10V Precision Voltage Reference (Rev. B)

Document overview

  • Manufacturer or author: Texas Instruments, Incorporated [SBVS022,B]
  • PDF pages: 20

Technical content

SBVS022B – SEPTEMBER 2000 – REVISED JUNE 2009

FEATURES

G +10V ±0.0025V OUTPUT G VERY LOW DRIFT: 2.5ppm/ °C max G EXCELLENT STABILITY: 5ppm/1000hr typ G EXCELLENT LINE REGULATION: 1ppm/V max G EXCELLENT LOAD REGULATION: 10ppm/mA max G LOW NOISE: 5 µVPP typ, 0.1Hz to 10Hz G WIDE SUPPLY RANGE: 11.4VDC to 36VDC G LOW QUIESCENT CURRENT: 1.4mA max G PACKAGE OPTIONS: PLASTIC DIP, SO-8 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000-2009, Texas Instruments Incorporated 10V Precision Voltage Reference Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.

APPLICATIONS

G PRECISION-CALIBRATED VOLTAGE STANDARD G D/A AND A/D CONVERTER REFERENCE G PRECISION CURRENT REFERENCE G ACCURATE COMPARATOR THRESHOLD REFERENCE G DIGITAL VOLTMETER G TEST EQUIPMENT G PC-BASED INSTRUMENTATION

DESCRIPTION

The REF102 is a precision 10V voltage reference. The drift is laser-trimmed to 2.5ppm/°C max C-grade over the indus- trial temperature range. The REF102 achieves its precision without a heater. This results in low power, fast warm-up, excellent stability, and low noise. The output voltage is extremely insensitive to both line and load variations and can be externally adjusted with minimal effect on drift and stability. Single-supply operation from 11.4V to 36V and excellent overall specifications make the REF102 an ideal choice for demanding instrumentation and system reference applications. A R 2 R 3 R 4 R 6 R 1 R 5 50kΩ 22kΩ 7kΩ 4kΩ 8kΩ DZ 1 Noise Reduction Common VOUT V+Trim 14kΩ REF102 REF102 www.ti.com

SBVS022Bwww.ti.com MAX INITIAL MAX DRIFT PACKAGE PACKAGE PRODUCT ERROR (mV) (PPM/ °C) PACKAGE-LEAD DESIGNATOR MARKING REF102AU ±10 ±10 SO-8 D REF102AU REF102AP ±10 ±10 DIP-8 P REF102AP REF102BU ±5 ±5 SO-8 D REF102BU REF102BP ±5 ±5 DIP-8 P REF102BP REF102CU ±2.5 ±2.5 SO-8 D REF102CU REF102CP ±2.5 ±2.5 DIP-8 P REF102CP PIN CONFIGURATIONS Top View DIP, SO Operating Temperature Storage Temperature Range NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. ABSOLUTE MAXIMUM RATINGS (1) ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI website at www.ti.com. NC = Not Connected Noise Reduction NC V OUT Trim NC Com NC

SBVS022B www.ti.com

ELECTRICAL CHARACTERISTICS

At TA = +25°C and VS = +15V power supply, unless otherwise noted. REF102A REF102B REF102C PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS OUTPUT VOLTAGE vs Temperature(1) 10 5 2.5 ppm/ °C vs Supply (Line Regulation) V S = 11.4V to 36V 2 1 1 ppm/V vs Output Current (Load Regulation) I L = 0mA to +10mA 20 10 10 ppm/mA IL = 0mA to –5mA 40 20 20 ppm/mA vs Time T A = +25°C M Package 5 ✻✻ ppm/1000hr P, U Packages(2) 20 ✻ ppm/1000hr Trim Range(3) ±3 ✻✻ % Capacitive Load, max 1000 ✻✻ pF NOISE 0.1Hz to 10Hz 5 ✻✻ µVPP OUTPUT CURRENT +10, –5 ✻✻ mA INPUT VOLTAGE RANGE +11.4 +36 ✻✻ ✻ ✻ V QUIESCENT CURRENT IOUT = 0 +1.4 ✻✻ mA WARM-UP TIME (4) To 0.1% 15 ✻✻ µs TEMPERATURE RANGE Specification ✻ Specifications same as REF102A. NOTES: (1) The box method is used to specify output voltage drift vs temperature; see the Discussion of Performance section. (2) Typically 5ppm/1000hrs after 168hr powered stabilization. (3) Trimming the offset voltage affects drift slightly. See Installation and Operating Instructions for details. (4) With noise reduction pin floating. See Typical Characteristics for details.

SBVS022Bwww.ti.com TYPICAL CHARACTERISTICS At TA = +25°C, VS = +15V, unless otherwise noted. POWER TURN-ON RESPONSE VOUT VIN Time (5µs/div) Power Turn-On POWER TURN-ON RESPONSE with 1 µF CN VOUT VIN Time (10ms/div) Power Turn-On POWER SUPPLY REJECTION vs FREQUENCY 130 120 110 100 1 100 1k 10k Frequency (Hz) Power Supply Rejection (dB) LOAD REGULATION +1.5 +1.0 +0.5 −0.5 −1.0 −1.5 –5 0 +5 +10 Output Current (mA) Output Voltage Change (mV) RESPONSE TO THERMAL SHOCK 30 45 60150 +600 +300 –300 –600 TA = +25°C REF102C Immersed in +85°C Fluorinert Bath Output Voltage Change (µV) Time (s) TA = +85°C QUIESCENT CURRENT vs TEMPERATURE 1.6 1.4 1.2 1.0 0.8 −50 −25 0 +25 +50 +75 +100 +125 Temperature (°C) Quiescent Current (mA) −75

FIGURE 7. +10V Reference With Output Current Boosted to: a) ±20mA, b) +100mA, and c) IL (TYP) +10mA, –5A.

350 Strain

See SBVA007 for more details. See SBVA001 for more details and ISINK Circuit. FIGURE 8. Strain Gauge Conditioner for 350Ω Bridge. FIGURE 9. ±10V Reference. FIGURE 10. Positive Precision Current Source.

SBVS022Bwww.ti.com

Revision History

DATE REVISION PAGE SECTION DESCRIPTION Absolute Maximum Ratings Deleted lead temperature rating. Package/Ordering Information Changed Package Ordering Information table. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 26/09 B

www.ti.com 23-Oct-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples REF102AM OBSOLETE TO-99 LMC 8 TBD Call TI Call TI REF102AP ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type REF102P A REF102APG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type REF102P A REF102AU ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF 102U A REF102AU/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF 102U A REF102AU/2K5G4 ACTIVE SOIC D 8 TBD Call TI Call TI REF102AUG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR REF 102U A REF102BM OBSOLETE TO-99 LMC 8 TBD Call TI Call TI REF102BP ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type REF102P B REF102BPG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type REF102P B REF102BU ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -25 to 85 REF 102U B REF102BUG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -25 to 85 REF 102U B REF102CM OBSOLETE TO-99 LMC 8 TBD Call TI Call TI REF102CP ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -25 to 85 REF102P C REF102CPG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -25 to 85 REF102P C REF102CU ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -25 to 85 REF 102U C

www.ti.com 23-Oct-2015 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples REF102CU/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -25 to 85 REF 102U C REF102CUG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -25 to 85 REF 102U C REF102RM OBSOLETE TO-99 LMC 8 TBD Call TI Call TI REF102SM OBSOLETE TO-99 LMC 8 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

www.ti.com 23-Oct-2015 Addendum-Page 3 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REF102AU/2K5 SOIC D 8 2500 367.0 367.0 35.0 REF102CU/2K5 SOIC D 8 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 Pack Materials-Page 2

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic”are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated