REF1112 BURR-BROWN | Alldatasheet

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Technical content

10ppm/°C, 1µµµµµA, 1.25V Shunt Voltage Reference

APPLICATIONS

zzzzz BATTERY-POWERED INSTRUMENTS zzzzz PORTABLE DEVICES zzzzz MEDICAL EQUIPMENT zzzzz CURRENT SOURCES zzzzz CALIBRATORS z MICROPOWER CURRENT AND VOLTAGE REFERENCE

DESCRIPTION

The REF1112 is a two-terminal shunt reference designed for power and space-sensitive applications. The REF1112 fea- tures an operating current of 1 µA in a SOT23-3 package and is an improved, lower power pin-compatible drop-in replacement for designs currently using the REF1004 and LT1004. The REF1112 is specified from –40°C to +85°C with operation extending from –40°C to +125°C. The REF1112 complements other 1 µA components from Texas Instruments including the OPA349 and the TLV240x low power operational amplifiers, and the TLV349x micropower voltage comparator. SBOS283 – SEPTEMBER 2003 www.ti.com Copyright © 2003, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

FEATURES

z MICRO-PACKAGE: SOT23-3 z WIDE CURRENT RANGE: 1 µµµµµA to 5mA z HIGH INITIAL ACCURACY: 0.2% z EXCELLENT SPECIFIED DRIFT PERFORMANCE: 30ppm/°C (max) from 0°C to +70°C 50ppm/°C (max) from –40°C to +85°C RBIAS VS VOUT IREF + ILOAD IREF RLOAD ILOAD RBIAS = VS − VD ILOAD + IREF 3N C SOT23 GND VO NC indicates pin should be left unconnected.

SBOS283www.ti.com REF1112 - 1.25V PARAMETER CONDITIONS MIN TYP MAX UNITS REVERSE BREAKDOWN VOLTAGE I REF = 1.2 µA 1.2475 1.25 1.2525 V -0.2 + 0.2 % TEMPERATURE COEFFICIENT 1.2µA < IREF < 5mA 0°C to +70°C 10 30 ppm/°C –40°C to +85°C 15 50 ppm/°C –40°C to +125°C 15 ppm/°C MINIMUM OPERATING CURRENT 1 1.2 µA REVERSE BREAKDOWN VOLTAGE 30 100 ppm/mA CHANGE WITH CURRENT 1.2µA < IREF < 5mA REVERSE DYNAMIC IMPEDANCE 1.2µA < IREF < 5mA 0.037 0.125 Ω LOW-FREQUENCY NOISE(1) 0.1Hz < IREF < 10Hz 25 µVPP THERMAL HYSTERESIS(2) 100 ppm LONG-TERM STABILITY +25°C ± 0.1°C 60 ppm/kHr TEMPERATURE CHARACTERISTICS Specified Range –40 +125 °C Operating Range –55 +125 °C Storage Range –65 +150 °C Thermal Resistance θJA PRELIMINARY ELECTRICAL CHARACTERISTICS Boldface limits apply over the specified temperature range, TA = –40°C to +125°C . At TA = +25°C, I REF = 1.2µA, and C LOAD = 10nF, unless otherwise noted. SOT23-3 Surface-Mount 135 °C/W (1) Peak-to-peak noise is measured with a 2-pole high-pass filter at 0.1Hz and a 4-pole low-pass chebyshev filter at 10Hz. (2) Thermal hysteresis is defined as the change in output voltage after operating the device at 25°C, cycling the device through the specified temperature range, and returning to 25°C. (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. ABSOLUTE MAXIMUM RATINGS(1) PACKAGE/ORDERING INFORMATION ELECTROSTATIC DISCHARGE SENSITIVITY Electrostatic discharge can cause damage ranging from performance degradation to complete device failure. Texas Instruments recom- mends that all integrated circuits be handled and stored using appro- priate ESD protection methods. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet published specifications. SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR (1) RANGE MARKING NUMBER MEDIA, QUANTITY REF1112 SOT23-3 DBZ –40°C to +125°C R11A REF1112AIDBZT Tape and Reel, 250 " """ " REF1112AIDBZR Tape and Reel, 3000 NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.

SBOS283 www.ti.com REVERSE DYNAMIC IMPEDANCE Reverse Current (mA) Dynamic Impedance (Ω) 0.10.010.001 1 10 0.1 0.01 100 -40°C ≤ TA ≤ 125°C f = 10Hz FORWARD CHARACTERISTICS Forward Voltage (V) Forward Current (mA) 1.00.10.01 100.001 1.0 0.8 0.6 0.4 0.2 0.0 TA = 25°C Behaves as standard silicon diode REVERSE CHARACTERISTICS Reverse Voltage (V) Reverse Current (µA) 100 0.1 0.01 10K -40°C ≤ TA ≤ 125°C Voltage Regulation Region TEMPERATURE DRIFT Temperature (°C) Reverse Voltage (V) 5−15−35 25 45 65−55 85 105 125 1.255 1.254 1.253 1.252 1.251 1.250 1.249 1.248 REVERSE DYNAMIC IMPEDANCE Frequency (Hz) Dynamic Impedance (Ω) 100101 1k 10k 0.1 0.01 100 10k 100k TA = +25°C IREF = 5mA IREF = 10µA REVERSE VOLTAGE CHANGE vs CURRENT Reverse Current (mA) Output Voltage Change (mV) 0.001 0.5 0.01 0.1 1 10 0.4 0.3 0.2 0.1 0.0 -40°C ≤ TA ≤ 125°C TYPICAL CHARACTERISTICS At TA = +25°C, I REF = 10µA and CL = 10nF, unless otherwise specified.

SBOS283www.ti.com LOW-FREQUENCY NOISE, 0.1 to 10Hz 1.0s/div 10µV/div Drift (ppm/°C) TEMPERATURE DRIFT DISTRIBUTION Distribution (%) −40°C to +85°C 0 5 10 15 20 25 30 35 40 45 50 TEMPERATURE DRIFT DISTRIBUTION Drift (ppm/°C) 0 5 10 15 20 25 30 35 Distribution (%) 0°C to +70°C REVERSE BREAKDOWN VOLTAGE DISTRIBUTION Reverse Breakdown Voltage (V) 1.2475 1.2500 1.2525 Distribution (%) RESPONSE TIME 25ms/div Voltage (V) CLOAD = 0.1µF VOUT VIN 0.1µF VOUT VIN IREF 375kΩ RESPONSE TIME 10ms/div Voltage (V) CLOAD = 0.01µF VOUT VIN 0.01µF VOUT VIN 375kΩ TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, I REF = 10µA and CL = 10nF, unless otherwise specified.

MPDS108 – AUGUST 2001 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DBZ (R-PDSO-G3) PLASTIC SMALL-OUTLINE 0,55 REF 4203227/A 08/01 3,04 2,80 2,05 1,78 1,03 0,89 0,60 0,45 2,64 2,10 1,40 1,20 0,51 0,37 1,12 0,89 0,100 0,013 0,180 0,085 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Dimensions are inclusive of plating. D. Dimensions are exclusive of mold flash and metal burr.

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