RFLPF1005040A17B1U WALSIN | Alldatasheet
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Technical content
Page 1 of 7 ASC_RFLPF1005040A17B1U_V02 Apr. 2012 MULTILAYER CERAMIC LOW PASS FILTER RFLPF Series – 1005(0402)- RoHS Compliance Halogens Free Product
2.4 GHz ISM Band Working Frequency
P/N: RFLPF1005040A17B1U *Contents in this sheet are subject to change without prior notice.
Page 2 of 7 ASC_RFLPF1005040A17B1U_V02 Apr. 2012
FEATURES
- Miniature footprint: 1.0 X 0.5 X 0.4 mm 3 2. Low Profile Thickness 3. High Rejection Rate 4. High Attenuation on harmonic Suppressed 5. LTCC process
APPLICATIONS
- 2.4GHz ISM band RF applications 2. Bluetooth, Wireless LAN 802.11b/g/n, HomeRF CONSTRUCTION DIMENSIONS Figure Symbol Dimension (mm) L 1.00 ± 0.10 W 0.50 ± 0.10 T 0.40 ± 0.10 A 0.35 ± 0.10 B 0.30 ± 0.10 C 0.15 ± 0.10 D 0.15 ± 0.10 E 0.30 ± 0.10 PIN Connection
1 Input port
2 GND
3 Output port
4 GND
Page 3 of 7 ASC_RFLPF1005040A17B1U_V02 Apr. 2012
ELECTRICAL CHARACTERISTICS
RFLPF1005040A17B1U Specification Frequency range 2450± 50 MHz Insertion Loss 0.75 dB max VSWR 2.0 max Impedance 50 Ω Attenuation (min.) 33@ 4800~ 5000MHz 37@ 7200~ 7500MHz Operation Temperature Range -40 °C ~ +85 °C Typical Electrical Chart SOLDER LAND PATTERN Figure Unit : mm Line width to be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness. 2 3 4 5 6 71 8 -50 -40 -30 -20 -10 -60 dB(S(1,1)) dB(S(2,1))
Page 4 of 7 ASC_RFLPF1005040A17B1U_V02 Apr. 2012 RELIABILITY TEST Test item Test condition / Test method Specification Solderability JIS C 0050-4.6 JESD22-B102D *Solder bath temperature ：235 ± 5 °C *Immersion time ：2 ± 0.5 sec Solder ：Sn3Ag0.5Cu for lead-free At least 95% of a surface of each terminal electrode must be covered by fresh solder. Leaching (Resistance to dissolution of metallization) IEC 60068-2-58 *Solder bath temperature ：260 ± 5 °C *Leaching immersion time ：30 ± 0.5 sec Solder : SN63A Loss of metallization on the edges of each electrode shall not exceed 25%. Resistance to soldering heat JIS C 0050-5.4 *Preheating temperature ：120~150 ,℃ 1 minute. *Solder temperature ：270 ±5°C *Immersion time ：10 ±1 sec Solder ：Sn3Ag0.5Cu for lead-free Measurement to be made after keeping at room temperature for 24 ±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. Loss of metallization on the edges of each electrode shall not exceed 25%. Drop Test JIS C 0044 Customer’s specification. *Height ：75 cm *Test Surface ：Rigid surface of concrete or steel. *Times ：6 surfaces for each units ；2 times for each side. No mechanical damage. Samples shall satisfy electrical specification after test. Adhesive Strength of Termination JIS C 0051- 7.4.3 *Pressurizing force ： *Test time ：10±1 sec No remarkable damage or removal of the termination. Bending test JIS C 0051- 7.4.1 The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm/s per second until the deflection becomes 1mm/s and then pressure shall be maintained for 5 ±1 sec. Measurement to be made after keeping at room temperature for 24 ±2 hours No mechanical damage. Samples shall satisfy electrical specification after test.
Page 5 of 7 ASC_RFLPF1005040A17B1U_V02 Apr. 2012 Temperature cycle JIS C 0025 1. 30 ±3 minutes at -40 °C ±3°C, 2. 10~15 minutes at room temperature, 3. 30 ±3 minutes at +85 °C ±3°C, 4. 10~15 minutes at room temperature, Total 100 continuous cycles Measurement to be made after keeping at room temperature for 24 ±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. Vibration JIS C 0040 *Frequency ：10Hz~55Hz~10Hz(1min) *Total amplitude ：1.5mm *Test times ：6hrs.(Two hrs each in three mutually perpendicular directions) No mechanical damage. Samples sh all satisfy electrical specification after test. High temperature JIS C 0021 *Temperature ：85 °C ±2°C *Test duration ：1000+24/-0 hours Measurement to be made after keeping at room temperature for 24 ±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test. Humidity (steady conditions) JIS C 0022 *Humidity ：90% to 95% R.H. *Temperature ：40 ±2°C *Time ：1000+24/-0 hrs. Measurement to be made after keeping at room temperature for 24 ±2 hrs ※ 500hrs measuring the first data then 1000hrs data No mechanical damage. Samples shall satisfy electrical specification after test. Low temperature JIS C 0020 *Temperature ：-40 °C ±2°C *Test duration ：1000+24/-0 hours Measurement to be made after keeping at room temperature for 24 ±2 hrs No mechanical damage. Samples shall satisfy electrical specification after test.
Page 6 of 7 ASC_RFLPF1005040A17B1U_V02 Apr. 2012 SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2, Fig 2. Infrared soldering profile ORDERING CODE RF LPF 100504 0 A 17B1U Walsin RF device Product Code LPF : Low Pass Filter Dimension code Per 2 digits of Length, Width, Thickness : e.g. : 100504 = Length 10, Width 5, Thickness 4 Unit of dimension 0 : 0.1 mm 1 : 1.0 mm Application A : 2.4GHZ ISM Band Specification Design code Minimum Ordering Quantity: 4000 pcs per reel. PACKAGING Paper Tape specifications (unit :mm) Index Ao Bo Φ D T W Index E F Po P1 P2
Page 7 of 7 ASC_RFLPF1005040A17B1U_V02 Apr. 2012 Reel dimensions A B C Taping Quantity: 4000 pieces per 7” reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Medical equipment (5) Disaster prevention / crime prevention equipment (6) Traffic signal equipment (7) Transportation equipment (vehicles, trains, ships, etc.) (8) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be confirmed. (2) Storage environment condition. Products should be storage in the warehouse on the following conditions. Temperature : -10 to +40 ℃ Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. Index A B C Dimension (mm) Φ178.0 Φ60.0 Φ13.0