RFP-250250N4AAXX ANAREN | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Model RFP-250250N4AAXX Features:
- Low Cost
- Surface Mount
- Aluminum Nitride Ceramic
- Non-Nichrome Resistive Element
- Low VSWR
- 100% Tested Surface Mount Attenuator
10 Watts
Description
The RFP-250250N4AAXX is high performance Aluminum Nitride (AlN) surface mount attenuator intended as a lower cost alternative to Beryllium Oxide (BeO). The attenuator is well suited to all cellular frequency bands such as; AMPS, GSM, DCS, PCS, PHS and UMTS. The high power handling makes the part ideal for inter-stage matching, directional couplers, and for use in isolators. General Specifications Resistive Element Thick film Substrate Aluminum Nitride Ceramic Terminal Finish Matte Tin over Sulfamate Nickel Operating Temperature -55 to +125°C (see chart) Tolerance is ±0.010”, unless otherwise specified. Designed to meet of exceed applicable portions of MIL-E-5400. All dimensions in inches. Electrical Specifications Attenuation Value: 1 – 6, 9, 10dB Power: 10 Watts Frequency Range: DC – 2.0 GHz Specification based on unit properly installed using suggested mounting instructions and a 50 ohm nominal impedance. Specifications subject to change. Outline Drawing Dimensions given in inches. Rev. 3/3/06
USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 544-2414 +44 2392-232392 Available on Tape and Reel For Pick and Place Manufacturing. Model RFP-250250N4AAXX Specifications: PART NUMBER ATTENUATION(dB) TOL. (±dB) POWER (WATTS) VSWR FREQ (GHZ) RFP-250250N4AA1 1 0.2 10 1.25:1 2.0 RFP-250250N4AA2 2 0.3 10 1.25:1 2.0 RFP-250250N4AA3 3 0.3 10 1.25:1 2.0 RFP-250250N4AA4 4 0.3 10 1.25:1 2.0 RFP-250250N4AA5 5 0.3 10 1.25:1 2.0 RFP-250250N4AA6 6 0.4 10 1.25:1 2.0 RFP-250250N4AA9 9 0.6 10 1.25:1 2.0 RFP-250250N4AA10 10 0.7 10 1.25:1 2.0 Power De-rating: Tape & Reel: Mounting Footprint and Procedure: