REG101-25 TI1 | Alldatasheet

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Technical content

100mA Low-Dropout Regulator

FEATURES

G NEW DMOS TOPOLOGY: Ultra Low Dropout Voltage: 60mV typ at 100mA Output capacitor NOT required for stability G FAST TRANSIENT RESPONSE G VERY LOW NOISE: 23µVrms G HIGH ACCURACY: ±1.5% max G HIGH EFFICIENCY: IGND = 500µA at IOUT = 100mA Not Enabled: IGND = 10nA ADJUSTABLE OUTPUT VERSIONS G OTHER OUTPUT VOLTAGES AVAILABLE UPON REQUEST G FOLDBACK CURRENT LIMIT G THERMAL PROTECTION G SMALL SURFACE-MOUNT PACKAGES: SOT23-5 and SO-8

APPLICATIONS

G PORTABLE COMMUNICATION DEVICES G BATTERY-POWERED EQUIPMENT G PERSONAL DIGITAL ASSISTANTS G MODEMS G BAR-CODE SCANNERS G BACKUP POWER SUPPLIES

DESCRIPTION

The REG101 is a family of low-noise, low-dropout linear regulators with low ground pin current. Its new DMOS topology provides significant improvement over previous designs, including low dropout voltage (only 60mV typ at full load), and better transient performance. In addition, no output capacitor is required for stability, unlike conventional low-dropout regulators that are difficult to compensate and require expensive low ESR capacitors greater than 1µF. Typical ground pin current is only 500µA (at I OUT = 100mA) and drops to 10nA when not in enabled mode. Unlike regula- tors with PNP pass devices, quiescent current remains rela- tively constant over load variation and under dropout condi- tions. The REG101 has very low output noise (typically 23µVrms for V OUT = 3.3V with CNR = 0.01µF), making it ideal for use in portable communications equipment. Accuracy is main- tained over temperature, line, and load variations. Key parameters are tested over the specified temperature range (–40°C to +85°C). The REG101 is well protected—internal circuitry provides a current limit that protects the load from damage. Thermal protection circuitry keeps the chip from being damaged by excessive temperature. The REG101 is available in the SOT23-5 and the SO-8 packages. REG101 (Fixed Voltage Versions) Enable Gnd 0.1µF C OUT (1)++ VOUTVIN NR NR = Noise Reduction NOTE: (1) Optional. REG101-A Gnd Enable 0.1µF + C OUT (1)+ VOUTVIN R 2 R 1 Adj REG101 REG101 SBVS026D – JULY 2001 – REVISED SEPTEMBER 2005 www.ti.com PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000-2005, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.

ABSOLUTE MAXIMUM RATINGS (1) Operating Temperature Range (T NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PIN CONFIGURATIONS Top View VOUT (2) VOUT (2) NR/Adjust(1) GND VIN (3) VIN (3) NC Enable SO-8 (U Package) VIN GND Enable VOUT NR/Adjust(1) SOT23-5 (N Package) NOTE: (1) For REG101A-A: voltage setting resistor pin. All other models: noise reduction capacitor pin. (2) Both pin 1 and pin 2 must be connected. (3) Both pin 7 and pin 8 must be connected. PACKAGE/ORDERING INFORMATION (1) PRODUCT VOUT (2) REG101 xx-yyyy/zzz XX is package designator. YYYY is typical output voltage (5 = 5.0V, 2.85 = 2.85V, A = Adjustable). ZZZ is package quantity. (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (2) Output voltages from 2.5V to 5.1V in 50mV increments are available; minimum order quantities apply. Contact factory for details and availability.

ELECTRICAL CHARACTERISTICS

Boldface limits apply over the specified temperature range, TJ = –40°C to +85°C. REG101NA REG101UA PARAMETER CONDITION MIN TYP MAX UNITS OUTPUT VOLTAGE Output Voltage V OUT REG101-2.5 2.5 V REG101-2.8 2.8 V REG101-2.85 2.85 V REG101-3.0 3.0 V REG101-3.3 3.3 V REG101-5 5V REG101-A 2.5 5.5 V Reference Voltage V REF 1.267 V Adjust Pin Current I ADJ 0.2 1 µA Accuracy ±0.5 ±1.5 % Over Temperature ±2.2 % vs Temperature dV OUT /dT 50 ppm/°C Includes Line and Load IOUT = 2mA to 100mA, VIN = (VOUT + 0.4V) to 10V ±0.8 ±2.0 % Over Temperature V IN = (VOUT + 0.6V) to 10V ±2.7 % DC DROPOUT VOLTAGE (2) VDROP IOUT = 2mA 4 10 mV For all models I OUT = 100mA 60 100 mV Over Temperature I OUT = 100mA 130 mV VOLTAGE NOISE Vn f = 10Hz to 100kHz Without CNR C NR = 0, COUT = 0 23 µVrms/V • VOUT µVrms With CNR (all fixed voltage models) C NR = 0.01µF, COUT = 10µF7 µVrms/V • VOUT µVrms OUTPUT CURRENT Current Limit(3) ICL 130 170 220 mA Over Temperature 110 240 mA Short-Circuit Current I SC 60 mA RIPPLE REJECTION f = 120Hz I OUT = 100mA 65 dB ENABLE CONTROL VENABLE High (output enabled) V ENABLE 1.8 V IN V VENABLE Low (output disabled) –0.2 0.5 V IENABLE High (output enabled) I ENABLE VENABLE = 1.8V to VIN, VIN = 1.8V to 6.5(4) 1 100 nA IENABLE Low (output disabled) V ENABLE = 0V to 0.5V 2 100 nA Output Disable Time C OUT = 1.0µF, RLOAD = 33Ω 200 µs Output Enable Time C OUT = 1.0µF, RLOAD = 33Ω 1.5 ms THERMAL SHUTDOWN Junction Temperature Shutdown 160 °C Reset from Shutdown 140 °C GROUND PIN CURRENT Ground Pin Current I GND IOUT = 2mA 400 500 µA IOUT = 100mA 500 650 µA Enable Pin Low V ENABLE ≤ 0.5V 0.01 0.2 µA INPUT VOLTAGE VIN Operating Input Voltage Range(5) 1.8 10 V Specified Input Voltage Range V IN > 1.8V V OUT + 0.4 10 V Over Temperature V IN > 1.8V V OUT + 0.6 10 V TEMPERATURE RANGE Specified Range T J –40 +85 °C Operating Range T J –55 +125 °C Storage Range T A –65 +150 °C Thermal Resistance SOT23-5 Surface Mount θJA Junction-to-Ambient 200 °C/W SO-8 Surface Mount θJA Junction-to-Ambient 150 °C/W NOTES: (1) The REG101 does not require a minimum output capacitor for stability. However, transient response can be improved with proper capacitor selection. (2) Dropout voltage is defined as the input voltage minus the output voltage that produces a 2% change in the output voltage from the value at VIN = VOUT + 1V at fixed load. (3) Current limit is the output current that produces a 10% change in output voltage from VIN = VOUT + 1V and IOUT = 2mA. (4) For VENABLE > 6.5V, see typical characteristic “IENABLE vs VENABLE ”. (5) The REG101 no longer regulates when VIN < VOUT + VDROP (MAX) . In drop-out, the impedance from VIN to VOUT is typically less than 1Ω at TJ = +25°C.

For all models, at TJ = +25°C and VENABLE = 1.8V, unless otherwise noted. 2004 010 30 60 50 70 80 90 100 0.80 0.60 0.40 0.20 0.00 –0.20 –0.40 –0.60 –0.80 Output Voltage Change (%) IOUT (mA) OUTPUT VOLTAGE CHANGE vs I OUT (VIN = VOUT + 1V, Output Voltage % Change Referred to IOUT = 50mA at +25°C) –55°C +125°C +25°C –25–50 0 75 25 50 100 125 0.0% –0.1% –0.2% –0.3% –0.4% Output Voltage Change (%) Temperature (°C) LOAD REGULATION vs TEMPERATURE (VIN = VOUT + 1V) 10mA < IOUT < 100mA 2mA < IOUT < 1000mA –50 –25 0 25 50 75 100 125 0.10 0.08 0.06 0.04 0.02 0.00 –0.02 –0.04 –0.06 –0.08 –0.10 Output Voltage Change (%) Temperature (°C) LINE REGULATION vs TEMPERATURE IOUT = 100mA (VOUT + 1V) < VIN < 10V (VOUT + 0.4V) < VIN < 10V 0 10 100 100 DC Dropout Voltage (mV) IOUT (mA) DC DROPOUT VOLTAGE vs I OUT 20 30 40 50 60 70 80 90 –55°C +125°C +25°C 01 2 345 8 67 –10 –15 –20 Output Voltage Change (mV) VIN – VOUT (V) LINE REGULATION (Referred to VIN = VOUT + 1V at IOUT = 50mA) IOUT = 2mA IOUT = 50mA IOUT = 100mA –50 125 1007550250–25 100 DC Dropout Voltage (mV) Temperature (°C) DC DROPOUT VOLTAGE vs TEMPERATURE IOUT = 100mA

TYPICAL CHARACTERISTICS (Cont.) For all models, at TJ = +25°C and VENABLE = 1.8V, unless otherwise noted. –50 25 –25 0 50 75 100 125 0.50 0.40 0.30 0.20 0.10 0.00 –0.10 –0.20 –0.30 –0.40 –0.50 Output Voltage Change (%) Temperature (°C) OUTPUT VOLTAGE vs TEMPERATURE (Output Voltage % Change Referred to IOUT = 50mA at +25°C) IOUT = 2mA IOUT = 100mA IOUT = 50mA –50 25 –25 0 50 75 100 125 100n 10n 100p IGND (A) Temperature (°C) GROUND PIN CURRENT, NOT ENABLED vs TEMPERATURE VENABLE = 0.5V VIN = VOUT + 1V –1.0 –0.8 –0.6 –0.4 –0.2 0.0 0.2 0.4 0.6 0.8 1.0 Percentage of Units (%) Error (%) OUTPUT VOLTAGE ACCURACY HISTOGRAM 100 Percentage of Units (%) VOUT Drift (ppm/°C) OUTPUT VOLTAGE DRIFT HISTOGRAM 02 0 3 010 50 40 70 60 90 80 100 600 500 400 300 200 100 IGND (µA) IOUT (mA) GROUND PIN CURRENT vs I OUT VOUT = 2.5V VIN = VOUT + 1V VOUT = 3.3V VOUT = 5.0V –50 –25 0 25 50 75 125 100 600 575 550 525 500 475 450 425 400 IGND (µA) Temperature (°C) GROUND PIN CURRENT vs TEMPERATURE IOUT = 100mAVOUT = 5V VOUT = 3.3V VOUT = 2.5V VIN = VOUT + 1V

TTYPICAL CHARACTERISTICS (Cont.) For all models, at TJ = +25°C and VENABLE = 1.8V, unless otherwise noted. 10 100 1k 10k 100k 0.1 0.01 eN (µV/√Hz) Frequency (Hz) NOISE SPECTRAL DENSITY IOUT = 100mA C NR = 0µF C OUT = 1µF C OUT = 0µF C OUT = 10µF 10 100 1k 10k 100k 0.1 0.01 eN (µV/√Hz) Frequency (Hz) NOISE SPECTRAL DENSITY IOUT = 100mA C NR = 0.01µF C OUT = 1µF C OUT = 0µF C OUT = 10µF Ripple Rejection (dB) VIN - VOUT (V) RIPPLE REJECTION vs (VIN – VOUT ) REG101-3.3 Frequency = 100kHz C OUT = 10µF IOUT = 100mA 0.1 11 0 Noise Voltage (µVrms) C OUT (µF) RMS NOISE VOLTAGE vs C OUT REG101-5.0 REG101-3.3 REG101-2.5 C NR = 0.01µF 10Hz < BW < 100kHz 11 0 1 k 100 10k 110 100 Noise Voltage (µVrms) C NR (pF) RMS NOISE VOLTAGE vs C NR C NR = 0µF 10Hz < BW < 100kHz REG101-5.0 REG101-2.5 REG101-3.3 10 100 1k 10k 100k 10M 1M Ripple Rejection (dB) Frequency (Hz) RIPPLE REJECTION vs FREQUENCY IOUT = 2mA IOUT = 100mA IOUT = 2mA C OUT = 10µF IOUT = 100mA C OUT = 10µF C OUT = 0µF

TYPICAL CHARACTERISTICS (Cont.) For all models, at TJ = +25°C and VENABLE = 1.8V, unless otherwise noted. –50 –25 ISC 125 180 160 140 120 100 IOUT (mA) Temperature (°C) CURRENT LIMIT vs TEMPERATURE ICL 0 25 50 75 100 VIN = VOUT + 1V LINE TRANSIENT RESPONSE 50µs/div 5.3V 50mV/div50mV/div VIN VOUT VOUT 4.3V REG101-3.3 IOUT = 100mA C OUT = 0 C OUT = 10µF LOAD TRANSIENT RESPONSE 10µs/div REG101-3.3 VIN = 4.3V 100mA 200mV/div200mV/div IOUT VOUT VOUT 10mA C OUT = 0µF C OUT = 10µF TURN-OFF 200µs/div 1V/div1V/div VENABLE VOUT REG101-3.3 C NR = 0.01µF C OUT = 0µF R LOAD = 1600Ω C OUT = 10µF R LOAD = 33Ω C OUT = 1.0µF R LOAD = 33Ω TURN-ON 250µs/div 1V/div1V/div VENABLE VOUT REG101-3.3 VIN = VOUT + 1V C NR = 0.01µF C OUT = 0µF R LOAD = 33Ω C OUT = 10µF R LOAD = 33Ω C OUT = 0µF R LOAD = 1600Ω 04 0 20 140 160 80 100 12060 180 3.5 3.0 2.5 2.0 1.5 1.0 0.5 Output Voltage (V) Output Current (mA) FOLDBACK CURRENT LIMIT ICL ISC REG101-3.3

TYPICAL CHARACTERISTICS (Cont.) For all models, at TJ = +25°C and VENABLE = 1.8V, unless otherwise noted. 6789 1 0 10µ 100n 10n IENABLE (A) VENABLE (V) IENABLE vs VENABLE T = +25°C T = –55°C T = +125°C POWER UP/POWER DOWN 1s/div 500mV/div VOUT = 3.0V R LOAD = 30Ω VOUTVIN 10 100 1k 10k 100k Vn (µVrms) C ADJ (pF) RMS NOISE VOLTAGE vs C ADJ REG101 –A VOUT = 3.3V C OUT = 0.1µF 10Hz < frequency < 100kHz –50 –25 0 25 50 75 100 125 0.350 0.300 0.250 0.200 0.150 0.100 0.050 0.000 IADJ (µA) Temperature (°C) ADJUST PIN CURRENT vs TEMPERATURE 200mV/div 200mV/div 10mA VOUT C OUT = 0 REG101 –A VIN = 4.3V VOUT = 3.3V C OUT = 10µF VOUT IOUT 100mA LOAD TRANSIENT-ADJUSTABLE VERSION 50mV/div 50mV/div 4.3V VOUT C OUT = 0 REG101 –A IOUT = 100mA C FB = 0.01µF VOUT = 3.3V C OUT = 10µF VOUT VIN 5.3V LINE TRANSIENT-ADJUSTABLE VERSION

FIGURE 6. Transient and DC Dropout. drop-out under DC load conditions. an undesirable effect on the load.

FIGURE 7. Maximum Power Dissipation versus Ambient Temperature for the Various Packages. configurations are shown in Figure 7.

www.ti.com 17-Aug-2012 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) REG101NA-2.5/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-2.5/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-2.5/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-2.5/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-2.8/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-2.8/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-2.85/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-2.85/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-2.85/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-3.3/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-3.3/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-3.3/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-3.3/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-3/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-3/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-3/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-3/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

www.ti.com 17-Aug-2012 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) REG101NA-5/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-5/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-5/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-5/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-A/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-A/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-A/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA-A/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101NA2.85/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM REG101UA-2.5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-2.5G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-2.8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-2.8/2K5 ACTIVE SOIC D 8 TBD Call TI Call TI REG101UA-2.8/2K5G4 ACTIVE SOIC D 8 TBD Call TI Call TI REG101UA-2.85 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-2.85G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-2.8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-3 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-3.3 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

www.ti.com 17-Aug-2012 Addendum-Page 3 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) REG101UA-3.3/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-3.3/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-3.3G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-3G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-5/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-5/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-5G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-A ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REG101UA-AG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

www.ti.com 17-Aug-2012 Addendum-Page 4 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REG101NA-2.5/250 SOT-23 DBV 5 250 203.0 203.0 35.0 REG101NA-2.5/3K SOT-23 DBV 5 3000 203.0 203.0 35.0 REG101NA-2.8/250 SOT-23 DBV 5 250 203.0 203.0 35.0 REG101NA-2.85/250 SOT-23 DBV 5 250 203.0 203.0 35.0 REG101NA-2.85/3K SOT-23 DBV 5 3000 203.0 203.0 35.0 REG101NA-3.3/250 SOT-23 DBV 5 250 203.0 203.0 35.0 REG101NA-3.3/3K SOT-23 DBV 5 3000 203.0 203.0 35.0 REG101NA-3/250 SOT-23 DBV 5 250 203.0 203.0 35.0 REG101NA-3/3K SOT-23 DBV 5 3000 203.0 203.0 35.0 REG101NA-5/250 SOT-23 DBV 5 250 203.0 203.0 35.0 REG101NA-5/3K SOT-23 DBV 5 3000 203.0 203.0 35.0 REG101NA-A/250 SOT-23 DBV 5 250 203.0 203.0 35.0 REG101NA-A/3K SOT-23 DBV 5 3000 203.0 203.0 35.0 REG101UA-3.3/2K5 SOIC D 8 2500 367.0 367.0 35.0 REG101UA-5/2K5 SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 Pack Materials-Page 2

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Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents whichmeet ISO/TS16949 requirements,mainlyforautomotiveuse.Components which have notbeen so designatedareneitherdesignednorintendedforautomotiveuse;and TIwillnotbe responsibleforany failureofsuch components tomeet such requirements. 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