RFP-375375N6Z50-2 ANAREN | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
- DC – 2.0 GHz
- 30 Watts
- Aluminum Nitride (AlN) Ceramic
- Surface Mountable
- Non-Nichrome Resistive Element
- Low VSWR
- 100% Tested Ω Note: XXX denotes value. Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +125°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. Electrical Specifications Resistance Value: 50 ohms, ±2% Frequency Range: DC - 2.0 GHz Power: 30 Watts General Specifications Resistive Element: Thick film Substrate: Aluminum nitride ceramic Terminals: Tin/Lead, 90/10 over nickel Available on Tape and Reel for Pick and Place Manufacturing. VER. 12/5/01
Aluminum Nitride SMD Terminations Model RFP-375375N6Z50-2 Typical Performance
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Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 Power Derating Suggested Mounting Procedures FILLED VIA SOLDER (2 PLS.) SCREW HEATSINK PASTE SOLDER PC BOARD TAPE DETAIL SCALE: NONE DESPOOLING DIRECTION RFP .390 .320 .070 .600 .280 N4ZXXX 250375 .390 .160 .070 .080 .060 DIA. ORIENTATION DEVICE .010 P.C.B. SOLDER INTERFACE TEMPERATURE — °C % OF RATED POWER 125100755025 100 Available on Tape and Reel for Pick and Place Manufacturing. 1. Solder part in place using 60/40 type solder with controlled temperature iron (700°F). 2. Drill thermal vias through PCB and fill with solder, such as 60/40 type. 3. To ensure good thermal connectivity to heat sink, drill and tap heatsink and mount PCB board to heat sink using screws.