RFP-250250-4X50-2 ANAREN | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
- DC - 2.0 GHz
- 40 Watts
- BeO Ceramic
- Non-Nichrome Resistive Element
- Low VSWR
- 100% Tested Ω 1Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 Available on Tape and Reel for Pick and Place Manufacturing. Note: XX denotes value VER. 12/5/01
P.C.B. SOLDER INTERFACE TEMPERATURE — °C % OF RATED POWER 125100755025 100 150 Chip Terminations Model RFP-250250-4X50-2 Typical Performance
2 Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 Power Derating Suggested Mounting Procedures BOARD EVEN WITH LEAD. MIN. (2 PLACES) .025 THAN LEAD. BOARD LOWER SCALE: SUGGESTED STRESS RELIEF METHODS 1. Make sure that the devices are mounted on flat surfaces (.001” under the device) to optimize the heat transfer. 2. Position device on mounting surface and solder in place using an indalloy type or a 60/40 type solder. 3. Solder leads in place using a 60/40 type solder with a controlled temperature iron (700°F). THAN LEAD. BOARD HIGHER SCALE: NOT RECOMMENDED APPLICATION BOARD LOWER THAN LEAD. Available on Tape and Reel for Pick and Place Manufacturing.