REF43

REF43 +2.5 V Low Power Precision Voltage Reference Data Sheet (REV. D)

Document overview

• Manufacturer or author: Analog Devices, Inc.
• PDF pages: 12

Technical content

REV. D Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2004 Analog Devices, Inc. All rights reserved. REF43 +2.5 V Low Power Precision Voltage Reference FEATURES PIN CONFIGURATION GENERAL DESCRIPTION The REF43 is a low power precision reference providing a stable 2.5 V output independent of variations in supply voltage, load conditions or ambient temperature. It is suitable as a reference level for 8-, 10- and 12-bit data acquisition systems, or wherever a stable, known voltage is required. SIMPLIFIED SCHEMATIC ORDERING GUIDE Number of Initial Temperature Package Package Part per Temperature Model Accuracy Coefficient Description Option Reel/Tray Range REF43FZ 0.06% 10ppm/ ∞C 8-Pin Hermetic DIP Q-8 48 –40 ∞C to +85∞C REF43GZ 0.10% 25ppm/ ∞C 8-Pin Hermetic DIP Q-8 48 –40 ∞C to +85∞C REF43GP 0.10% 25ppm/ ∞C 8-Pin Plastic DIP N-8 50 –40 ∞C to +85∞C REF43GS 0.10% 25ppm/ ∞C 8-Pin SOIC R-8 98 –40 ∞C to +85∞C REF43GS-REEL 0.10% 25ppm/ ∞C 8-Pin SOIC R-8 2,500 –40 ∞C to +85∞C REF43GS-REEL7 0.10% 25ppm/ ∞C 8-Pin SOIC R-8 1,000 –40 ∞C to +85∞C REF43GSZ* 0.10% 25ppm/ ∞C 8-Pin SOIC R-8 98 –40 ∞C to +85∞C REF43GSZ-REEL7* 0.10% 25ppm/ ∞C 8-Pin SOIC R-8 1,000 –40 ∞C to +85∞C REF43NBC 0.20% Die 221 *Z = Pb-free part. Tight output tolerances and low thermal drift are assured by zener-zap trimming of both output voltage and its temperature coefficient. A unique curvature correction circuit reduces the thermal curvature which is characteristic of many previous bandgap references. TEMP VIN VOUT TRIM GROUND

REV. D–2– REF43 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the REF43 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

REV. D –3–

REV. D–4– REF43 DICE CHARACTERISTICS DIE SIZE 0.085 /H11547 0.062 inch, 5270 sq. mils (2.16 /H11547 1.57 mm, 3.39 sq. mm) 4A. 4B. 6A. 6B. *PADS 4A AND 4B MUST BOTH BE BONDED TO GROUND. ‡VOUT FORCE AND SENSE ARE TYPICALLY BONDED TOGETHER AT THE LOAD. VIN TEMPERATURE OUT GROUND* GROUND* TRIM VOUT FO2. VIN VOUT SENSE‡

REV. D REF43 –5– Typical Performance Characteristics–

REV. D–6– REF43

REV. D REF43 –7–

REV. D–8– REF43 *OP AMP IS OP43 IF HIGHER SPEED AND FASTER SETTING IS REQUIRED. OP97 IF LOWER SPEED AND HIGHER LINEARITY IS REQUIRED.

REV. D REF43 –9–

REV. D–10– REF43

REV. D REF43 –11–

REV. D C00374–0–8/04(D) –12– REF43

Revision History

8/04—Data Sheet Changed from REV. C to REV. D. 8-Lead Plastic Dual In-Line Package [PDIP] (N-8) P-Suffix Dimensions shown in inches and (millimeters) SEATING PLANE 0.180 (4.57) MAX 0.150 (3.81) 0.130 (3.30) 0.110 (2.79) 0.060 (1.52) 0.050 (1.27) 0.045 (1.14) 1 4 5 0.295 (7.49) 0.285 (7.24) 0.275 (6.98) 0.100 (2.54) BSC 0.375 (9.53) 0.365 (9.27) 0.355 (9.02) 0.150 (3.81) 0.135 (3.43) 0.120 (3.05) 0.015 (0.38) 0.010 (0.25) 0.008 (0.20) 0.325 (8.26) 0.310 (7.87) 0.300 (7.62) 0.022 (0.56) 0.018 (0.46) 0.014 (0.36) CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN COMPLIANT TO JEDEC STANDARDS MO-095AA 0.015 (0.38) MIN OUTLINE DIMENSIONS 8-Lead Standard Small Outline Package [SOIC] (R-8) S-Suffix Dimensions shown in millimeters and (inches) 0.25 (0.0098) 0.17 (0.0067) 1.27 (0.0500) 0.40 (0.0157) 0.50 (0.0196) 0.25 (0.0099) /H11547 45/H11543 8/H11543 0/H11543 1.75 (0.0688) 1.35 (0.0532) SEATING PLANE 0.25 (0.0098) 0.10 (0.0040) 5.00 (0.1968) 4.80 (0.1890) 4.00 (0.1574) 3.80 (0.1497) 1.27 (0.0500) BSC 6.20 (0.2440) 5.80 (0.2284) 0.51 (0.0201) 0.31 (0.0122)COPLANARITY 0.10 CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN COMPLIANT TO JEDEC STANDARDS MS-012AA 8-Lead Ceramic Dual In-Line Package [CERDIP] (Q-8) Z-Suffix Dimensions shown in inches and (millimeters) 1 4 0.310 (7.87) 0.220 (5.59)PIN 1 0.005 (0.13) MIN 0.055 (1.40) MAX 0.100 (2.54) BSC 0.320 (8.13) 0.290 (7.37) 0.015 (0.38) 0.008 (0.20) SEATING PLANE 0.200 (5.08) MAX 0.405 (10.29) MAX 0.150 (3.81) MIN 0.200 (5.08) 0.125 (3.18) 0.023 (0.58) 0.014 (0.36) 0.070 (1.78) 0.030 (0.76) 0.060 (1.52) 0.015 (0.38) CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN