RFLPF2012110A1T WALSIN | Alldatasheet
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Technical content
Page 1 of 7 ASC_RFLPF2012110A1T_V01 Jul.2010 RFLPF 2012(0805) Series –RoHS Compliance MULTILAYER CERAMIC LOW PASS FILTER
2.4 GHz ISM Band Working Frequency
*Contents in this sheet are subject to change without prior notice.
Page 2 of 7 ASC_RFLPF2012110A1T_V01 Jul.2010
FEATURES
- Multilayer LTCC ( Low Temperature Cofired Ceramics ) Technology 2. Reflow solderable 3. Miniatured Size 2.00 x 1.25 x 1.05 mm 4. Low Insertion Loss (Typical –0.3dB@2.4GHz) 5. High attenuation on 2nd and 3rd harmonic suppressed 6. Suitable for 2.45 GHz Working Frequency Operation
APPLICATIONS
- 2.4GHz ISM Band RF Application 2. Bluetooth, Wireless LAN, HomeRF CONSTRUCTION Fig 1. Outline of 2.4GHz Low Pass Filter
DESCRIPTION
Walsin Technology Corporation develops a new ceramic Low Pass Filter specified for 2.4 GHz ISM Band application, as shown in fig-1. Both of Wireless LAN IEEE 802.11b, and Bluetooth TM typically located on this unlicensed frequency band which range covers from 2.4GHz to 2.4835GHz. To fulfil the in-band and out-band frequency requirements, this Low Pass Filter has been designed to a high suppression on 2nd and 3 rd harmonic as well as low insertion loss characteristics through Walsin’s advanced LTCC (Low Temperature Co-fired Ceramic) technology and superior product design via 3D EM Simulation Skill. This Low Pass Filter has a rectangular ceramic body with a tiny dimension of 2.00 x 1.25 x 1.05 mm 3 future meet the SMT automation and miniaturization requirements on modern portable devices. DIMENSIONS Figure Symbol Dimension L 2.00 ± 0.15 mm W 1.25 ± 0.10 mm T 1.05 ± 0.10 mm A 0.30 ± 0.10 mm B 0.30 ± 0.10 mm C 0.30 ± 0.10 mm D 0.25 ± 0.15 mm E 0.30 ± 0.10 mm F 0.20 ± 0.10 mm G 0.25 ± 0.15 mm P 0.65 ± 0.10 mm PIN Definition PIN Definition P1 Input / output P5 Input / output P2 Ground P6 Ground P3 Ground P7 Ground t P4 Ground P8 Ground P1 P2
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ELECTRICAL CHARACTERISTICS
RFLPF2012110A1T Specification Frequency range (MHz) 2450 ± 50 MHz Insertion Loss (dB) 0.8 VSWR 1.5 Attenuation (dB min.) 40dB@4800MHz/ 7200MHz Operation Temperature -40 ℃ ~ +85 ℃ Typical Electrical Chart SOLDER LAND PATTERN Line width to be design to match 50 Ω characteristic impedance, depending on PCB material and thickness Unit in mil
Page 4 of 7 ASC_RFLPF2012110A1T_V01 Jul.2010 RELIABILITY TEST Test item Test condition / Test method Specification Solderability JIS C 0050-4.6 JESD22-B102D *Solder bath temperature ：235 ± 5 °C *Immersion time ：2 ± 0.5 sec *Solder ：Sn3Ag0.5Cu for lead-free At least 95% of a surface of each terminal electrode must be covered by fresh solder. Leaching (Resistance to dissolution of metallization) IEC 60068-2-58 *Solder bath temperature ：260 ± 5 °C *Leaching immersion time ：30 ± 0.5 sec *Solder : SN63A Loss of metallization on the edges of each electrode shall not exceed 25%. Resistance to soldering heat JIS C 0050-5.4 *Preheating temperature ：120~150 ,℃ 1 minute. *Solder temperature ：270 ±5°C *Immersion time ：10 ±1 sec *Solder ：Sn3Ag0.5Cu for lead-free Measurement to be made after keeping at room temperature for 24 ±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. Loss of metallization on the edges of each electrode shall not exceed 25%. Drop Test JIS C 0044 *Height ：75 cm *Test Surface ：Rigid surface of concrete or steel. *Times ：6 surfaces for each units ；2 times for each side. No mechanical damage. Samples shall satisfy electrical specification after test. Adhesive Strength of Termination JIS C 0051- 7.4.3 *Pressurizing force ： *Test time ：10±1 sec No remarkable damage or removal of the termination. Bending test JIS C 0051- 7.4.1 The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm/s per second until the deflection becomes 1mm/s and then pressure shall be maintained for 5 ±1 sec. Measurement to be made after keeping at room temperature for 24 ±2 hours No mechanical damage. Samples shall satisfy electrical specification after test.
Page 5 of 7 ASC_RFLPF2012110A1T_V01 Jul.2010 Temperature cycle JIS C 0025 1. 30 ±3 minutes at -40 °C ±3°C, 2. 10~15 minutes at room temperature, 3. 30 ±3 minutes at +85 °C ±3°C, 4. 10~15 minutes at room temperature, Total 100 continuous cycles Measurement to be made after keeping at room temperature for 24 ±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. Vibration JIS C 0040 *Frequency ：10Hz~55Hz~10Hz(1min) *Total amplitude：1.5mm *Test times ：6hrs.(Two hrs each in three mutually perpendicular directions) No mechanical damage. Samples shall satisfy electrical specification after test. High temperature JIS C 0021 *Temperature ：85 °C ±2°C *Test duration ：1000+24/-0 hours Measurement to be made after keeping at room temperature for 24 ±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. Humidity (steady conditions) JIS C 0022 *Humidity ：90% to 95% R.H. *Temperature ：40 ±2°C *Time ：1000+24/-0 hrs. Measurement to be made after keeping at room temperature for 24 ±2 hrs ※ 500hrs measuring the first data then 1000hrs data No mechanical damage. Samples shall satisfy electrical specification after test. Low temperature JIS C 0020 *Temperature ：-40 °C ±2°C *Test duration ：1000+24/-0 hours Measurement to be made after keeping at room temperature for 24 ±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test.
Page 6 of 7 ASC_RFLPF2012110A1T_V01 Jul.2010 SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2, Fig 2. Infrared soldering profile ORDERING CODE RF LPF 201211 0 A 1 T Walsin RF device Product Code LPF : Low Pass Filter Dimension code Per 2 digits of Length, Width, Thickness : e.g. : 201211 = Length 20, Width 12, Thickness 11 Unit of dimension 0 : 0.1 mm 1 : 1.0 mm Application A : 2.4GHZ ISM Band Specification Design Code Packing T: Reeled Minimum Ordering Quantity: 2000 pcs per reel. PACKAGING P0P2P1 T WF E Φ D P0P2P1 T WF E Φ D Plastic Tape specifications (unit :mm) Index Ao Bo Φ D T W Index E F Po P1 P2
Page 7 of 7 ASC_RFLPF2012110A1T_V01 Jul.2010 Reel dimensions Taping Quantity: 2000 pieces per 7” reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Medical equipment (5) Disaster prevention / crime prevention equipment (6) Traffic signal equipment (7) Transportation equipment (vehicles, trains, ships, etc.) (8) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be confirmed. (2) Storage environment condition. /square6 Products should be storage in the warehouse on the following conditions. /square6 Temperature : -10 to +40 °C /square6 Humidity : 30 to 70% relative humidity /square6 Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. /square6 Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. /square6 Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. /square6 Products should be storage under the airtight packaged condition. Index A B C 7” Reel Dimension (mm) Φ 178 Φ 60.0 Φ 13.5