RFP-100-100RW ANAREN | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
- DC - 3.0 GHz
- 100 Watts
- BeO Ceramic
- W elded Silver Leads
- Non-Nichrome Resistive Element
- 100% Tested Ω 1Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +150°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Lead length 0.15” minimum. Specifications subject to change without notice. Electrical Specifications Resistance Value: 100 ohms, ±5% Frequency Range: DC - 3.0 GHz Power: 100 Watts Capacitance: 1.5 pF VER. 12/5/01
2 Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 Power Derating Suggested Mounting Procedures MIN..025 (2 PLACES) SUGGESTED STRESS RELIEF METHODS BOARD LOWER THAN LEAD. WITH LEAD. BOARD EVEN SCALE: 1. Make sure that the devices are mounted on flat surfaces (.001” under the device) to optimize the heat transfer. 2. Drill & tap the heatsink for the appropriate thread size to be used. 3. Coat heatsink with a minimum amount of high quality silicone grease (.001” max. thickness). 4. Position device on mounting surface and secure using socket head screws, flat & split washers. Torque screws to the appropriate value. Make sure that the device is flat against the heatsink. (Care should be taken to avoid upward pressure of the leads towards the lid). 5. Solder leads in place using an SN63 type solder with a controlled temperature iron (210°C). SCALE: BOARD HIGHER THAN LEAD.THAN LEAD. BOARD LOWER NOT RECOMMENDED APPLICATION CASE TEMPERATURE — °C % OF RATED POWER 150125100755025 100