REF3012 TI1 | Alldatasheet
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Dropout Voltage (mV) 0 5 10 15 20 25 30 Load Current (mA) 5 Ω ADS7822 VCC CS DOUT DCLOCK VREF +In – In GND
1 F to 10 Fμ μ
1 F to μ
10 F μ
3.3 V
0.1 F μ
V IN VS Microcontroller REF3033 GND Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community Reference Design REF3012,REF3020,REF3025,REF3030,REF3033,REF3040 SBVS032G –MARCH 2002–REVISED NOVEMBER 2015 REF30xx50-ppm/°CMax,50-μA,CMOSVoltageReferenceinSOT-23-3
1 Features 3 Description
The REF30xx is a precision, low-power, low dropout 1• microSize Package: SOT-23-3 voltage, reference family available in a tiny SOT-23-3• Low Dropout: 1 mV package. The REF30xx offers excellent temperature
- High Output Current: 25 mA drift and initial accuracy while operating at a quiescent current of 42 µA (typ).• High Accuracy: 0.2%
- Low IQ: 42 µA (typ) The low power consumption and the relatively high precision make the REF30xx very attractive for loop-• Excellent Specified Drift Performance: powered industrial applications such as pressure and– 50 ppm/°C (max) from 0°C to 70°C temperature transmitter applications. The REF30xx is – 75 ppm/°C (max) from –40°C to +125°C easy to use in intrinsically safe and explosion-proof applications because it does not require a load 2 Applications capacitor to be stable. The REF30xx is specified over the extended industrial temperature range of –40°C• Temperature and Pressure Transmitters to +125°C.
- Portable, Battery-powered Equipment The REF30xx operates with supplies within 1 mV of• Data Acquisition Systems output voltage under zero-load conditions. The low
- Medical Equipment dropout along with small size and low power consumption make The REF30xx ideal for portable• Handheld Test Equipment and battery-powered applications. Device Information PART NUMBER PACKAGE BODY SIZE (NOM) REF30xx SOT-23 (3) 2.92 mm × 1.30 mm Typical Application Dropout Voltage vs Load Current An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
REF3012,REF3020,REF3025,REF3030,REF3033,REF3040 SBVS032G –MARCH 2002–REVISED NOVEMBER 2015 www.ti.com Table of Contents
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision F (August 2008) to Revision G Page
- Added Detailed Description, Applications and Implementation, Power-Supply Recommendations, Layout, Device
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Product Folder Links: REF3012 REF3020 REF3025 REF3030 REF3033 REF3040
3 GND
REF3012,REF3020,REF3025,REF3030,REF3033,REF3040 www.ti.com SBVS032G –MARCH 2002–REVISED NOVEMBER 2015
5 Device Comparison Table
PART NUMBER VOLTAGE (V) REF3012 1.25 REF3020 2.048 REF3025 2.5 REF3030 3.0 REF3033 3.3 REF3040 4.096
6 Pin Configuration and Functions
NO. NAME
1 IN Input Input supply voltage
2 OUT Output Reference output voltage
3 GND — Ground
Copyright © 2002–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: REF3012 REF3020 REF3025 REF3030 REF3033 REF3040
REF3012,REF3020,REF3025,REF3030,REF3033,REF3040 SBVS032G –MARCH 2002–REVISED NOVEMBER 2015 www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage, V+ to V– 7.0 V Output short-circuit current(2) Continuous Operating temperature –40 125 °C Junction temperature 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Short circuit to ground.
7.2 ESD Ratings
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
at TA = 25°C, VIN = 5 V, and ILOAD = 0 mA (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage VREF + 0.05(1) 5.5 V ILOAD Load current 25 mA TA Operating temperature –40 125 °C (1) For IL > 0, see Typical Characteristics. Minimum supply voltage for REF3012 is 1.8 V .
7.4 Thermal Information
THERMAL METRIC(1) DBZ (SOT-23) UNIT
3 PINS
RθJA Junction-to-ambient thermal resistance 297.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 128.5 °C/W RθJB Junction-to-board thermal resistance 91.7 °C/W ψJT Junction-to-top characterization parameter 12.8 °C/W ψJB Junction-to-board characterization parameter 90.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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Product Folder Links: REF3012 REF3020 REF3025 REF3030 REF3033 REF3040
REF3012,REF3020,REF3025,REF3030,REF3033,REF3040 www.ti.com SBVS032G –MARCH 2002–REVISED NOVEMBER 2015
7.5 Electrical Characteristics
at TA = 25°C, VIN = 5 V, and ILOAD = 0 mA (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOUT Output voltage 1.2475 1.25 1.2525 V Initial accuracy 0.2% f = 0.1 Hz to 10 Hz 14 μVPP Output voltage noise f = 10 Hz to 10 kHz 42 µVrms Line regulation 1.8 V ≤ VIN ≤ 5.5 V 60 190 µV/V REF3020 (2.048 V) VOUT Output voltage 2.044 2.048 2.052 V Initial accuracy 0.2% f = 0.1 Hz to 10 Hz 23 μVPP Output voltage noise f = 10 Hz to 10 kHz 65 µVrms Line regulation VREF + 50 mV ≤ VIN ≤ 5.5 V 110 290 µV/V REF3025 (2.5 V) VOUT Output voltage 2.495 2.50 2.505 V Initial accuracy 0.2% f = 0.1 Hz to 10 Hz 28 μVPP Output voltage noise f = 10 Hz to 10 kHz 80 µVrms Line regulation VREF + 50 mV ≤ VIN ≤ 5.5 V 120 325 µV/V REF3030 (3.0 V) VOUT Output voltage 2.994 3.0 3.006 V Initial accuracy 0.2% f = 0.1 Hz to 10 Hz 33 μVPP Output voltage noise f = 10 Hz to 10 kHz 94 µVrms Line regulation VREF + 50 mV ≤ VIN ≤ 5.5 V 120 375 µV/V REF3033 (3.3 V) VOUT Output voltage 3.294 3.30 3.306 V Initial accuracy 0.2% f = 0.1 Hz to 10 Hz 36 μVPP Output voltage noise f = 10 Hz to 10 kHz 105 µVrms Line regulation VREF + 50 mV ≤ VIN ≤ 5.5 V 130 400 µV/V REF3040 (4.096 V) VOUT Output voltage 4.088 4.096 4.104 V Initial accuracy 0.2% f = 0.1 Hz to 10 Hz 45 μVPP Output voltage noise f = 10 Hz to 10 kHz 128 µVrms Line regulation VREF + 50 mV ≤ VIN ≤ 5.5 V 160 410 µV/V (1) The minimum supply voltage for the REF3012 is 1.8 V. Copyright © 2002–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: REF3012 REF3020 REF3025 REF3030 REF3033 REF3040
REF3012,REF3020,REF3025,REF3030,REF3033,REF3040 SBVS032G –MARCH 2002–REVISED NOVEMBER 2015 www.ti.com Electrical Characteristics (continued) at TA = 25°C, VIN = 5 V, and ILOAD = 0 mA (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT REF33xx (REF3312, REF3318, REF3320, REF3325, REF3330, REF3333) 0°C ≤ TA ≤ 70°C 20 50 –30°C ≤ TA ≤ +85°C 28 60 dVOUT/dT Output voltage temperature drift(2) ppm/°C –40°C ≤ TA ≤ +85°C 30 65 –40°C ≤ TA ≤ +125°C 35 75 0000h to 1000h 24 Long-term stability ppm 1000h to 2000h 15 0 mA < ILOAD < 25 mA, VIN = VREF +ΔVO(ΔIL) Load regulation(3) µV/mA500 mV(1) dT Thermal hysteresis(4) 25 100 ppm VIN – VOUT Dropout voltage 1 50 mV ISC Short-circuit current 45 mA Turn-on settling time To 0.1% with CL = 1 μF ms POWER SUPPLY 42 50 IQ Quiescent current μA (2) Box method used to determine over temperature drift. (3) Typical value of load regulation reflects measurements using a force and sense contacts; see Load Regulation section. (4) Thermal hysteresis procedure explained in more detail in Thermal Hysteresis section.
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Product Folder Links: REF3012 REF3020 REF3025 REF3030 REF3033 REF3040
7.6 Typical Characteristics
Figure 1. Temperature Drift Figure 2. Temperature Drift Figure 3. Output Voltage vs Temperature Figure 4. Maximum Load Current vs Temperature Figure 5. Load Regulation vs Temperature Figure 6. Quiescent Current vs Temperature
Figure 8. Output Impedance vs FrequencyFigure 7. Line Regulation vs Temperature Figure 9. Power-Supply Rejection Ratio vs Frequency Figure 10. Output Voltage vs Supply Voltage Figure 11. Output Voltage vs Supply Voltage Figure 12. Output Voltage vs Load Current
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3 V/div
1 V/div
5 V/div
Figure 13. Step Response Figure 14. Step Response Figure 16. 0-mA to 1-mA Load TransientFigure 15. Line Transient Response Figure 17. 0-mA to 5-mA Load Transient Figure 18. 1-mA to 6-mA Load Transient
Figure 20. 0.1-Hz to 10-Hz NoiseFigure 19. 1-mA to 25-mA Load Transient Figure 21. Long-Term Stability: 0 to 1000 Hours Figure 22. Long-Term Stability: 1000 to 2000 Hours Figure 23. Long-Term Stability: 0 to 2000 Hours
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8 Detailed Description
8.1 Overview
the base-emitter voltage of Q2.
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Supply Voltage
versus load is shown on the front page. supply range, as shown in Figure 24. Figure 24. Supply Current vs Supply Voltage
8.3.2 Thermal Hysteresis
- VHYST = Calculated hysteresis
- VPRE = Output voltage measured at 25°C pretemperature cycling
- VPOST = Output voltage measured when device has been operated at 25°C, cycled through specified range of –40°C to +125°C, and returned to operation at 25°C. (1)
8.3.3 Temperature Drift
The REF30xx exhibits minimal drift error, defined as the change in output voltage over varying temperature. to +125°C, the REF30xx family drift increases to a typical value of 50 ppm.
8.3.4 Noise Performance
8.3.5 Long-Term Stability
Long-term stability refers to the change of the output voltage of a reference over a period of months or years. is characterized by measuring 30 units at regular intervals for a period of 2000 hours.
8.3.6 Load Regulation
regulation, use force and sense lines. Figure 25. Accurate Load Regulation of REF30xx
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8.4 Device Functional Modes
8.4.1 Negative Reference Voltage
performance of the REF30xx to provide an accurate solution for split-supply applications. Figure 26. REF3025 Combined With OPA703 to Create Positive and Negative Reference Voltages.
8.4.2 Data Acquisition
family features stability and a wide range of voltages suitable for most microcontrollers and data converters. Figure 27 and Figure 28 show two basic data acquisition systems. Figure 27. Basic Data Acquisition System 1
1.25 V VS
Figure 28. Basic Data Acquisition System 2
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3.0 V VOUT
0.47 F/c109
9 Application and Implementation
9.1 Application Information
supply bypass capacitor of 0.47 μF is always recommended. Figure 29. Typical Connections for Operating REF30xx
9.2 Typical Application
circuitry. A low-power, zero-drift, op-amp circuit is used to attenuate and level-shift the input signal. Figure 30. Low-Power Reference and Bipolar Voltage Conditioning Circuit for Low-Power ADCs
9.2.1 Design Requirements
- Supply Voltage: 3.3 V
- Maximum Input Voltage: ±6 V
- Specified Input Voltage: ±5 V
- ADC Reference Voltage: 1.25 V The goal for this design is to accurately condition a ±5-V bipolar input voltage into a voltage suitable for conversion by a low-voltage ADC with a 1.25-V reference voltage, VREF, and an input voltage range of VREF / 2. The circuit should function with reduced performance over a wider input range of at least ±6 V to allow for easier protection of overvoltage conditions.
9.2.2 Detailed Design Procedure
a differential voltage that is within the ±VREF / 2 input range of the ADC.
9.2.3 Application Curves
Figure 31. OPA317 Output Voltage vs Input Voltage Figure 32. OPA317 Output Voltage Error vs Input Voltage Figure 33. Output Code Error vs Input Voltage
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10 Power Supply Recommendations
11 Layout
11.1 Layout Guidelines
- Connect low-ESR, 0.1-μF ceramic bypass capacitors at VIN of the REF30xx
- Decouple other active devices in the system per the device specifications
- Use a solid ground plane to help distribute heat and reduces electromagnetic interference (EMI) noise pickup
- Place the external components as close to the device as possible. This configuration prevents parasitic errors (such as the Seebeck effect) from occurring
- Minimize trace length between the reference and bias connections to the INA and ADC to reduce noise pickup
- Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when absolutely necessary
11.2 Layout Example
Figure 34. Layout Example
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
12.2 Related Links
tools and software, and quick access to sample or buy. Table 1. Related Links
12.3 Community Resources
solve problems with fellow engineers. contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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www.ti.com 16-Dec-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples REF3012AIDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30A REF3012AIDBZRG4 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30A REF3012AIDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30A REF3012AIDBZTG4 ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30A REF3020AIDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30B REF3020AIDBZRG4 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30B REF3020AIDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30B REF3020AIDBZTG4 ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30B REF3025AIDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30C REF3025AIDBZRG4 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30C REF3025AIDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30C REF3025AIDBZTG4 ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30C REF3030AIDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30F REF3030AIDBZRG4 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30F REF3030AIDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30F REF3030AIDBZTG4 ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30F REF3033AIDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30D
www.ti.com 16-Dec-2015 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples REF3033AIDBZRG4 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30D REF3033AIDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30D REF3033AIDBZTG4 ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30D REF3040AIDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30E REF3040AIDBZRG4 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30E REF3040AIDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30E REF3040AIDBZTG4 ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 R30E (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
www.ti.com 16-Dec-2015 Addendum-Page 3 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF REF3033 :
- Automotive: REF3033-Q1 NOTE: Qualified Version Definitions:
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 17-Dec-2015 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REF3012AIDBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 REF3012AIDBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 REF3020AIDBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 REF3020AIDBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 REF3025AIDBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 REF3025AIDBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 REF3030AIDBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 REF3030AIDBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 REF3033AIDBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 REF3033AIDBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 REF3040AIDBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 REF3040AIDBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 17-Dec-2015 Pack Materials-Page 2
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