REG71050 TI | Alldatasheet
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Technical content
Load□Current□(mA) Efficiency□(%) 1 10 1000.1 V =□VIN OUT V =□2.7VIN V =□4.2VIN V =□3.6VIN V =□3.3VIN V =□3VIN VIN Enable VOUT GND REG710CIN 2.2/c109F COUT 2.2/c109F CPUMP 0.22/c109F 4 63 5 1 Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community Reference Design REG71050,REG71055,REG710 SBAS221H –DECEMBER 2001–REVISED OCTOBER 2015 REG710xxBuck-BoostChargePumpwithupto60-mAOutputCurrent
1 Features 3 Description
The REG710 family of devices are switched capacitor 1• Wide Input Voltage Range: 1.8 V to 5.5 V voltage converters that generate regulated, low-ripple• Automatic Step-Up and Step-Down Operation output voltage from an unregulated input voltage. A
- Low Input Current Ripple wide input supply voltage from 1.8 V to 5.5 V makes the REG710 family of devices ideal for a variety of• Low Output Voltage Ripple battery sources, such as single-cell Li-Ion, or 2-cell• Minimum Number of External Components— No and 3-cell nickel-based or alkaline-based chemistries.Inductors The input voltage may vary above and below the• 1-MHz Internal Oscillator Allows Small Capacitors output voltage and the output remains in regulation.• Shutdown Mode The device works as step-up or step-down converters
- Thermal and Current Limit Protection without the need of an inductor, providing low EMI DC-DC conversion. The high switching frequency• Six Fixed Output Voltages Available: device is thermally protected and current limited,2 Applications protecting the load and the regulator during fault conditions. Typical ground pin current (quiescent• White LED Driver current) is 65 μA with no load, and less than 1 μA in• Smart Card Readers shutdown mode.• SIM Cards
- Handheld devices Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM)• Modems REG710 SOT-23 (6) 2.90 mm × 1.60 mm• PCMCIA Cards SOT (6) 2.90 mm × 1.60 mm• LCD Displays REG71050 SON (6) 2.00 mm × 2.00 mm• Battery Backup Supplies REG71055 SOT-23 (6) 2.90 mm × 1.60 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. spacing Typical Operating Circuit Efficiency vs Load Current An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
REG71050,REG71055,REG710 SBAS221H –DECEMBER 2001–REVISED OCTOBER 2015 www.ti.com Table of Contents
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (January 2009) to Revision H Page
- Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
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Product Folder Links: REG71050 REG71055 REG710
REG71050,REG71055,REG710 www.ti.com SBAS221H –DECEMBER 2001–REVISED OCTOBER 2015
5 Device Comparison Table
ORDER NUMBER OUTPUT VOLTAGE REG71055 5.5 V REG710NA-5 5 V REG71050 REG710NA-3.3 3.3 V REG710NA-3 3 V REG710NA-2.7 2.7 V REG710NA-2.5 2.5 V
6 Pin Configuration and Functions
DDC and DBV Package DRV Package 6-Pin SOT and SOT-23 6-Pin SON With Exposed Thermal Pad Top View Top View Pin Functions PIN I/O DESCRIPTION NAME DDC/DBV DRV Cpump- 4 3 – Connect to the flying capacitor Cpump+ 6 1 – Connect to the flying capacitor Enable 3 5 I Hardware Enable/Disable pin (high=enable) GND 2 4 – Ground Vin 5 2 I Input supply pin. Connect the input capacitor to this pin. Vout 1 6 O Output supply. Connect the output capacitor to this pin.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Supply voltage –0.3 6 Enable Enable input –0.3 VIN V Output short-circuit duration Indefinite TA Operating ambient temperature –55 125 TJ Operating ambient temperature –55 150 °C Tstg Storage temperature –55 150 Copyright © 2001–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: REG71050 REG71055 REG710
REG71050,REG71055,REG710 SBAS221H –DECEMBER 2001–REVISED OCTOBER 2015 www.ti.com
7.2 ESD Ratings
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge VCharged device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT INPUT VOLTAGE REG71055 3 5.5 V Tested Startup(1) REG710-5 2.7 5.5 V All other models 1.8 5.5 V TA Operating ambient temperature range –40 85 °C (1) See conditions under Output Voltage with a resistive load no lower than typical VOUT/IOUT in Electrical Characteristics.
7.4 Thermal Information
THERMAL METRIC(1) DRV DDC DBV UNIT
6 PINS 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 119.1 204.6 184.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 110.5 50.5 124.6 °C/W RθJB Junction-to-board thermal resistance 88.7 54.3 30.6 °C/W ψJT Junction-to-top characterization parameter 7.7 0.8 22.1 °C/W ψJB Junction-to-board characterization parameter 89 52.8 30.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 61.8 n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics
TA = -40ºC to 85ºC, typical values are at TA = 25°C (unless otherwise noted), VIN = (VOUT / 2 + 0.75 V), IOUT = 10 mA, CIN = COUT = 2.2 μF, CPUMP = 0.22 μF, and VENABLE = 1.3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY VIN Input voltage range. Tested Startup. See conditions under Output VoltageREG71055 3 5.5 with a resistive load no lower than REG710-5 2.7 5.5 Vtypical VOUT/IOUT. All other models 1.8 5.5 IQ Operating quiescent current IOUT = 0 mA, TA = 25°C 65 100 μA VIN = 1.8 V to 5.5 V, Enable = 0 V, TAISD Shutdown current 0.01 1 μA= 25°C CONTROL SIGNALS (ENABLE) Logic high input voltage VIN = 1.8 V to 5.5 V 1.3 VIN V Logic low input voltage VIN = 1.8 V to 5.5 V –0.2 0.4 V Logic high input current VIN = 1.8 V to 5.5 V, TA = 25°C 100 nA Logic low input current VIN = 1.8 V to 5.5 V, TA = 25°C 100 nA OSCILLATOR FREQUENCY(1) 1 MHz (1) The converter regulates by enabling and disabling periods of switching cycles. The switching frequency is the oscillator frequency during an active period.
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Product Folder Links: REG71050 REG71055 REG710
REG71050,REG71055,REG710 www.ti.com SBAS221H –DECEMBER 2001–REVISED OCTOBER 2015 Electrical Characteristics (continued) TA = -40ºC to 85ºC, typical values are at TA = 25°C (unless otherwise noted), VIN = (VOUT / 2 + 0.75 V), IOUT = 10 mA, CIN = COUT = 2.2 μF, CPUMP = 0.22 μF, and VENABLE = 1.3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OUTPUT IOUT ≤ 10 mA, 3 V ≤ VIN ≤ 5.5 V 5.2 5.5 5.8 V REG71055 IOUT ≤ 10 mA, 2.7 V ≤ VIN ≤ 5.5 V 4.7 5 5.3 V REG710-5, REG71050 IOUT ≤ 30 mA, 3 V ≤ VIN ≤ 5.5 V 4.7 5 5.3 V IOUT ≤ 60 mA, 3.3 V ≤ VIN ≤ 4.2 V 4.6 5 5.4 V REG710-3.3 IOUT ≤ 10 mA, 1.8 V ≤ VIN ≤ 5.5 V 2.82 3 3.18 V REG710-3 IOUT ≤ 30 mA, 2.2 V ≤ VIN ≤ 5.5 V 2.82 3 3.18 V REG710-2.7 IOUT ≤ 30 mA, 2 V ≤ VIN ≤ 5.5 V 2.54 2.7 2.86 V REG710-2.5 IOUT ≤ 30 mA, 2 V ≤ VIN ≤ 5.5 V 2.35 2.5 2.65 V Iout Nominal output current TA = 25°C 30 mA Isc Short circuit output current TA = 25°C 100 mA RIPPLE VOLTAGE (2) IOUT = 30 mA, TA = 25°C 35 mVPP IOUT = 10 mA, VIN = 1.8 V, REG710-EFFICIENCY(3) 90%3.3, TA = 25°C THERMAL SHUTDOWN Shutdown temperature 160 °C Shutdown recovery 140 °C (2) Effective series resistance (ESR) of capacitors is < 0.1 Ω. (3) See efficiency curves for other VIN/VOUT configurations. Copyright © 2001–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: REG71050 REG71055 REG710
7.6 Typical Characteristics
Figure 1. Supply Current vs Temperature Figure 2. Supply Current vs Temperature Figure 4. Output Voltage Drift HistogramFigure 3. Output Voltage vs Temperature
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8 Detailed Description
8.1 Overview
device operates as a variable frequency switched-mode regulator. This operation is shown in Figure 5. of operation, as shown in Figure 6. shown in Figure 6 (A), and CPUMP charges to VIN. CPUMP is added to VIN. The output voltage is regulated by skipping clock cycles as necessary. Figure 5. Simplified Schematic of the REG710 Operating in the Step-Down Mode Figure 6. Simplified Schematic of the REG710 Operating in the Step-Up or Boost Mode
1 VOUT
2 GND
2.2 F/c109
0.22 F/c109
REG71050,REG71055,REG710 SBAS221H –DECEMBER 2001–REVISED OCTOBER 2015 www.ti.com
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Shutdown Mode
The EN pin enables the IC when pulled high and places it into energy-saving shutdown mode when pulled low. When in shutdown mode, the output is disconnected from the input and the quiescent current is reduced to 0.01 μA typical. This shutdown mode functionality is only valid when VIN is above the minimum recommended operating voltage. The EN pin cannot be left floating and must be actively terminated either high or low.
8.3.2 Protection
The regulator includes thermal shutdown circuitry protecting the device from damage caused by overload conditions. The thermal protection circuitry disables the output when the junction temperature reaches approximately 160°C, allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is automatically reenabled. Continuously operating the regulator into thermal shutdown can degrade reliability. The regulator also provides current limit to protect itself and the load.
8.4 Device Functional Modes
8.4.1 Peak Current Reduction
In normal operation, the charging of the pump and the output capacitors usually leads to relatively high peak input currents which can be much higher than the average load current. The regulator incorporates circuitry to limit the input peak current, lowering the total EMI emission and lowering the output voltage ripple and the input current ripple. The Input capacitor (CIN) supplies most of the charge required by the input current peaks.
8.4.2 Efficiency
The efficiency of the charge pump regulator varies with the output voltage version, the applied input voltage, the load current, and the internal operation mode of the device. The approximate efficiency is given by:
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Product Folder Links: REG71050 REG71055 REG710
Table 1. Operating Mode Change versus VIN Table 1 lists the approximate values of the input voltage at which the device changes internal operating mode. See efficiency curves in Typical Characteristics for various loads and input voltages.
9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
power supply design. Application curves are included for the typical application shown below.
9.2 Typical Applications
Figure 7. Typical Operating Circuit
9.2.1 Design Requirements
The REG710 family of switched capacitor voltage converters offers a variety of regulated fixed output voltages.
9.2.2 Detailed Design Procedure
9.2.2.1 Capacitor Selection
respectively) should also be surface-mount ceramic types. In all cases, X7R or X5R dielectric are recommended. See the typical operating circuit shown in Figure 7 for component values. output capacitor, COUT, to 10 μF or larger.
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Table 2. Suggested Capacitors
9.2.3 Application Curves
Figure 8. Efficiency vs VIN Figure 9. Efficiency vs Load Current Figure 10. Efficiency vs Load Current Figure 11. Efficiency vs Load Current
Figure 12. Efficiency vs Load Current Figure 13. Efficiency vs Load Current Figure 14. Load Transient Response Figure 15. Line Transient Response Figure 16. Output Ripple Voltage Figure 17. Output Ripple Voltage vs VIN
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9.3 System Examples
The REG710 family of charge pumps can be cascaded to reach higher output voltages, as shown in Figure 21. Figure 21. REG710 Circuit for Step-Up Operation From 1.8 V to 5 V With 10-mA Output Current or 3.3 V to 5 V. Connect both Enable pins together.
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4.7 F/c109
9.3.2 Doubling the Output Current
Figure 22. REG710 Circuit for Doubling the Output Current When higher output currents are required, the REG710 family can be paralleled to double the output current. account (see Electrical Characteristics).
9.3.3 Driving LEDs
Figure 23. REG710 Circuit for Driving LEDs required output voltage. In this application, the charge pump can drive multiple LEDs up to 60 mA in total.
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10 Power Supply Recommendations
output current of the REG710.
11 Layout
11.1 Layout Guidelines
the capacitors as close as possible to the regulator using short, direct circuit traces. output capacitors have been kept as short as possible.
11.2 Layout Example
Figure 24. Suggested PCB Design for Minimum Ripple
12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Related Links
resources, tools and software, and quick access to sample or buy. Table 3. Related Links
12.3 Community Resources
solve problems with fellow engineers. contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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www.ti.com 7-Oct-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) REG71050DDCR Active Production SOT-23- THIN (DDC) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 GAAI REG71050DDCR.B Active Production SOT-23- THIN (DDC) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 GAAI REG71050DDCT Active Production SOT-23- THIN (DDC) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 GAAI REG71050DDCT.B Active Production SOT-23- THIN (DDC) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 GAAI REG71050DDCTG4 Active Production SOT-23- THIN (DDC) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 GAAI REG71050DDCTG4.B Active Production SOT-23- THIN (DDC) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 GAAI REG71050DRVR Active Production WSON (DRV) | 6 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 CFF REG71050DRVR.B Active Production WSON (DRV) | 6 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 CFF REG71050DRVT Active Production WSON (DRV) | 6 250 | SMALL T&R Yes Call TI | Nipdau Level-2-260C-1 YEAR -40 to 85 CFF REG71050DRVT.B Active Production WSON (DRV) | 6 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 CFF REG71050DRVTG4 Active Production WSON (DRV) | 6 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 CFF REG71050DRVTG4.B Active Production WSON (DRV) | 6 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -40 to 85 CFF REG71055DDCR Active Production SOT-23- THIN (DDC) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10H REG71055DDCR.B Active Production SOT-23- THIN (DDC) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10H REG71055DDCRG4 Active Production SOT-23- THIN (DDC) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10H REG71055DDCRG4.B Active Production SOT-23- THIN (DDC) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10H REG71055DDCT Active Production SOT-23- THIN (DDC) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10H REG71055DDCT.B Active Production SOT-23- THIN (DDC) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10H REG710NA-2.5/250 Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10G REG710NA-2.5/250.B Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10G Addendum-Page 1
www.ti.com 7-Oct-2025 Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) REG710NA-2.7/250 Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10F REG710NA-2.7/250.B Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10F REG710NA-3.3/250 Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10C REG710NA-3.3/250.B Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10C REG710NA-3.3/3K Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10C REG710NA-3.3/3K.B Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10C REG710NA-3/250 Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10D REG710NA-3/250.B Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10D REG710NA-3/3K Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10D REG710NA-3/3K.B Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10D REG710NA-5/250 Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10B REG710NA-5/250.B Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10B REG710NA-5/3K Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10B REG710NA-5/3K.B Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10B REG710NA-5/3KG4 Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10B REG710NA-5/3KG4.B Active Production SOT-23 (DBV) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10B REG710NA3.3/250G4 Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10C REG710NA3.3/250G4.B Active Production SOT-23 (DBV) | 6 250 | SMALL T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 R10C (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. Addendum-Page 2
www.ti.com 7-Oct-2025 (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF REG71055 :
- Automotive : REG71055-Q1 NOTE: Qualified Version Definitions:
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 3
PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant REG71050DDCR SOT-23- THIN REG71050DDCT SOT-23- THIN REG71050DDCTG4 SOT-23- THIN REG71055DDCR SOT-23- THIN REG71055DDCRG4 SOT-23- THIN REG71055DDCT SOT-23- THIN Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2025 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REG71050DDCR SOT-23-THIN DDC 6 3000 200.0 183.0 25.0 REG71050DDCT SOT-23-THIN DDC 6 250 200.0 183.0 25.0 REG71050DDCTG4 SOT-23-THIN DDC 6 250 200.0 183.0 25.0 REG71050DRVR WSON DRV 6 3000 213.0 191.0 35.0 REG71050DRVT WSON DRV 6 250 213.0 191.0 35.0 REG71050DRVTG4 WSON DRV 6 250 213.0 191.0 35.0 REG71055DDCR SOT-23-THIN DDC 6 3000 200.0 183.0 25.0 REG71055DDCRG4 SOT-23-THIN DDC 6 3000 200.0 183.0 25.0 REG71055DDCT SOT-23-THIN DDC 6 250 200.0 183.0 25.0 REG710NA-2.5/250 SOT-23 DBV 6 250 200.0 183.0 25.0 REG710NA-2.7/250 SOT-23 DBV 6 250 200.0 183.0 25.0 REG710NA-3.3/250 SOT-23 DBV 6 250 180.0 180.0 18.0 REG710NA-3.3/3K SOT-23 DBV 6 3000 200.0 183.0 25.0 REG710NA-3.3/3K SOT-23 DBV 6 3000 180.0 180.0 18.0 REG710NA-3/250 SOT-23 DBV 6 250 200.0 183.0 25.0 REG710NA-3/250 SOT-23 DBV 6 250 180.0 180.0 18.0 REG710NA-3/3K SOT-23 DBV 6 3000 180.0 180.0 18.0 REG710NA-5/250 SOT-23 DBV 6 250 180.0 180.0 18.0 Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2025 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REG710NA-5/3K SOT-23 DBV 6 3000 180.0 180.0 18.0 REG710NA-5/3KG4 SOT-23 DBV 6 3000 180.0 180.0 18.0 REG710NA3.3/250G4 SOT-23 DBV 6 250 180.0 180.0 18.0 Pack Materials-Page 4
www.ti.com PACKAGE OUTLINE C 0.22
0.08 TYP
0.25 3.0 2.6 2X 0.95 1.45 0.90 0.15
0.00 TYP
6X 0.50 0.25 0.6
0.3 TYP
0 TYP
1.9 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 (1.1) SOT-23 - 1.45 mm max heightDBV0006A SMALL OUTLINE TRANSISTOR 4214840/G 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side. 4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation. 5. Refernce JEDEC MO-178.
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
6X (1.1) 6X (0.6) (2.6) 2X (0.95) (R0.05) TYP 4214840/G 08/2024 SOT-23 - 1.45 mm max heightDBV0006A SMALL OUTLINE TRANSISTOR NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X PKG 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.6) 2X(0.95) 6X (1.1) 6X (0.6) (R0.05) TYP SOT-23 - 1.45 mm max heightDBV0006A SMALL OUTLINE TRANSISTOR 4214840/G 08/2024 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X SYMM PKG 3 4
Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. DRV 6 WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 4206925/F
www.ti.com PACKAGE OUTLINE C 6X 0.35 0.25 1.6 0.1 6X 0.3 0.2 1.3 1 0.1 4X 0.65 0.8 0.7 0.05 0.00 B 2.1 1.9 A 2.1 1.9 (0.2) TYP WSON - 0.8 mm max heightDRV0006A PLASTIC SMALL OUTLINE - NO LEAD 4222173/B 04/2018 PIN 1 INDEX AREA SEATING PLANE 0.08 C 3 4 (OPTIONAL) PIN 1 ID
0.1 C A B
0.05 C THERMAL PAD EXPOSED NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 5.500
www.ti.com EXAMPLE BOARD LAYOUT (1) 4X (0.65) (1.95) 6X (0.3) 6X (0.45) (1.6) (R0.05) TYP ( 0.2) VIA TYP (1.1) WSON - 0.8 mm max heightDRV0006A PLASTIC SMALL OUTLINE - NO LEAD 4222173/B 04/2018 SYMM 3 4 SYMM LAND PATTERN EXAMPLE SCALE:25X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED METALSOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED)
www.ti.com EXAMPLE STENCIL DESIGN 6X (0.3) 6X (0.45) 4X (0.65) (0.7) (1) (1.95) (R0.05) TYP (0.45) WSON - 0.8 mm max heightDRV0006A PLASTIC SMALL OUTLINE - NO LEAD 4222173/B 04/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD #7 88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:30X SYMM 3 4 SYMM METAL
www.ti.com PACKAGE OUTLINE C 6X 0.35 0.25 1.6 0.1 6X 0.3 0.2 1.3 1 0.1 4X 0.65 0.8 0.7 0.05 0.00 B 2.1 1.9 A 2.1 1.9 (0.2) TYP WSON - 0.8 mm max heightDRV0006D PLASTIC SMALL OUTLINE - NO LEAD 4225563/A 12/2019 PIN 1 INDEX AREA SEATING PLANE 0.08 C 3 4 (OPTIONAL) PIN 1 ID 0.05 C THERMAL PAD EXPOSED NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 5.500
www.ti.com EXAMPLE BOARD LAYOUT (1) 4X (0.65) (1.95) 6X (0.3) 6X (0.45) (1.6) (R0.05) TYP ( 0.2) VIA TYP (1.1) WSON - 0.8 mm max heightDRV0006D PLASTIC SMALL OUTLINE - NO LEAD 4225563/A 12/2019 SYMM 3 4 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:25X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN 6X (0.3) 6X (0.45) 4X (0.65) (0.7) (1) (1.95) (R0.05) TYP (0.45) WSON - 0.8 mm max heightDRV0006D PLASTIC SMALL OUTLINE - NO LEAD 4225563/A 12/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD #7 88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:30X SYMM 3 4 SYMM METAL
www.ti.com PACKAGE OUTLINE C 0.20
0.12 TYP
0.25 3.05 2.55 4X 0.95 1.1 0.7 0.1
0.0 TYP
6X 0.5 0.3 0.6 1.9 0 -8 TYP 4X 0 -15 4X 4 -15 A 3.05 2.75 B1.75 1.45 SOT-23 - 1.1 max heightDDC0006A SMALL OUTLINE TRANSISTOR 4214841/E 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC MO-193. 3 4 0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT 6X (1.1) 6X (0.6) (2.7) 4X (0.95) (R0.05) TYP 4214841/E 08/2024 SOT-23 - 1.1 max heightDDC0006A SMALL OUTLINE TRANSISTOR NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE EXPLOSED METAL SHOWN SCALE:15X SYMM 3 4 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDERMASK DETAILS EXPOSED METAL
www.ti.com EXAMPLE STENCIL DESIGN (2.7) 4X(0.95) 6X (1.1) 6X (0.6) (R0.05) TYP SOT-23 - 1.1 max heightDDC0006A SMALL OUTLINE TRANSISTOR 4214841/E 08/2024 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X SYMM SYMM 3 4
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