REG71050 TI1 | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 32
Technical content
Load□Current□(mA) Efficiency□(%) 1 10 1000.1 V =□VIN OUT V =□2.7VIN V =□4.2VIN V =□3.6VIN V =□3.3VIN V =□3VIN VIN Enable VOUT GND REG710CIN 2.2/c109F COUT 2.2/c109F CPUMP 0.22/c109F 4 63 5 1 Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community Reference Design REG71050,REG71055,REG710 SBAS221H –DECEMBER 2001–REVISED OCTOBER 2015 REG710xxBuck-BoostChargePumpwithupto60-mAOutputCurrent
1 Features 3 Description
The REG710 family of devices are switched capacitor 1• Wide Input Voltage Range: 1.8 V to 5.5 V voltage converters that generate regulated, low-ripple• Automatic Step-Up and Step-Down Operation output voltage from an unregulated input voltage. A
- Low Input Current Ripple wide input supply voltage from 1.8 V to 5.5 V makes the REG710 family of devices ideal for a variety of• Low Output Voltage Ripple battery sources, such as single-cell Li-Ion, or 2-cell• Minimum Number of External Components— No and 3-cell nickel-based or alkaline-based chemistries.Inductors The input voltage may vary above and below the• 1-MHz Internal Oscillator Allows Small Capacitors output voltage and the output remains in regulation.• Shutdown Mode The device works as step-up or step-down converters
- Thermal and Current Limit Protection without the need of an inductor, providing low EMI DC-DC conversion. The high switching frequency• Six Fixed Output Voltages Available: device is thermally protected and current limited,2 Applications protecting the load and the regulator during fault conditions. Typical ground pin current (quiescent• White LED Driver current) is 65 μA with no load, and less than 1 μA in• Smart Card Readers shutdown mode.• SIM Cards
- Handheld devices Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM)• Modems REG710 SOT-23 (6) 2.90 mm × 1.60 mm• PCMCIA Cards SOT (6) 2.90 mm × 1.60 mm• LCD Displays REG71050 SON (6) 2.00 mm × 2.00 mm• Battery Backup Supplies REG71055 SOT-23 (6) 2.90 mm × 1.60 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. spacing Typical Operating Circuit Efficiency vs Load Current An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
REG71050,REG71055,REG710 SBAS221H –DECEMBER 2001–REVISED OCTOBER 2015 www.ti.com Table of Contents
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (January 2009) to Revision H Page
- Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
2 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated
Product Folder Links: REG71050 REG71055 REG710
REG71050,REG71055,REG710 www.ti.com SBAS221H –DECEMBER 2001–REVISED OCTOBER 2015
5 Device Comparison Table
ORDER NUMBER OUTPUT VOLTAGE REG71055 5.5 V REG710NA-5 5 V REG71050 REG710NA-3.3 3.3 V REG710NA-3 3 V REG710NA-2.7 2.7 V REG710NA-2.5 2.5 V
6 Pin Configuration and Functions
DDC and DBV Package DRV Package 6-Pin SOT and SOT-23 6-Pin SON With Exposed Thermal Pad Top View Top View Pin Functions PIN I/O DESCRIPTION NAME DDC/DBV DRV Cpump- 4 3 – Connect to the flying capacitor Cpump+ 6 1 – Connect to the flying capacitor Enable 3 5 I Hardware Enable/Disable pin (high=enable) GND 2 4 – Ground Vin 5 2 I Input supply pin. Connect the input capacitor to this pin. Vout 1 6 O Output supply. Connect the output capacitor to this pin.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Supply voltage –0.3 6 Enable Enable input –0.3 VIN V Output short-circuit duration Indefinite TA Operating ambient temperature –55 125 TJ Operating ambient temperature –55 150 °C Tstg Storage temperature –55 150 Copyright © 2001–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: REG71050 REG71055 REG710
REG71050,REG71055,REG710 SBAS221H –DECEMBER 2001–REVISED OCTOBER 2015 www.ti.com
7.2 ESD Ratings
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge VCharged device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT INPUT VOLTAGE REG71055 3 5.5 V Tested Startup(1) REG710-5 2.7 5.5 V All other models 1.8 5.5 V TA Operating ambient temperature range –40 85 °C (1) See conditions under Output Voltage with a resistive load no lower than typical VOUT/IOUT in Electrical Characteristics.
7.4 Thermal Information
THERMAL METRIC(1) DRV DDC DBV UNIT
6 PINS 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 119.1 204.6 184.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 110.5 50.5 124.6 °C/W RθJB Junction-to-board thermal resistance 88.7 54.3 30.6 °C/W ψJT Junction-to-top characterization parameter 7.7 0.8 22.1 °C/W ψJB Junction-to-board characterization parameter 89 52.8 30.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 61.8 n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics
TA = -40ºC to 85ºC, typical values are at TA = 25°C (unless otherwise noted), VIN = (VOUT / 2 + 0.75 V), IOUT = 10 mA, CIN = COUT = 2.2 μF, CPUMP = 0.22 μF, and VENABLE = 1.3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY VIN Input voltage range. Tested Startup. See conditions under Output VoltageREG71055 3 5.5 with a resistive load no lower than REG710-5 2.7 5.5 Vtypical VOUT/IOUT. All other models 1.8 5.5 IQ Operating quiescent current IOUT = 0 mA, TA = 25°C 65 100 μA VIN = 1.8 V to 5.5 V, Enable = 0 V, TAISD Shutdown current 0.01 1 μA= 25°C CONTROL SIGNALS (ENABLE) Logic high input voltage VIN = 1.8 V to 5.5 V 1.3 VIN V Logic low input voltage VIN = 1.8 V to 5.5 V –0.2 0.4 V Logic high input current VIN = 1.8 V to 5.5 V, TA = 25°C 100 nA Logic low input current VIN = 1.8 V to 5.5 V, TA = 25°C 100 nA OSCILLATOR FREQUENCY(1) 1 MHz (1) The converter regulates by enabling and disabling periods of switching cycles. The switching frequency is the oscillator frequency during an active period.
4 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated
Product Folder Links: REG71050 REG71055 REG710
REG71050,REG71055,REG710 www.ti.com SBAS221H –DECEMBER 2001–REVISED OCTOBER 2015 Electrical Characteristics (continued) TA = -40ºC to 85ºC, typical values are at TA = 25°C (unless otherwise noted), VIN = (VOUT / 2 + 0.75 V), IOUT = 10 mA, CIN = COUT = 2.2 μF, CPUMP = 0.22 μF, and VENABLE = 1.3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OUTPUT IOUT ≤ 10 mA, 3 V ≤ VIN ≤ 5.5 V 5.2 5.5 5.8 V REG71055 IOUT ≤ 10 mA, 2.7 V ≤ VIN ≤ 5.5 V 4.7 5 5.3 V REG710-5, REG71050 IOUT ≤ 30 mA, 3 V ≤ VIN ≤ 5.5 V 4.7 5 5.3 V IOUT ≤ 60 mA, 3.3 V ≤ VIN ≤ 4.2 V 4.6 5 5.4 V REG710-3.3 IOUT ≤ 10 mA, 1.8 V ≤ VIN ≤ 5.5 V 2.82 3 3.18 V REG710-3 IOUT ≤ 30 mA, 2.2 V ≤ VIN ≤ 5.5 V 2.82 3 3.18 V REG710-2.7 IOUT ≤ 30 mA, 2 V ≤ VIN ≤ 5.5 V 2.54 2.7 2.86 V REG710-2.5 IOUT ≤ 30 mA, 2 V ≤ VIN ≤ 5.5 V 2.35 2.5 2.65 V Iout Nominal output current TA = 25°C 30 mA Isc Short circuit output current TA = 25°C 100 mA RIPPLE VOLTAGE (2) IOUT = 30 mA, TA = 25°C 35 mVPP IOUT = 10 mA, VIN = 1.8 V, REG710-EFFICIENCY(3) 90%3.3, TA = 25°C THERMAL SHUTDOWN Shutdown temperature 160 °C Shutdown recovery 140 °C (2) Effective series resistance (ESR) of capacitors is < 0.1 Ω. (3) See efficiency curves for other VIN/VOUT configurations. Copyright © 2001–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: REG71050 REG71055 REG710
7.6 Typical Characteristics
Figure 1. Supply Current vs Temperature Figure 2. Supply Current vs Temperature Figure 4. Output Voltage Drift HistogramFigure 3. Output Voltage vs Temperature
6 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated
8 Detailed Description
8.1 Overview
device operates as a variable frequency switched-mode regulator. This operation is shown in Figure 5. of operation, as shown in Figure 6. shown in Figure 6 (A), and CPUMP charges to VIN. CPUMP is added to VIN. The output voltage is regulated by skipping clock cycles as necessary. Figure 5. Simplified Schematic of the REG710 Operating in the Step-Down Mode Figure 6. Simplified Schematic of the REG710 Operating in the Step-Up or Boost Mode
1 VOUT
2 GND
2.2 F/c109
0.22 F/c109
REG71050,REG71055,REG710 SBAS221H –DECEMBER 2001–REVISED OCTOBER 2015 www.ti.com
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Shutdown Mode
The EN pin enables the IC when pulled high and places it into energy-saving shutdown mode when pulled low. When in shutdown mode, the output is disconnected from the input and the quiescent current is reduced to 0.01 μA typical. This shutdown mode functionality is only valid when VIN is above the minimum recommended operating voltage. The EN pin cannot be left floating and must be actively terminated either high or low.
8.3.2 Protection
The regulator includes thermal shutdown circuitry protecting the device from damage caused by overload conditions. The thermal protection circuitry disables the output when the junction temperature reaches approximately 160°C, allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is automatically reenabled. Continuously operating the regulator into thermal shutdown can degrade reliability. The regulator also provides current limit to protect itself and the load.
8.4 Device Functional Modes
8.4.1 Peak Current Reduction
In normal operation, the charging of the pump and the output capacitors usually leads to relatively high peak input currents which can be much higher than the average load current. The regulator incorporates circuitry to limit the input peak current, lowering the total EMI emission and lowering the output voltage ripple and the input current ripple. The Input capacitor (CIN) supplies most of the charge required by the input current peaks.
8.4.2 Efficiency
The efficiency of the charge pump regulator varies with the output voltage version, the applied input voltage, the load current, and the internal operation mode of the device. The approximate efficiency is given by:
8 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated
Product Folder Links: REG71050 REG71055 REG710
Table 1. Operating Mode Change versus VIN Table 1 lists the approximate values of the input voltage at which the device changes internal operating mode. See efficiency curves in Typical Characteristics for various loads and input voltages.
9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
power supply design. Application curves are included for the typical application shown below.
9.2 Typical Applications
Figure 7. Typical Operating Circuit
9.2.1 Design Requirements
The REG710 family of switched capacitor voltage converters offers a variety of regulated fixed output voltages.
9.2.2 Detailed Design Procedure
9.2.2.1 Capacitor Selection
respectively) should also be surface-mount ceramic types. In all cases, X7R or X5R dielectric are recommended. See the typical operating circuit shown in Figure 7 for component values. output capacitor, COUT, to 10 μF or larger.
10 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated
Table 2. Suggested Capacitors
9.2.3 Application Curves
Figure 8. Efficiency vs VIN Figure 9. Efficiency vs Load Current Figure 10. Efficiency vs Load Current Figure 11. Efficiency vs Load Current
Figure 12. Efficiency vs Load Current Figure 13. Efficiency vs Load Current Figure 14. Load Transient Response Figure 15. Line Transient Response Figure 16. Output Ripple Voltage Figure 17. Output Ripple Voltage vs VIN
12 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated
9.3 System Examples
The REG710 family of charge pumps can be cascaded to reach higher output voltages, as shown in Figure 21. Figure 21. REG710 Circuit for Step-Up Operation From 1.8 V to 5 V With 10-mA Output Current or 3.3 V to 5 V. Connect both Enable pins together.
14 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated
4.7 F/c109
9.3.2 Doubling the Output Current
Figure 22. REG710 Circuit for Doubling the Output Current When higher output currents are required, the REG710 family can be paralleled to double the output current. account (see Electrical Characteristics).
9.3.3 Driving LEDs
Figure 23. REG710 Circuit for Driving LEDs required output voltage. In this application, the charge pump can drive multiple LEDs up to 60 mA in total.
16 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated
10 Power Supply Recommendations
output current of the REG710.
11 Layout
11.1 Layout Guidelines
the capacitors as close as possible to the regulator using short, direct circuit traces. output capacitors have been kept as short as possible.
11.2 Layout Example
Figure 24. Suggested PCB Design for Minimum Ripple
12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Related Links
resources, tools and software, and quick access to sample or buy. Table 3. Related Links
12.3 Community Resources
solve problems with fellow engineers. contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated
www.ti.com 24-Apr-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples REG71050DDCR ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 GAAI REG71050DDCRG4 ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 GAAI REG71050DDCT ACTIVE SOT DDC 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 GAAI REG71050DDCTG4 ACTIVE SOT DDC 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 GAAI REG71050DRVR ACTIVE SON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CFF REG71050DRVRG4 ACTIVE SON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CFF REG71050DRVT ACTIVE SON DRV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CFF REG71055DDCR ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10H REG71055DDCRG4 ACTIVE SOT DDC 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10H REG71055DDCT ACTIVE SOT DDC 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10H REG71055DDCTG4 ACTIVE SOT DDC 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10H REG710NA-2.5/250 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10G REG710NA-2.5/250G4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10G REG710NA-2.5/3K OBSOLETE SOT-23 DBV 6 TBD Call TI Call TI -40 to 85 R10G REG710NA-2.5/3KG4 OBSOLETE SOT-23 DBV 6 TBD Call TI Call TI -40 to 85 REG710NA-2.7/250 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10F REG710NA-3.3/250 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10C REG710NA-3.3/250G4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10C
www.ti.com 24-Apr-2015 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples REG710NA-3.3/3K ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10C REG710NA-3/250 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10D REG710NA-3/250G4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10D REG710NA-3/3K ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10D REG710NA-3/3KG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10D REG710NA-5/250 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10B REG710NA-5/250G4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10B REG710NA-5/3K ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10B REG710NA-5/3KG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 R10B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
www.ti.com 24-Apr-2015 Addendum-Page 3 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF REG71055 :
- Automotive: REG71055-Q1 NOTE: Qualified Version Definitions:
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 28-Jul-2014 Pack Materials-Page 1
(mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REG71050DDCR SOT DDC 6 3000 203.0 203.0 35.0 REG71050DDCT SOT DDC 6 250 203.0 203.0 35.0 REG71050DRVR SON DRV 6 3000 195.0 200.0 45.0 REG71050DRVT SON DRV 6 250 210.0 185.0 35.0 REG71050DRVT SON DRV 6 250 195.0 200.0 45.0 REG71055DDCR SOT DDC 6 3000 203.0 203.0 35.0 REG71055DDCT SOT DDC 6 250 203.0 203.0 35.0 REG710NA-2.5/250 SOT-23 DBV 6 250 203.0 203.0 35.0 REG710NA-2.7/250 SOT-23 DBV 6 250 203.0 203.0 35.0 REG710NA-3.3/250 SOT-23 DBV 6 250 180.0 180.0 18.0 REG710NA-3.3/3K SOT-23 DBV 6 3000 203.0 203.0 35.0 REG710NA-3.3/3K SOT-23 DBV 6 3000 180.0 180.0 18.0 REG710NA-3/250 SOT-23 DBV 6 250 203.0 203.0 35.0 REG710NA-3/250 SOT-23 DBV 6 250 180.0 180.0 18.0 REG710NA-3/3K SOT-23 DBV 6 3000 180.0 180.0 18.0 PACKAGE MATERIALS INFORMATION www.ti.com 28-Jul-2014 Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REG710NA-3/3K SOT-23 DBV 6 3000 203.0 203.0 35.0 REG710NA-5/250 SOT-23 DBV 6 250 180.0 180.0 18.0 REG710NA-5/250 SOT-23 DBV 6 250 203.0 203.0 35.0 REG710NA-5/3K SOT-23 DBV 6 3000 203.0 203.0 35.0 REG710NA-5/3K SOT-23 DBV 6 3000 180.0 180.0 18.0 PACKAGE MATERIALS INFORMATION www.ti.com 28-Jul-2014 Pack Materials-Page 3
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic”are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated