REF3012

REF30 TI | Alldatasheet

Document overview

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Technical content

REF30E and REF30, Low Current Voltage Reference in SOT-23-3

1 Features

• Small industry standard footprint: SOT23-3
• High accuracy – REF30E: ±0.1% – REF30: ±0.2%
• Excellent temperature drift performance: – REF30E: 20ppm/°C – REF30: 75ppm/°C
• REF30E is drop-in replacement of REF30
• Low IQ (typical) – REF30E: 25µA – REF30: 42µA
• High output current – REF30E: ±10mA – REF30: 25mA
• Output voltage options – REF30E: 1.25V to 5V – REF30: 1.25V to 4.096V
• Temperature range: -40ºC to +125ºC

2 Applications

• Field transmitter & sensor
• Solar energy
• PLC, DCS & PAC
• Energy storage systems
• Medical & healthcare
• AC inverter & VF drives
• Handheld Test Equipment

3 Description

The REF30 is a precision, low-power, low-dropout voltage, reference family available in a tiny 3- pin SOT-23 package. REF30E is the enhanced performance version of REF30 family which is designed for precision applications. The REF30E offers improved temperature drift and initial accuracy while operating at a lower quiescent current of 25µA. The low power consumption and the improved precision make the REF30E very attractive for loop- powered industrial applications such as pressure and temperature transmitter and battery-powered applications. The REF30/REF30E is specified over the extended industrial temperature range of –40°C to +125°C. The REF30 is easy to use in intrinsically safe and explosion-proof applications because the REF30 does not require a load capacitor to be stable.

Package Information

PART NUMBER PACKAGE(1) PACKAGE SIZE(2) REF30xx SOT-23 (3) 2.92mm × 2.37mm REF30xxE(3) SOT-23 (3) 2.92mm × 2.37mm (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) The package size (length × width) is a nominal value and includes pins, where applicable. (3) This is preview device. Contact local TI support for samples. 5 Ω ADS7822 VCC CS DOUT DCLOCK VREF +In – In GND

1 F to 10 Fμ μ

1 F to μ

10 F μ

3.3 V

0.1 F μ

V IN VS Microcontroller REF3033 GND Copyright © 2016, Texas Instruments Incorporated Typical Application 350 300 250 200 150 100 Dropout Voltage (mV) 0 5 10 15 20 25 30 Load Current (mA) Dropout Voltage vs Load Current REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

11 Mechanical, Packaging, and Orderable

4 Device Comparison Table

REF30(1) REF30E (2) REF3012AIDBZR REF3012EAIDBZR 1.25V REF3016EAIDBZR 1.65V REF3018EAIDBZR 1.8V REF3020AIDBZR REF3020EAIDBZR 2.048V REF3025AIDBZR REF3025EAIDBZR 2.5V REF3030AIDBZR REF3030EAIDBZR 3V REF3033AIDBZR REF3033EAIDBZR 3.3V REF3040AIDBZR REF3040EAIDBZR 4.096V REF3045EAIDBZR 4.5V REF3050EAIDBZR 5.0V (1) This family is released to market. (2) Product preview. Contact local TI support for samples. Specification comparision PART NUMBER Initial Accuracy(%) Max Temperature Drift (ppm/°C) IQ (µA) 50 (0°C to 70°C) 15 (0°C to 70°C) REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 www.ti.com

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5 Pin Configuration and Functions

3 GND

Figure 5-1. DBZ Package 3-Pin SOT-23 Top View Table 5-1. Pin Functions PIN I/O DESCRIPTION NO. NAME

1 IN Input Input supply voltage

2 OUT Output Reference output voltage

3 GND — Ground

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage, IN to GND REF30xx 7 V REF30xxE 6 V Output short-circuit current(2) 70 mA Operating temperature -40 125 °C Junction temperature (TJ max) 150 °C Storage temperature range (Tstg) -65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability. (2) Short circuit to ground.

6.2 ESD Ratings

V(ESD) Electrostatic discharge (3) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±4000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1500 V(ESD) Electrostatic discharge (4) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. (3) Specification for REF30 (4) Specification for REF30E

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage(2) VOUT + 0.05(1) 5.5 V VIN Input voltage(3) VOUT + 0.2(1) 5.75 V ILOAD Load current(2) 25 mA ILOAD Load current(3) –10 10 mA TA Operating temperature –40 125 °C (1) For IL > 0mA, see respective electrical table. Minimum supply voltage for REF3012, REF3012E AND REF3016E is 1.8V . (2) Specification for REF30xx (3) Specification for REF30xxE REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 www.ti.com

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6.4 Thermal Information

THERMAL METRIC(1) REF30XX REF30XXE UNITDBZ (SOT-23) DBZ (SOT-23)

3 PINS 3 PINS

RθJA Junction-to-ambient thermal resistance 297.3 218.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 128.5 120.6 °C/W RθJB Junction-to-board thermal resistance 91.7 48.7 °C/W ΨJT Junction-to-top characterization parameter 12.8 14.5 °C/W ΨJB Junction-to-board characterization parameter 90.3 48.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the SPRA953 application report.

6.5 REF30E

at TA = 25°C, VIN = VOUT + 200mV, CIN = 0.1µF, COUT = 0.1µF and ILOAD = 0mA (unless otherwise noted) PARAMETER TEST CONDITION MIN TYP MAX UNIT REF3012E (1.25V)(1) VOUT Output Voltage 1.24875 1.25 1.25125 V Initial accuracy -0.1 0.1 % Output voltage noise ƒ = 0.1Hz to 10Hz 31.25 µVPP ƒ = 10Hz to 10kHz 30 µVrms Line regulation 1.8V ≤ VOUT ≤ 5.75V 31 125 µV/V REF3016E (1.65V)(1) VOUT Output Voltage 1.64835 1.65 1.65165 V Initial accuracy -0.1 0.1 % Output voltage noise ƒ = 0.1Hz to 10Hz 40 µVPP ƒ = 10Hz to 10kHz 42 µVrms Line regulation 1.8V ≤ VOUT ≤ 5.75V 41 165 µV/V REF3018E (1.8V) VOUT Output Voltage 1.7982 1.8 1.8018 V Initial accuracy -0.1 0.1 % Output voltage noise ƒ = 0.1Hz to 10Hz 45 µVPP ƒ = 10Hz to 10kHz 51 µVrms Line regulation VOUT+ 200mV ≤ VIN ≤ 5.75V 41 165 µV/V REF3020E (2.048V) VOUT Output Voltage 2.045952 2.048 2.050048 V Initial accuracy -0.1 0.1 % Output voltage noise ƒ = 0.1Hz to 10Hz 51.2 µVPP ƒ = 10Hz to 10kHz 51 µVrms Line regulation VOUT+ 200mV ≤ VIN ≤ 5.75V 51 205 µV/V REF3025E (2.5V) VOUT Output Voltage 2.4975 2.5 2.5025 V Initial accuracy -0.1 0.1 % Output voltage noise ƒ = 0.1Hz to 10Hz 62.5 µVPP ƒ = 10Hz to 10kHz 62 µVrms Line regulation VOUT+ 200mV ≤ VIN ≤ 5.75V 63 250 µV/V www.ti.com REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: REF30 REF30E

6.5 REF30E (continued)

at TA = 25°C, VIN = VOUT + 200mV, CIN = 0.1µF, COUT = 0.1µF and ILOAD = 0mA (unless otherwise noted) PARAMETER TEST CONDITION MIN TYP MAX UNIT REF3030E (3.0V) VOUT Output Voltage 2.997 3 3.003 V Initial accuracy -0.1 0.1 % Output voltage noise ƒ = 0.1Hz to 10Hz 75 µVPP ƒ = 10Hz to 10kHz 75 µVrms Line regulation VOUT+ 200mV ≤ VIN ≤ 5.75V 75 300 µV/V REF3033E (3.3V) VOUT Output Voltage 3.2967 3.3 3.3033 V Initial accuracy -0.1 0.1 % Output voltage noise ƒ = 0.1Hz to 10Hz 82.5 µVPP ƒ = 10Hz to 10kHz 82.5 µVrms Line regulation VOUT+ 200mV ≤ VIN ≤ 5.75V 83 330 µV/V REF3040E (4.096V) VOUT Output Voltage 4.091904 4.096 4.100096 V Initial accuracy -0.1 0.1 % Output voltage noise ƒ = 0.1Hz to 10Hz 102.4 µVPP Output voltage noise ƒ = 10Hz to 10kHz 102 µVrms Line regulation VOUT+ 200mV ≤ VIN ≤ 5.75V 102 470 µV/V REF3045E(4.5V) VOUT Output Voltage 4.4955 4.5 4.5045 V Initial accuracy -0.1 0.1 % Output voltage noise ƒ = 0.1Hz to 10Hz 112.5 µVPP ƒ = 10Hz to 10kHz 112 µVrms Line regulation VOUT+ 200mV ≤ VIN ≤ 5.75V 110 520 µV/V REF3050E (5.0V) VOUT Output Voltage 4.995 5 5.005 V Initial accuracy -0.1 0.1 % Output voltage noise ƒ = 0.1Hz to 10Hz 125 µVPP ƒ = 10Hz to 10kHz 125 µVrms Line regulation VREF + 200mV ≤ VIN ≤ 5.75V 125 1000 µV/V REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 www.ti.com

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at TA = 25°C, VIN = VOUT + 200mV, CIN = 0.1µF, COUT = 0.1µF and ILOAD = 0mA (unless otherwise noted) PARAMETER TEST CONDITION MIN TYP MAX UNIT REF30xxE dVOUT/dT Output voltage temperature drift for A grade(2) 0°C ≤ TA ≤ 70°C 7 15 ppm/°C–40°C ≤ TA ≤ 85°C 8 15 –40°C ≤ TA ≤ 125°C 10 20 Long Term stability 0000h to 1000h 40 ppm 1000h to 2000h 15 dVOUT/ dILOAD Load regulation Source(3) 0mA < ILOAD < 10mA, VIN = VOUT + 500mV(4) 3 15 ppm/mA Load regulation Sink(3) 0mA > ILOAD > - 10mA, VIN = VOUTF + 500mV(4) 3 15 ppm/mA dT Thermal hysteresis(6) 25 ppm VDO Dropout voltage(1) 20 200 mV ISC Short-circuit current REF3012E, REF3016E, REF3018E, REF3020E 20 mA ISC Short-circuit current REF3025E, REF3030E, REF3033E, REF3040E, REF3045E, REF3050E 40 mA Turnon settling time To 0.1% with CL = 1µF 2 ms POWER SUPPLY IQ Quiescent current TA = 25°C 25 µA –40°C ≤ TA ≤ 125°C 38 CAPACITIVE LOAD CIN Stable input capacitor range –40°C ≤ TA ≤ 125°C 0.1 µF CL Stable output capacitor range(5) –40°C ≤ TA ≤ 125°C 0.1 10 µF (1) The minimum supply voltage for the REF3012E and REF3016E is 1.8V. (2) Box method used to determine over temperature drift. (3) Typical value of load regulation reflects measurements using a force and sense contacts see Section 8.3.6 section. (4) Vin = 1.8V + 500mV for REF3016E (5) ESR for the capacitor can range from 10mΩ to 500mΩ. (6) Thermal hysteresis procedure explained in more detail in Section 8.3.2 section. www.ti.com REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: REF30 REF30E

6.6 REF30

at TA = 25°C, VIN = 5V, and ILOAD = 0mA (unless otherwise noted) PARAMETER TEST CONDITION MIN TYP MAX UNIT REF3012 (1.25V)(1) VOUT Output Voltage 1.2475 1.25 1.2525 V Initial accuracy 0.2 % Output voltage noise ƒ = 10Hz to 1kHz 14 µVPP ƒ = 10Hz to 10kHz 42 µVrms Line regulation 1.8V ≤ VIN ≤ 5.5V 60 190 µV/V REF3020 (2.048V) VOUT Output Voltage 2.044 2.048 2.052 V Initial accuracy 0.2 % Output voltage noise ƒ = 10Hz to 1kHz 23 µVPP ƒ = 10Hz to 10kHz 65 µVrms Line regulation VREF + 50mV ≤ VIN ≤ 5.5V 110 290 µV/V REF3025 (2.5V) VOUT Output Voltage 2.495 2.5 2.505 V Initial accuracy 0.2 % Output voltage noise ƒ = 10Hz to 1kHz 28 µVPP ƒ = 10Hz to 10kHz 80 µVrms Line regulation VREF + 50mV ≤ VIN ≤ 5.5V 120 325 µV/V REF3030 (3.0V) VOUT Output Voltage 2.994 3 3.06 V Initial accuracy 0.2 % Output voltage noise ƒ = 10Hz to 1kHz 33 µVPP ƒ = 10Hz to 10kHz 94 µVrms Line regulation VREF + 50mV ≤ VIN ≤ 5.5V 120 375 µV/V REF3033 (3.3V) VOUT Output Voltage 3.294 3.3 3.306 V Initial accuracy 0.2 % Output voltage noise ƒ = 10Hz to 1kHz 36 µVPP ƒ = 10Hz to 10kHz 105 µVrms Line regulation VREF + 50mV ≤ VIN ≤ 5.5V 130 400 µV/V REF3040 (4.096V) VOUT Output Voltage 4.088 4.096 4.104 V Initial accuracy 0.2 % Output voltage noise ƒ = 10Hz to 1kHz 45 µVPP ƒ = 10Hz to 10kHz 128 µVrms Line regulation VREF + 50mV ≤ VIN ≤ 5.5V 160 410 µV/V REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 www.ti.com

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6.6 REF30 (continued)

at TA = 25°C, VIN = 5V, and ILOAD = 0mA (unless otherwise noted) PARAMETER TEST CONDITION MIN TYP MAX UNIT REF30xx dVOUT/dT Output voltage temperature drift(2) 0°C ≤ TA ≤ 70°C 20 50 ppm/°C –30°C ≤ TA ≤ +85°C 28 60 –40°C ≤ TA ≤ +85°C 30 65 –40°C ≤ TA ≤ +125°C 35 75 dVOUT/ dILOAD Load regulation(3) 0mA < ILOAD < 25mA, VIN = VREF + 500mV(1) 3 100 ppm Thermal hysteresis(4) 25 100 ppm Long Term stability 0000h to 1000h 24 ppm 1000h to 2000h 15 VDO Dropout voltage 1 50 mV ISC Short-circuit current 45 mA Turnon settling time To 0.1% with CL = 1μF 120 µs POWER SUPPLY IQ Quiescent current TA = 25C 42 50 µA (1) The minimum supply voltage for the REF3012 is 1.8V. (2) Box method used to determine over temperature drift. (3) Typical value of load regulation reflects measurements using a force and sense contacts see Section 8.3.6 section. (4) Thermal hysteresis procedure explained in more detail in Section 8.3.2 section. www.ti.com REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: REF30 REF30E

6.7 Typical Characteristics REF30E

at TA = 25°C, VIN = 5V, and REF3025E used for typical characteristics (unless otherwise noted). All plots are preview and can change at the time of release to production. –40°C to +125°C Figure 6-1. Temperature Drift Histogram T e m p e r a t u r e (  C ) Output Voltage (V) - 4 0 - 7 2 6 5 9 9 2 1 2 5 2 . 4 7 5 2 . 4 8 5 2 . 4 9 5 2 . 5 0 5 2 . 5 1 5 2 . 5 2 5 Figure 6-2. Output Voltage vs Temperature T e m p e r a t u r e (  C ) Quiescent current (A) - 4 0 - 7 2 6 5 9 9 2 1 2 5 2 0 2 4 2 8 3 2 3 6 4 0 V I N = 1 . 8 V V I N = 5 . 5 V Figure 6-3. Quiescent Current vs Temperature VOUT = 1.25V T e m p e r a t u r e (  C ) Quiescent Current (A) - 4 0 - 7 2 6 5 9 9 2 1 2 5 2 0 2 4 2 8 3 2 3 6 4 0 V I N = 2 . 7 V V I N = 5 . 5 V Figure 6-4. Quiescent Current vs Temperature VOUT = 2.5V T e m p e r a t u r e (  C ) Quiescent Current (A) - 4 0 - 7 2 6 5 9 9 2 1 2 5 2 0 2 4 2 8 3 2 3 6 4 0 V I N = 2 . 7 V V I N = 5 . 5 V Figure 6-5. Quiescent Current vs Temperature VOUT = 3V T e m p e r a t u r e (  C ) Line Regulation (ppm/V) - 4 0 - 7 2 6 5 9 9 2 1 2 5 1 0 1 5 2 0 2 5 Figure 6-6. Line Regulation vs Temperature REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 www.ti.com

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6.7 Typical Characteristics REF30E (continued)

at TA = 25°C, VIN = 5V, and REF3025E used for typical characteristics (unless otherwise noted). All plots are preview and can change at the time of release to production. T e m p e r a t u r e (  C ) Dropout Voltage (mV) - 4 0 - 7 2 6 5 9 9 2 1 2 5 1 5 3 0 4 5 6 0 7 5 Figure 6-7. Dropout Voltage Vs Temperature www.ti.com REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: REF30 REF30E

6.8 Typical Characteristics REF30

at TA = 25°C, VIN = 5V, and REF3025 used for typical characteristics (unless otherwise noted) Number of Units 5 10 15 20 25 30 40 35 45 50 55 65 60 Drift (ppm/°C) 0°C to 70°C Figure 6-8. Temperature Drift 100 Number of Units 5 10 15 20 25 30 40 35 45 50 55 65 60 Drift (ppm/°C) –40°C to +125°C Figure 6-9. Temperature Drift 2.502 2.500 2.498 2.496 2.494 2.492 2.490 Output Voltage (V) /c4540 /c4520 0 20 60 40 80 100 120 140 Temperature (°C) Figure 6-10. Output Voltage vs Temperature Maximum Load Current (mA) /c4540 /c4520 0 20 60 40 80 100 120 140 Temperature (°C) Figure 6-11. Maximum Load Current vs Temperature Load Regulation ( V/mA) μ Temperature (°C) /c4540 /c4520 0 20 60 40 80 100 120 140 Figure 6-12. Load Regulation vs Temperature I ( A) μQ Temperature (°C) /c4540 /c4520 0 20 60 40 80 100 120 140 Figure 6-13. Quiescent Current vs Temperature REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 www.ti.com

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6.8 Typical Characteristics REF30 (continued)

at TA = 25°C, VIN = 5V, and REF3025 used for typical characteristics (unless otherwise noted) 200 150 100 /c4550 Line Regulation ( V/V) μ Temperature (°C) /c4540 /c4520 0 20 60 40 80 100 120 140 Figure 6-14. Line Regulation vs Temperature 100 0.1 0.01 Output Impedance (dB) 1 10 100 1k 10k 100k Frequency (Hz) Figure 6-15. Output Impedance vs Frequency PSRR (dB) 1 10 100 1k 10k 100k Frequency (Hz) Figure 6-16. Power-Supply Rejection Ratio vs Frequency 2.500010 2.500000 2.499990 2.499980 2.499970 2.499960 2.499950 2.499940 2.499930 2.499920 Output Voltage (V) 2.5 3 3.5 4 4.5 5 5.5 6 Supply (V) No Load Figure 6-17. Output Voltage vs Supply Voltage 2.500200 2.500100 2.500000 2.499900 2.499800 2.499700 2.499600 2.499500 2.499400 2.499300 Output Voltage (V) 2.5 3 3.5 4 4.5 5 5.5 6 Supply (V) ILOAD = 25mA Figure 6-18. Output Voltage vs Supply Voltage 2.500010 2.500000 2.499990 2.499980 2.499970 2.499960 2.499950 2.499940 2.499930 Output Voltage (V) 0 5 10 15 20 25 30 Load Current (mA) Figure 6-19. Output Voltage vs Load Current www.ti.com REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: REF30 REF30E

at TA = 25°C, VIN = 5V, and REF3025 used for typical characteristics (unless otherwise noted) 40 /c109s/div VIN VOUT

3 V/div

1 V/div

CL = 0, 3V Startup Figure 6-20. Step Response 10 s/div/c109 VIN

5 V/div

CL = 0, 5V startup Figure 6-21. Step Response 10 /c109s/div 500 mV/div 50 mV/div VIN VOUT Figure 6-22. Line Transient Response 10 /c109s/div 20 mV/div I = 1 mAL VOUT I = 0 mAL CL = 0 Figure 6-23. 0mA to 1mA Load Transient 10 /c109s/div 20 mV/div I = 5 mAL VOUT I = 0 mAL CL = 0 Figure 6-24. 0mA to 5mA Load Transient 40 /c109s/div 20 mV/div VOUT I = 0 mAL I = 6 mAL CL = 1μF Figure 6-25. 1mA to 6mA Load Transient REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 www.ti.com

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at TA = 25°C, VIN = 5V, and REF3025 used for typical characteristics (unless otherwise noted) 100 s/div/c109 20 mV/div VOUT I = 1 mAL I = 25 mAL CL = 1μF Figure 6-26. 1mA to 25mA Load Transient /c109V/div 1.0 s/div Figure 6-27. 0.1Hz to 10Hz Noise Absolute Output Voltage Drift (ppm) 0 100 200 300 400 500 600 700 800 900 1000 Time (hours) Figure 6-28. Long-Term Stability: 0 to 1000 Hours Absolute Output Voltage Drift (ppm) 1200 1300 1600 1800 1900 2000 Time (hours) 1000 1100 1400 1500 1700 Figure 6-29. Long-Term Stability: 1000 to 2000 Hours Absolute Output Voltage Drift (ppm) 0 200 400 600 800 1000 1200 1400 1600 1800 2000 Time (hours) Figure 6-30. Long-Term Stability: 0 to 2000 Hours www.ti.com REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: REF30 REF30E

7 Detailed Description

7.1 Overview

The REF30 is a series, precision bandgap voltage reference. The basic topology is shown in the Section 7.2. Transistors Q1 and Q 2 are biased so that the current density of Q 1 is greater than that of Q 2. The difference of the two base-emitter voltages, Vbe 1 – Vbe2, has a positive temperature coefficient and is forced across resistor R1. This voltage is gained up and added to the base-emitter voltage of Q 2, which has a negative coefficient. The resulting output voltage is virtually independent of temperature. The curvature of the bandgap voltage, as shown in Figure 6-10, is due to the slightly nonlinear temperature coefficient of the base-emitter voltage of Q2.

7.2 Functional Block Diagram

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7.3 Feature Description

7.3.1 Supply Voltage

The REF30 family of references features an extremely low dropout voltage. With the exception of the REF3012, which has a minimum supply requirement of 1.8V, the REF30 can be operated with a supply of only 1mV above the output voltage in an unloaded condition. For loaded conditions, a typical dropout voltage versus load is shown on the front page. The REF30 features a low quiescent current that is extremely stable over changes in both temperature and supply. The typical room temperature quiescent current is 42 μA, and the maximum quiescent current over temperature is just 59 μA. Additionally, the quiescent current typically changes less than 2.5 μA over the entire supply range, as shown in Figure 7-1. Supply voltages below the specified levels can cause the REF30 to momentarily draw currents greater than the typical quiescent current. Use a power supply with a fast rising edge and low output impedance to easily prevent this issue. 42.5 42.0 41.5 41.0 40.5 40.0 I ( A) μQ V (V)IN Figure 7-1. Supply Current vs Supply Voltage REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 www.ti.com

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7.3.2 Thermal Hysteresis

Thermal hysteresis for the REF30 is defined as the change in output voltage after operating the device at 25°C, cycling the device through the specified temperature range, and returning to 25°C, and can be expressed as shown in Equation 1: PRE POST 6 HYST NOM abs V VV = • 10 (ppm) V /c230 /c246 /c45 /c231 /c247 /c231 /c247 /c232 /c248 (1) where

• VHYST = Calculated hysteresis
• VPRE = Output voltage measured at 25°C pretemperature cycling
• VPOST = Output voltage measured when device has been operated at 25°C, cycled through specified range of –40°C to +125°C, and returned to operation at 25°C.

7.3.3 Temperature Drift

The REF30 exhibits minimal drift error, defined as the change in output voltage over varying temperature. Using the box method of drift measurement, the REF30 features a typical drift coefficient of 20ppm from 0°C to 70°C, the primary temperature range of use for many applications. For industrial temperature ranges of –40°C to +125°C, the REF30 family drift increases to a typical value of 50ppm.

7.3.4 Noise Performance

The REF30 generates noise less than 50 μVPP between frequencies of 0.1Hz to 10Hz, and can be seen in Figure 6-27 The noise voltage of the REF30 increases with output voltage and operating temperature. Additional filtering can be used to improve output noise levels; however, make sure the output impedance does not degrade AC performance.

7.3.5 Long-Term Stability

Long-term stability refers to the change of the output voltage of a reference over a period of months or years. This effect lessens as time progresses as is apparent by the long-term stability curves. The typical drift value for the REF30 is 24ppm from 0 hours to 1000 hours, and 15ppm from 1000 hours to 2000 hours. This parameter is characterized by measuring 30 units at regular intervals for a period of 2000 hours.

7.3.6 Load Regulation

Load regulation is defined as the change in output voltage as a result of changes in load current. Use a 4 wire measurement (kelvin measurement) methodology for accurate load regulation measurement as shown in Figure 7-2. The force and sense lines tied to the contact area of the output pin reduce the impact of contact and trace resistance, resulting in accurate measurement of the load regulation contributed solely by the REF30xx. Output Pin Meter VOUT Sense Line Force Line Load IL Contact and Trace Resistance Copyright © 2016, Texas Instruments Incorporated Figure 7-2. Accurate Load Regulation of REF30 www.ti.com REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: REF30 REF30E

7.4 Device Functional Modes

7.4.1 Negative Reference Voltage

For applications requiring a negative and positive reference voltage, the OPA703 and REF30 can be used to provide a dual-supply reference from a ±5V supply. Figure 7-3 shows the REF3025 used to provide a ±2.5V supply reference voltage. The low offset voltage and low drift of the OPA703 complement the low drift performance of the REF30 to provide an accurate resolution for split-supply applications. OP A703 REF3025 +5 V /c45 5 V +5V 10 k/c87 10 k/c87 +2.5 V /c45 2.5 V Copyright © 2016, Texas Instruments Incorporated Figure 7-3. REF3025 Combined With OPA703 to Create Positive and Negative Reference Voltages. REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 www.ti.com

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Product Folder Links: REF30 REF30E

7.4.2 Data Acquisition

Often data acquisition systems require stable voltage references to maintain necessary accuracy. The REF30 family features stability and a wide range of voltages designed for most microcontrollers and data converters. Figure 7-4 and Figure 7-5 show two basic data acquisition systems. 5 Ω ADS7822 VCC CS DOUT DCLOCK VREF +In – In GND 3.3 V V IN VS Microcontroller REF3033 GND Copyright © 2016, Texas Instruments Incorporated Figure 7-4. Basic Data Acquisition System 1 ADS8324 VCC CS DOUT DCLOCK VREF +In –In GND 5 Ω 0.1 Fμ 0 V to 1.25 V Microcontroller 2.5-V Supply REF3012 GND VIN VOUT 2.5 V

1.25 V VS

Copyright © 2016, Texas Instruments Incorporated Figure 7-5. Basic Data Acquisition System 2 www.ti.com REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: REF30 REF30E

8 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

8.1 Application Information

For normal operation, the REF30 does not require a capacitor on the output. If a capacitive load is connected, take special care when using low equivalent series resistance (ESR) capacitors and high capacitance. This precaution is especially true for low-output voltage devices; therefore, for the REF3012 use a low-ESR capacitance of 10 μF or less. Figure 8-1 shows the typical connections required for operation of the REF30. A supply bypass capacitor of 0.1μF is always recommended. VOUT VIN 1 0.1μF REF30 Figure 8-1. Typical Connections for Operating REF30

8.2 Typical Application

Figure 8-2 shows a low-power reference and conditioning circuit. This circuit attenuates and level-shifts a bipolar input voltage within the proper input range of a single-supply low power 16-Bit ΔΣ ADC, such as the one inside the MSP430 or other similar single-supply ADCs. Precision reference circuits are used to level-shift the input signal, provide the ADC reference voltage and to create a well-regulated supply voltage for the low-power analog circuitry. A low-power, zero-drift, op-amp circuit is used to attenuate and level-shift the input signal. IN OUT REF3012 IN OUT REF30303.3 V 1.25 V 20 k

3.0 V VOUT

3.0 V 1.25 V 3.3 V IN+ IN± SD_16VREF J1.2/A1+ J1.3/A1± J1.5/VREF 0.625 V 47 µF 47 k 47 k VIN ±5 V A-ADC 3.0 V MSP430F2013 Launchpad 100 k Copyright © 2016, Texas Instruments Incorporated Figure 8-2. Low-Power Reference and Bipolar Voltage Conditioning Circuit for Low-Power ADCs REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 www.ti.com

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Product Folder Links: REF30 REF30E

8.2.1 Design Requirements

• Supply Voltage: 3.3V
• Maximum Input Voltage: ±6V
• Specified Input Voltage: ±5V
• ADC Reference Voltage: 1.25V The goal for this design is to accurately condition a ±5V bipolar input voltage into a voltage that works for conversion by a low-voltage ADC with a 1.25V reference voltage, V REF, and an input voltage range of V REF/2. The circuit can function with reduced performance over a wider input range of at least ±6V to allow for easier protection of overvoltage conditions.

8.2.2 Detailed Design Procedure

Figure 8-2 depicts a simplified schematic for this design showing the MSP430 ADC inputs and full input conditioning circuitry. The ADC is configured for a bipolar measurement where final conversion result is the differential voltage between the voltage at the positive and negative ADC inputs. The bipolar, GND-referenced input signal must be level-shifted and attenuated by the op amp so that the output is biased to VREF/2 and has a differential voltage that is within the ±VREF/2 input range of the ADC.

8.2.3 Application Curves

0.25 0.5 0.75 1.25 ±6 ±5 ±4 ±3 ±2 ±1 0 1 2 3 4 5 6 Output Voltage (V) Input Voltage (V) C001 Figure 8-3. OPA317 Output Voltage vs Input Voltage -0.00035 -0.0003 -0.00025 -0.0002 -0.00015 -0.0001 ±6 ±5 ±4 ±3 ±2 ±1 0 1 2 3 4 5 6 Error Voltage (V) Input Voltage (V) C00 Figure 8-4. OPA317 Output Voltage Error vs Input Voltage ±200 ±150 ±100 ±50 100 150 ±6 ±5 ±4 ±3 ±2 ±1 0 1 2 3 4 5 6 Output Code Error (# of codes) Input Voltage (V) C003 Figure 8-5. Output Code Error vs Input Voltage www.ti.com REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: REF30 REF30E

8.3 Power Supply Recommendations

The REF30 family of references feature an extremely low-dropout voltage. These references can be operated with a supply of only 50mV above the output voltage. For loaded reference conditions, a typical dropout voltage versus load is shown in the front page plot, Dropout Voltage vs Load Current . Use a supply bypass capacitor greater than 0.47µF.

8.4 Layout

8.4.1 Layout Guidelines

Figure 8-6 illustrates an example of a printed-circuit board (PCB) layout using the REF30. Some key considerations are:

• Connect low-ESR, 0.1μF ceramic bypass capacitors at VIN of the REF30.
• Decouple other active devices in the system per the device specifications.
• Use a solid ground plane to help distribute heat and reduces electromagnetic interference (EMI) noise pickup.
• Place the external components as close to the device as possible. This configuration prevents parasitic errors (such as the Seebeck effect) from occurring.
• Minimize trace length between the reference and bias connections to the INA and ADC to reduce noise pickup.
• Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when absolutely necessary.

8.4.2 Layout Example

Figure 8-6. Layout Example REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 www.ti.com

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Product Folder Links: REF30 REF30E

9 Device and Documentation Support

9.1 Documentation Support

9.1.1 Related Documentation

CMOS, Rail-to-Rail, I/O Operational Amplifiers (SBOS180) REF29xx 100ppm/°C, 50μA in 3-Pin SOT-23 CMOS Voltage Reference (SBVS033)

9.2 Related Links

Table 9-1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 9-1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY REF3012 Click here Click here Click here Click here Click here REF3020 Click here Click here Click here Click here Click here REF3025 Click here Click here Click here Click here Click here REF3030 Click here Click here Click here Click here Click here REF3033 Click here Click here Click here Click here Click here REF3040 Click here Click here Click here Click here Click here

9.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

9.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

9.5 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

9.7 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions. www.ti.com REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: REF30 REF30E

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision I (July 2022) to Revision J (July 2025) Page Changes from Revision H (February 2018) to Revision I (July 2022) Page Changes from Revision G (November 2015) to Revision H (February 2018) Page Changes from Revision F (August 2008) to Revision G (November 2015) Page

• Added Device Information, ESD Ratings, Recommended Operating Conditions, and Thermal Information
• Added Detailed Description, Applications and Implementation, Power-Supply Recommendations, Layout,

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. REF30, REF30E SBVS032J – MARCH 2002 – REVISED JULY 2025 www.ti.com

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Product Folder Links: REF30 REF30E

www.ti.com 8-Aug-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) PREF3025EAIDBZR Active Preproduction SOT-23 (DBZ) | 3 3000 | LARGE T&R - Call TI Call TI -40 to 125 PREF3030EAIDBZR Active Preproduction SOT-23 (DBZ) | 3 3000 | LARGE T&R - Call TI Call TI -40 to 125 REF3012AIDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30A REF3012AIDBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30A REF3012AIDBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30A REF3012AIDBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30A REF3020AIDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30B REF3020AIDBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30B REF3020AIDBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30B REF3020AIDBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30B REF3025AIDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30C REF3025AIDBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30C REF3025AIDBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30C REF3025AIDBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30C REF3030AIDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30F REF3030AIDBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30F REF3030AIDBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30F REF3030AIDBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30F REF3033AIDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30D REF3033AIDBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30D REF3033AIDBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30D REF3033AIDBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30D REF3040AIDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30E REF3040AIDBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30E REF3040AIDBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30E REF3040AIDBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R30E (1) Status: For more details on status, see our product life cycle. Addendum-Page 1

www.ti.com 8-Aug-2025 (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 25-Jul-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 25-Jul-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REF3012AIDBZR SOT-23 DBZ 3 3000 200.0 183.0 25.0 REF3012AIDBZT SOT-23 DBZ 3 250 200.0 183.0 25.0 REF3020AIDBZR SOT-23 DBZ 3 3000 200.0 183.0 25.0 REF3020AIDBZT SOT-23 DBZ 3 250 200.0 183.0 25.0 REF3025AIDBZR SOT-23 DBZ 3 3000 200.0 183.0 25.0 REF3025AIDBZT SOT-23 DBZ 3 250 200.0 183.0 25.0 REF3030AIDBZR SOT-23 DBZ 3 3000 200.0 183.0 25.0 REF3030AIDBZT SOT-23 DBZ 3 250 200.0 183.0 25.0 REF3033AIDBZR SOT-23 DBZ 3 3000 200.0 183.0 25.0 REF3033AIDBZT SOT-23 DBZ 3 250 200.0 183.0 25.0 REF3040AIDBZR SOT-23 DBZ 3 3000 200.0 183.0 25.0 REF3040AIDBZT SOT-23 DBZ 3 250 200.0 183.0 25.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 0.20

0.08 TYP

0.25 2.64 2.10

1.12 MAX

0.10

0.01 TYP

3X 0.5 0.3 0.6

0.2 TYP

1.9 0.95 0 -8 TYP 4X 0 -15 4X 4 -15 A 3.04 2.80 B1.4 1.2 (0.95) (0.15) (0.125) SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. 4. Support pin may differ or may not be present. 5. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25mm per side

0.2 C A B

0.1 C SCALE 4.000

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

3X (1.3) 3X (0.6) (2.1) 2X (0.95) (R0.05) TYP 4214838/F 08/2024 SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE SCALE:15X PKG SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS

www.ti.com EXAMPLE STENCIL DESIGN (2.1) 2X(0.95) 3X (1.3) 3X (0.6) (R0.05) TYP SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X SYMM PKG

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