REF2912 TI | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 27
Technical content
Dropout Voltage (mV) 0 5 10 15 20 25 30 Load Current (mA) Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community Reference Design An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. REF2912,REF2920,REF2925 REF2930,REF2933,REF2940 SBVS033C –JUNE 2002–REVISED JUNE 2016 REF29xx100ppm/°C,50µAin3-PinSOT-23CMOSVoltageReference
1 Features
1• MicroSIZE Package: SOT-23
- Low Dropout: 1 mV
- High Output Current: 25 mA
- Low Temperature Drift: Maximum of 100 ppm/°C
- High Accuracy: 2%
- Low IQ: Maximum of 50 µA
2 Applications
- Portable, Battery-Powered Equipment
- Data Acquisition Systems
- Medical Equipment
- Hand-Held Test Equipment
3 Description
The REF29xx is a precision, low-power, low-voltage dropout voltage reference family available in a tiny 3‑pin SOT-23 package. The small size and low power consumption (50 µA maximum) of the REF29xx make it ideal for portable and battery-powered applications. The REF29xx does not require a load capacitor, but it is stable with any capacitive load. Unloaded, the REF29xx can be operated with supplies within 1 mV of output voltage. All models are specified for the wide temperature range, –40°C to 125°C. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) REF29xx SOT-23 (3) 2.92 mm × 1.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Dropout Voltage vs Load Current
REF2912,REF2920,REF2925 REF2930,REF2933,REF2940 SBVS033C –JUNE 2002–REVISED JUNE 2016 www.ti.com Product Folder Links: REF2912 REF2920 REF2925 REF2930 REF2933 REF2940 Submit Documentation Feedback Copyright © 2002–2016, Texas Instruments Incorporated Table of Contents
12.2 Receiving Notification of Documentation Updates 19
13 Mechanical, Packaging, and Orderable
4 Revision History
Changes from Revision B (February 2008) to Revision C Page
- Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
REF2912,REF2920,REF2925 REF2930,REF2933,REF2940 www.ti.com SBVS033C –JUNE 2002–REVISED JUNE 2016 Product Folder Links: REF2912 REF2920 REF2925 REF2930 REF2933 REF2940 Submit Documentation FeedbackCopyright © 2002–2016, Texas Instruments Incorporated
5 Device Comparison Table
PRODUCT VOLTAGE (V) REF2912 1.25 REF2920 2.048 REF2925 2.5 REF2930 3 REF2933 3.3 REF2940 4.096
6 Pin Configuration and Functions
NO. NAME
1 IN I Input supply voltage
2 OUT O Reference output voltage
3 GND — Ground
REF2912,REF2920,REF2925 REF2930,REF2933,REF2940 SBVS033C –JUNE 2002–REVISED JUNE 2016 www.ti.com Product Folder Links: REF2912 REF2920 REF2925 REF2930 REF2933 REF2940 Submit Documentation Feedback Copyright © 2002–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Short-circuit to ground.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage, V+ to V– 7 V Output short circuit(2) Continuous °C Lead temperature (soldering, 10 s) 300 °C Operating temperature –40 125 °C Junction temperature 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 (1) Minimum supply voltage for the REF2912 is 1.8 V.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input voltage VREF + 0.05(1) 5.5 V ILOAD Load current 25 mA TA Operating temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
7.4 Thermal Information
THERMAL METRIC(1) REF29xx UNITDBZ (SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 297.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 128.5 °C/W RθJB Junction-to-board thermal resistance 91.7 °C/W ψJT Junction-to-top characterization parameter 12.8 °C/W ψJB Junction-to-board characterization parameter 90.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
REF2912,REF2920,REF2925 REF2930,REF2933,REF2940 www.ti.com SBVS033C –JUNE 2002–REVISED JUNE 2016 Product Folder Links: REF2912 REF2920 REF2925 REF2930 REF2933 REF2940 Submit Documentation FeedbackCopyright © 2002–2016, Texas Instruments Incorporated (1) Box Method used to determine overtemperature drift. (2) Typical value of load regulation reflects measurements using a force and sense contacts, see Load Regulation. (3) Minimum supply voltage for REF2912 is 1.8 V.
7.5 Electrical Characteristics
Boldface limits apply over the specified temperature range, TA = –40°C to 125°C. At TA = 25°C, ILOAD = 0 mA, VIN = 5 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT REF2912 – 1.25 V VOUT Output voltage 1.225 1.25 1.275 V Initial accuracy 2% Output voltage noise f = 0.1 Hz to 10 Hz, 14 µVPP Voltage noise f = 10 Hz to 10 kHz 42 µVrms Line regulation 1.8 V ≤ VIN ≤ 5.5 V 60 190 µV/V REF2920 VOUT Output voltage 2.007 2.048 2.089 V Initial accuracy 2% Output voltage noise f = 0.1 Hz to 10 Hz, 23 µVPP Voltage noise f = 10 Hz to 10 kHz 65 µVrms Line regulation VREF + 50 mV ≤ VIN ≤ 5.5 V 110 290 µV/V REF2925 VOUT Output voltage 2.45 2.5 2.55 V Initial accuracy 2% Output voltage noise f = 0.1 Hz to 10 Hz 28 µVPP Voltage noise f = 10 Hz to 10 kHz 80 µVrms Line regulation VREF + 50 mV ≤ VIN ≤ 5.5 V 120 325 µV/V REF2930 VOUT Output voltage 2.94 3 3.06 V Initial accuracy 2% Output voltage noise f = 0.1 Hz to 10 Hz, 33 µVPP Voltage noise f = 10 Hz to 10 kHz 94 µVrms Line regulation VREF + 50 mV ≤ VIN ≤ 5.5 V 120 375 µV/V REF2933 VOUT Output voltage 3.234 3.3 3.366 V Initial accuracy 2% Output voltage noise f = 0.1 Hz to 10 Hz, 36 µVPP Voltage noise f = 10 Hz to 10 kHz 105 µVrms Line regulation VREF + 50 mV ≤ VIN ≤ 5.5 V 130 400 µV/V REF2940 VOUT Output voltage 4.014 4.096 4.178 V Initial accuracy 2% Output voltage noise f = 0.1 Hz to 10 Hz, 45 µVPP Voltage noise f = 10 Hz to 10 kHz 128 µVrms VREF + 50 mV ≤ VIN ≤ 5.5 V 160 410 µV/V REF2912, REF2920, REF2925, REF2930, REF2933, REF2940 dVOUT/dT Output voltage temperature drift(1) –40°C ≤ TA ≤ 125°C 35 100 ppm/°C ILOAD Output current 25 mA Long-term stability 0 to 1000H 24 ppm 1000 to 2000H 15 dVOUT/dILOAD Load regulation(2) 0 mA < ILOAD < 25 mA, VIN = VREF + 500 mV(3) 3 100 µV/mA
REF2912,REF2920,REF2925 REF2930,REF2933,REF2940 SBVS033C –JUNE 2002–REVISED JUNE 2016 www.ti.com Product Folder Links: REF2912 REF2920 REF2925 REF2930 REF2933 REF2940 Submit Documentation Feedback Copyright © 2002–2016, Texas Instruments Incorporated Electrical Characteristics (continued) Boldface limits apply over the specified temperature range, TA = –40°C to 125°C. At TA = 25°C, ILOAD = 0 mA, VIN = 5 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT (4) Thermal hysteresis procedure is explained in more detail in Thermal Hysteresis. (5) For IL > 0, see Typical Characteristics. dT Thermal Hysteresis(4) 25 100 ppm VIN – VOUT Dropout voltage 1 50 mV ISC Short-circuit current 45 mA Turnon settling time to 0.1% at VIN = 5 V with CL = 0 120 µs POWER SUPPLY VS Voltage IL = 0 VREF + 0.001(5) 5.5 V Voltage over temperature –40°C ≤ TA ≤ 125°C VREF + 0.05 5.5 IQ Quiescent current 42 50 µA Quiescent current over temperature –40°C ≤ TA ≤ 125°C 59 TEMPERATURE RANGE Specified range –40 125 °C Operating range –40 125 °C Storage range –65 150 °C RθJC Thermal resistance for SOT-23 surface-mount 110 °C/W RθJA 336 °C/W
7.6 Typical Characteristics
Figure 1. Temperature Drift (0°C to 70°C) Figure 2. Temperature Drift (–40°C to 125°C) Figure 3. Output Voltage vs Temperature Figure 4. Maximum Load Current vs Temperature Figure 5. Load Regulation vs Temperature Figure 6. Quiescent Current vs Temperature
8 Detailed Description
8.1 Overview
8.2 Functional Block Diagram
Figure 24. Simplified Schematic of Band-Gap Reference
8.3 Feature Description
8.3.1 Supply Voltage
supply range, as shown in Figure 25. Figure 25. Supply Current vs Supply Voltage
8.3.2 Thermal Hysteresis
- VHYST = calculated hysteresis
- VPRE = output voltage measured at 25°C pretemperature cycling
- VPOST = output voltage measured when device has been operated at 25°C, cycled through specified range –40°C to 125°C and returned to operation at 25°C (1)
8.3.3 Temperature Drift
ranges of –40°C to 125°C, the REF29xx family drift increases to a typical value of 50 ppm.
8.3.4 Noise Performance
Figure 20. The noise voltage of the REF29xx increases with output voltage and operating temperature. Additional
8.3.5 Long-Term Stability
Long-term stability refers to the change of the output voltage of a reference over a period of months or years. characterized by measuring 30 units at regular intervals for a period of 2000 hours.
8.3.6 Load Regulation
regulation, force and sense lines must be used.
Figure 26. Accurate Load Regulation of REF29xx
8.4 Device Functional Modes
8.4.1 Negative Reference Voltage
performance of the REF29xx to provide an accurate solution for split-supply applications. Figure 27. REF2925 Combined With OPA703 to Create Positive and Negative Reference Voltages
8.4.2 Data Acquisition
Figure 28 for a basic data acquisition system.
Figure 28. Basic Data Acquisition System 1
9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
always recommends a supply bypass capacitor of 0.47 µF. Figure 29. Typical Connections for Operating REF29xx
9.2 Typical Application
circuitry. A low-power, zero-drift, operational amplifier circuit is used to attenuate and level-shift the input signal.
3.0 V VOUT
Figure 30. Low-Power Reference and Bipolar Voltage Conditioning Circuit for Low-Power ADCs
9.2.1 Design Requirements
- Supply Voltage: 3.3 V
- Maximum Input Voltage: ±6 V
- Specified Input Voltage: ±5 V
- ADC Reference Voltage: 1.25 V The goal for this design is to accurately condition a ±5-V bipolar input voltage into a voltage suitable for conversion by a low-voltage ADC with a 1.25-V reference voltage, VREF, and an input voltage range of VREF / 2. The circuit should function with reduced performance over a wider input range of at least ±6 V to allow for easier protection of overvoltage conditions.
9.2.2 Detailed Design Procedure
2 and has a differential voltage that is within the ±VREF / 2 input range of the ADC.
9.2.3 Application Curves
Figure 31. OPA317 Output Voltage vs Input Voltage Figure 32. OPA317 Output Voltage Error vs Input Voltage Figure 33. Output Code Error vs Input Voltage
10 Power Supply Recommendations
Load Current. Use a supply bypass capacitor greater than 0.47 µF.
11 Layout
11.1 Layout Guidelines
- Connect low-ESR, 0.1-µF ceramic bypass capacitors at VIN of the REF29xx
- Decouple other active devices in the system per the device specifications
- Use a solid ground plane to help distribute heat and reduces electromagnetic interference (EMI) noise pickup
- Place the external components as close to the device as possible. This configuration prevents parasitic errors (such as the Seebeck effect) from occurring
- Minimize trace length between the reference and bias connections to the INA and ADC to reduce noise pickup
- Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when absolutely necessary
11.2 Layout Example
Figure 34. REF29xx Layout Example
12 Device and Documentation Support
12.1 Related Links
resources, tools and software, and quick access to sample or buy. Table 1. Related Links
12.2 Receiving Notification of Documentation Updates
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
solve problems with fellow engineers. contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) REF2912AIDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29A REF2912AIDBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29A REF2912AIDBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29A REF2912AIDBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29A REF2920AIDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29B REF2920AIDBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29B REF2920AIDBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29B REF2920AIDBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29B REF2925AIDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29C REF2925AIDBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29C REF2925AIDBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29C REF2925AIDBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29C REF2930AIDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29D REF2930AIDBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29D REF2930AIDBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29D REF2930AIDBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29D REF2933AIDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29E REF2933AIDBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29E REF2933AIDBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29E REF2933AIDBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29E REF2940AIDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29F REF2940AIDBZR.B Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29F REF2940AIDBZT Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29F REF2940AIDBZT.B Active Production SOT-23 (DBZ) | 3 250 | SMALL T&R Yes NIPDAUAG Level-1-260C-UNLIM -40 to 125 R29F (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. Addendum-Page 1
www.ti.com 23-May-2025 (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 5-Jan-2021 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REF2912AIDBZR SOT-23 DBZ 3 3000 200.0 183.0 25.0 REF2912AIDBZT SOT-23 DBZ 3 250 200.0 183.0 25.0 REF2920AIDBZR SOT-23 DBZ 3 3000 200.0 183.0 25.0 REF2920AIDBZT SOT-23 DBZ 3 250 200.0 183.0 25.0 REF2925AIDBZR SOT-23 DBZ 3 3000 200.0 183.0 25.0 REF2925AIDBZT SOT-23 DBZ 3 250 200.0 183.0 25.0 REF2930AIDBZR SOT-23 DBZ 3 3000 200.0 183.0 25.0 REF2930AIDBZT SOT-23 DBZ 3 250 200.0 183.0 25.0 REF2933AIDBZR SOT-23 DBZ 3 3000 200.0 183.0 25.0 REF2933AIDBZT SOT-23 DBZ 3 250 200.0 183.0 25.0 REF2940AIDBZR SOT-23 DBZ 3 3000 200.0 183.0 25.0 REF2940AIDBZT SOT-23 DBZ 3 250 200.0 183.0 25.0 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jan-2021 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.20
0.08 TYP
0.25 2.64 2.10
1.12 MAX
0.10
0.01 TYP
3X 0.5 0.3 0.6
0.2 TYP
1.9 0.95 0 -8 TYP 4X 0 -15 4X 4 -15 A 3.04 2.80 B1.4 1.2 (0.95) (0.15) (0.125) SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. 4. Support pin may differ or may not be present. 5. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25mm per side
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
3X (1.3) 3X (0.6) (2.1) 2X (0.95) (R0.05) TYP 4214838/F 08/2024 SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE SCALE:15X PKG SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN (2.1) 2X(0.95) 3X (1.3) 3X (0.6) (R0.05) TYP SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X SYMM PKG
IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2025, Texas Instruments Incorporated