6 ) J S T B, C 5.7pF (5R7 ) J S T B, C 5.8pF (5R8 ) J S T B, C 5.9pF (5R9 ) J S T B, C 6.0pF (6R0 ) J S T B, C 1. The letter in cell is expressed the symbol of product thickness. 2. For more information about products with special capacitance or other data, please contact WTC local representative.

Multilayer Ceramic Capacitors Approval Sheet Page 6 of 12 ASC_Microwave_High_ Reliability_(RH)_023B Jun. 2019 DIELECTRIC X8G SIZE 0505 0603 0805 Tolerance RATED VOLTAGE (VDC) 250 250 250 Capacitance 6.1pF (6R1 ) J S T B, C 6.2pF (6R2 ) J S T B, C 6.3pF (6R3 ) J S T B, C 6.4pF (6R4 ) J S T B, C 6.5pF (6R5 ) J S T B, C 6.6pF (6R6 ) J S T B, C 6.7pF (6R7 ) J S T B, C 6.8pF (6R8 ) J S T B, C 6.9pF (6R9 ) J S T B, C 7.0pF (7R0 ) J S T B, C 7.1pF (7R1 ) J S T B, C 7.2pF (7R2 ) J S T B, C 7.3pF (7R3 ) J S T B, C 7.4pF (7R4 ) J S T B, C 7.5pF ( 7R5 ) J S T B, C 7.6pF (7R6 ) J S T B, C 7.7pF (7R7 ) J S T B, C 7.8pF (7R8 ) J S T B, C 7.9pF (7R9 ) J S T B, C 8.0pF (8R0 ) J S T B, C 8.1pF (8R1 ) J S T B, C 8.2pF (8R2 ) J S T B, C 8.3pF (8R3 ) J S T B, C 8.4pF (8R4 ) J S T B, C 8.5pF (8R5 ) J S T B, C 8.6pF (8R6 ) J S T B, C 8.7pF (8R7 ) J S T B, C 8.8pF (8R8 ) J S T B, C 8.9pF (8R9 ) J S T B, C 9.0pF (9R0 ) J S T B, C 9.1pF (9R1 ) J S T B, C 9.2pF (9R2 ) J S T B, C 9.3pF (9R3 ) J S T B, C 9.4pF (9R4 ) J S T B, C 9.5pF (9R5 ) J S T B, C 9.6pF (9R6 ) J S T B, C 9.7pF (9R7 ) J S T B, C 9.8pF (9R8 ) J S T B, C 9.9pF (9R9 ) J S T B, C 10pF (100) J S T F, G, J 1. The letter in cell is expressed the symbol of product thickness. 2. For more information about products with special capacitance or other data, please contact WTC local representative.

Multilayer Ceramic Capacitors Approval Sheet Page 7 of 12 ASC_Microwave_High_ Reliability_(RH)_023B Jun. 2019 9. ELECTRICAL CHARACTERISTICS Fig. 4 Q vs. Frequency (0402 size) Fig. 2 ESR vs. Frequency (0402 size) Fig. 6 Impedance vs. Frequency. (0402 size) Fig. 3 ESR vs. Frequency (0603 size) Fig. 5 Q vs. Frequency (0603 size) Fig. 7 Impedance vs. Frequency (0603 size)

Multilayer Ceramic Capacitors Approval Sheet Page 8 of 12 ASC_Microwave_High_ Reliability_(RH)_023B Jun. 2019 Fig. 10 Q vs. Frequency (0805 size) Fig. 8 ESR vs. Frequency (0805 size) Fig. 12 Impedance vs. Frequency. (0805 size) Fig. 9 ESR vs. Frequency (0505 size) Fig. 11 Q vs. Frequency (0505 size) Fig. 13 Impedance vs. Frequency (0505 size)

Multilayer Ceramic Capacitors Approval Sheet Page 9 of 12 ASC_Microwave_High_ Reliability_(RH)_023B Jun. 2019 10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS No. Item Test Conditions Requirements 1. Visual and Mechanical --- * No remarkable defect. * Dimensions to conform to individual specification sheet. 2. Capacitance 1.0±0.2Vrms, 1MHz±10% At 25° C ambient temperature. * Shall not exceed the limits given in the detailed spec. 3. Q/ D.F. (Dissipation Factor) * Q≥800+20C 4. Dielectric Strength * To apply voltage: 200V ~ 250V : 200% of rated voltage. * Duration: 1 to 5 sec. * Charge & discharge current less than 50mA. * No evidence of damage or flash over during test. 5. Insulation Resistance ≤100V : To apply rated voltage for max. 120 sec. ≥10G Ω or RxC ≥100 Ω-F whichever is smaller ≥200V :To apply rated voltage (500V max.) for 60 sec. 6. Temperature Coefficient With no electrical load. Operating temperature: -55~150° C at 25° C * Capacitance change: within ±30ppm/° C; 7. Adhesive Strength of Termination * Pressurizing force ： 0402 to 0603: 5N >0603: 10N * Test time: 10±1 sec. * No remarkable damage or removal of the terminations. 8. Vibration Resistance * Vibration frequency: 10~55 Hz/min. * Total amplitude: 1.5mm * Test time: 6 hrs. (Two hrs each in three mutually perpendicular directions.) * Cap./DF(Q) Measurement to be made after de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change and Q/D.F.: To meet initial spec. Solderability * Solder temperature: 235±5° C * Dipping time: 2±0.5 sec. 95% min. coverage of all metalized area. 10. Bending Test * The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm per second u ntil the deflection becomes 1 mm and then the pressure shall be maintained for 5±1 sec. * Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change: within ±5.0% or ±0.5pF whichever is larger. (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test.) 11. Resistance to Soldering Heat * Solder temperature: 260±5° C * Dipping time: 10±1 sec * Preheating: 120 to 150° C for 1 minute before immerse the capacitor in a eutectic solder. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change: within ±2.5% or ±0.25pF whichever is larger. * 25% max. leaching on each edge.

Multilayer Ceramic Capacitors Approval Sheet Page 10 of 12 ASC_Microwave_High_ Reliability_(RH)_023B Jun. 2019 No. Item Test Condition Requirements 12. Temperature Cycle * Conduct the five cycles according to the temperatures and time. Step Temp. (° C) Time (min.) 1 Min. operating temp. +0/-3 30±3 2 Room temp. 2~3 3 Max. operating temp. +3/-0 30±3 4 Room temp. 2~3 *Before initial measurement (Class II only): To apply de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change ：within ±2.5 ％ or ±0.25pF whichever is larger. 13. Humidity (Damp Heat) Steady State * Test temp.: 40±2° C * Humidity: 90~95% RH * Test time: 500+24/-0hrs. * Cap. / DF(Q) / I.R. Measurement to be made after de- aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change: within ±5.0% or ±0.5pF whichever is larger. * Q/D.F. value: 10pF ≤Cap<30pF, Q ≥275+2.5C Cap<10pF; Q ≥200+10C * I.R.: ≥1G Ω. 14. Humidity (Damp Heat) Load * Test temp.: 40±2° C * Humidity: 90~95%RH * Test time: 500+24/-0 hrs. * To apply voltage ：rated voltage (MAX. 500V) * Cap. / DF(Q) / I.R. Measurement to be made after de- aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change: within ±7.5% or ±0.75pF whichever is larger. * Q/D.F. value: Cap<30pF, Q ≥100+10/3C * I.R.: ≥500M Ω. 15. High Temperature Load (Endurance) * Test temp.: 150±3° C * To apply voltage: 10V ≦Ur<500V : 200% of rated voltage. * Test time: 2000+24/-0 hrs. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150° C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change: within ±3.0% or ±0.3pF whichever is larger. * Q/D.F. value: Cap ≤10pF, Q ≥200+10C * I.R.: ≥1G Ω. 16. ESR The ESR should be measured at room temperature and tested at frequency 1±0.1 GHz. RH15(0402) RH18(0603) 0.1pF ≤Cap ≤1pF:< 330m Ω/pF 0.2pF ≤Cap ≤1pF:< 1400mΩ 1pF<Cap ≤3pF:< 280m Ω 1pF<Cap ≤10pF:< 230m Ω RH21(0805) RH11(0505) 0.3pF ≤Cap ≤1pF: < 1400m Ω 0.4pF ≤Cap<1pF: < 1400m Ω 1pF<Cap ≤10pF: < 230m Ω 1.0pF ≤Cap<10pF: < 230m Ω Cap=10pF: < 200m Ω

Multilayer Ceramic Capacitors Approval Sheet Page 11 of 12 ASC_Microwave_High_ Reliability_(RH)_023B Jun. 2019 APPENDIXES ◙ Tape & reel dimensions ◙ Example of customer label *Customized label is available upon request Fig. 16 The dimension of reel Fig. 14 The dimension of paper tape Size 0402, 0505, 0603, 0805 Reel size 7” 13” a. Customer name b. WTC order series and item number c. Customer P/O d. Customer P/N e. Description of product f. Quantity g. Bar code including quantity & WTC P/N or customer h. WTC P/N i. Shipping date j. Order bar code including series and item numbers k. Serial number of label Size 0402 0505 0603 0805 Thickness N J S T A0 0.70 +/-0.30 1.50 +/-0.20 B 0 1.20 +/-0.30 2.30 +/-0.20 T ≦0.80 0.23 +/-0.1 ≦1.20 ≦1.20 K 0 - < 1.50 - - W 8.00 +/-0.30 8.00 +/-0.30 8.00 +/-0.30 8.00 +/-0.30 P0 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 10xP 0 40.00 +/-0.10 40.00 +/-0.20 40.00 +/-0.20 40.00 +/-0.20 P1 2.00 +/-0.05 4.00 +/-0.10 4.00 +/-0.10 4.00 +/-0.10 P2 2.00 +/-0.05 2.00 +/-0.05 2.00 +/-0.05 2.00 +/-0.05 D 0 1.50 +0.1/-0 1.50 +0.1/-0 1.50 +0.1/-0 1.50 +0.1/-0 D 1 - 1.00 +/-0.10 - - E 1.75 +/-0.10 1.75 +/-0.10 1.75 +/-0.10 1.75 +/-0.10 F 3.50 +/-0.05 3.50 +/-0.05 3.50 +/-0.05 3.50 +/-0.05 Fig. 15 The dimension of plastic tape

Multilayer Ceramic Capacitors Approval Sheet Page 12 of 12 ASC_Microwave_High_ Reliability_(RH)_023B Jun. 2019 ◙ Constructions ◙ Storage and handling conditions (1) To store products at 5 to 40 °C ambient temperature and 20 to 70%. related humidity conditions. (2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension is needed. Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability. Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.) b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low reliability. c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture. ◙ Recommended soldering conditions The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N 2 within oven are recommended. No. Name X8G

1 Ceramic material Hi-Q dielectric ceramic

2 Inner electrode Cu

4 Middle layer Ni

5 Outer layer Sn (Matt)

Fig. 17 The construction of MLCC Fig. 18 Recommended reflow soldering profile for SMT process with SnAgCu series solder paste. Fig. 19 Recommended wave soldering profile for SMT process with SnAgCu series solder.