REF1004

REF1004 TI1 | Alldatasheet

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Technical content

1.2V and 2.5V Micropower VOLTAGE REFERENCE

FEATURES

l INITIAL ACCURACY: REF1004-1.2 ±4mV REF1004-2.5 ±20mV l MINIMUM OPERATING CURRENT: REF1004-1.2 10µA REF1004-2.5 20µA l EXCELLENT LONG TERM TEMPERATURE STABILITY l VERY LOW DYNAMIC IMPEDANCE l OPERATES UP TO 20mA l PACKAGE: 8-Lead SOIC International Airport Industrial Park • Mailing Address: PO Box 11400 • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Tel: (520) 746-1111 • Twx: 910-952-1111 • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 REF1004 NC NC NC Anode Cathode NC Cathode NC Typical Operating Circuit (Top View)

APPLICATIONS

l BATTERY POWERED TEST EQUIPMENT l PORTABLE MEDICAL INSTRUMENTATION l PORTABLE COMMUNICATIONS DEVICES l A/D AND D/A CONVERTERS l NOTEBOOK AND PALMTOP COMPUTERS

DESCRIPTION

The REF1004-1.2 and REF1004-2.5 are two terminal bandgap reference diodes designed for high accuracy with outstanding temperature characteristics at low operating currents. Prior to the introduction of the REF1004 Micropower Voltage References, accuracy and stability specifications could only be attained by expensive screening of standard devices. The REF1004 is a cost effective solution when reference voltage accuracy, low power, and long term temperature sta- bility are required. REF1004 is a drop-in replacement for the LT1004 as well as an upgraded replacement of the LM185/385 series references. The REF1004C is characterized for operation from 0°C to 70°C and the REF1004I is characterized for operation from –40°C to +85°C. The REF1004 is offered in an 8-lead Plastic SOIC package and shipped in anti-static rails or tape and reel. © 1992 Burr-Brown Corporation PDS-1172 Printed in U.S.A. October, 1993 SBVS002

REF1004-1.2 REF1004-2.5 PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS AVERAGE TEMPERATURE COEFFICIENT IMIN ≤ IR ≤ 20mA 20 20 ppm/ °C MINIMUM OPERATION CURRENT (3) 81 0 1 2 2 0 µA REVERSE BREAKDOWN IMIN ≤ IR ≤ 1mA 1 1 mV VOLTAGE CHANGE WITH 1.5(3) 1.5(3) CURRENT 1mA ≤ IR ≤ 20mA 10 10 20(3) 20(3) REVERSE DYNAMIC IMPEDANCE (3) IR = 100µA 0.2 0.6 0.2 0.6 Ω WIDE BAND NOISE (RMS) IR = 100µA 10Hz ≤ IR ≤ 10kHz 60 120 µV LONG TERM STABILITY IR = 100µA TA = 25°C ± 0.1°C 20 20 ppm/KHr NOTES: (1) This specification applies over the full operating temperature range of 0°C ≤ TA ≤ 70°C. (2) This specification applies over the full operating temperature range of 40°C ≤ TA ≤ +85°C. (3) Denotes the specifications which apply over the full operating temperature range. SPECIFICATIONS ELECTRICAL TA = +25°C unless otherwise noted. MODEL T A VZ PACKAGE REF1004C-1.2 0 °C to +70°C 1.2V 8-Lead SOIC REF1004C-2.5 0 °C to +70°C 2.5V 8-Lead SOIC REF1004I-1.2 –40 °C to +85°C 1.2V 8-Lead SOIC REF1004I-2.5 –40 °C to +85°C 2.5V 8-Lead SOIC NOTE: Available in Tape and Reel, Add –TR to Model Number.

ORDERING INFORMATION

Operating Temperature Range Storage Temperature ABSOLUTE MAXIMUM RATINGS MODEL PART MARKING REF1004C-1.2 BBREF0412 REF1004C-2.5 BBREF0425 REF1004I-1.2 BBREF0412 REF1004I-2.5 BBREF0425

PACKAGE INFORMATION

MODEL PACKAGE NUMBER (1) REF1004C-1.2 8-Pin SOIC 182 REF1004C-2.5 8-Pin SOIC 182 REF1004I-1.2 8-Pin SOIC 182 REF1004I-2.5 8-Pin SOIC 182 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix D of Burr-Brown IC Data Book. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.

3 REF1004

TYPICAL PERFORMANCE CURVES 1.2V TA = +25°C unless otherwise noted. REVERSE CHARACTERISTICS Reverse Voltage (V) Reverse Current (µA) 100 0.1 –40°C ≤ TA ≤ +85°C Temperature (°C) –55 –35 –15 5 25 45 65 85 105 125 1.245 1.240 1.235 1.230 1.225 Reverse Voltage (V) TEMPERATURE DRIFT REVERSE DYNAMIC IMPEDANCE Reverse Current (mA) 0.01 0.1 1 10 100 100 0.1 Reverse Impedance (Ω ) f = 25Hz –40°C to +85°C FORWARD CHARACTERISTICS 1.2 0.8 0.4 0.0 Forward Voltage (V) Forward Current (mA) 0.01 0.1 1 10 100 TA = 25°C –4 Output Voltage Change (mV) REVERSE VOLTAGE CHANGE Reverse Current (mA) 10.01 0.1 10 100 –40°C ≤ TA ≤ +85°C REVERSE DYNAMIC IMPEDANCE Frequency (Hz) 10 100 1k 10k 100k 1M 10k 100 0.1 Dynamic Impedance (Ω ) TA = +25°C IREF = 100µA

TYPICAL PERFORMANCE CURVES 1.2V (CONT) TA = +25°C unless otherwise noted. Frequency (Hz) 1k 10k 100k10010 700 600 500 400 300 200 100 Noise (nV/√Hz) NOISE VOLTAGE IREF = 100µA TA = 25°C FILTERED OUTPUT NOISE 100 1k 10k 100k Cutoff Frequency (Hz) Integrated Noise (µV) IREF = 100µA100µA R C RESPONSE TIME Time (µSec) 0 100 200 300 400 500 600 1.5 1.0 0.5 0.0 2.5 Voltage (V) 36kΩ VIN VOUT Output Input

5 REF1004

Reverse Current (µA) 100 0.1 Reverse Voltage (V) –40°C ≤ TA ≤ +85°C TYPICAL PERFORMANCE CURVES 2.5V TA = +25°C unless otherwise noted. FORWARD CHARACTERISTICS 1.2 1.0 0.8 0.6 0.4 0.2 0.0 Forward Voltage (V) Forward Current (mA) 0.01 0.1 1 10 100 TA = +25°C REVERSE VOLTAGE CHANGE Reverse Current (mA) Output Voltage Change (mV) 0.01 0.1 1 10 100 –40°C ≤ TA ≤ +85°C Temperature (°C) –55 –35 –15 5 25 45 65 85 105 125 2.520 2.515 2.510 2.505 2.500 2.495 2.490 2.485 2.480 2.475 Reference Voltage (V) TEMPERATURE DRIFT REVERSE DYNAMIC IMPEDANCE 1000 100 0.1 Reverse Impedance (Ω ) Reverse Current (mA) 0.01 0.1 1 10 100 f = 25Hz –40°C to +85°C REVERSE DYNAMIC IMPEDANCE Frequency (Hz) 10 100 1k 10k 100k 1M 10k 100 0.1 Dynamic Impedance (Ω ) TA = +25°C IREF = 100µA

TYPICAL PERFORMANCE CURVES 2.5V (CONT) TA = +25°C unless otherwise noted. Noise (nV/√Hz) Frequency (Hz) 1k 10k 100k10010 1400 1200 1000 800 600 400 200 NOISE VOLTAGE IREF = 100µA FILTERED OUTPUT NOISE 100 Cutoff Frequency (Hz) 1k 10k 100k Integrated Noise (µV) 120 100 100µA R C IREF = 100µA RESPONSE TIME Voltage (V) Time (µSec) 4.0 3.0 2.0 1.0 0.0 5.0 0.0 0 100 200 300 400 500 600 24kΩ VIN VOUT Output Input

7 REF1004

FIGURE 1. Low-Noise Reference. FIGURE2. Micropower Reference from 9V Battery. FIGURE 3. 1.2V Reference from 1.5V Battery. FIGURE 4. 2.5V Reference. FIGURE 5. Lead-Acid Low-Battery-Voltage Detector. NOTE: (1) R1 sets trip point, 60.4kΩ per cell for 1.8V per cell.

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) REF1004C-1.2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004C-1.2/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004C-1.2/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004C-1.2E4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004C-2.5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004C-2.5/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004C-2.5/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004C-2.5E4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-1.2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-1.2/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-1.2/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-1.2E4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-2.5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-2.5/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-2.5/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR REF1004I-2.5E4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) PACKAGE OPTION ADDENDUM www.ti.com 7-May-2008 Addendum-Page 1

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 7-May-2008 Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) REF1004C-1.2/2K5 SOIC D 8 2500 346.0 346.0 29.0 REF1004C-2.5/2K5 SOIC D 8 2500 346.0 346.0 29.0 REF1004I-1.2/2K5 SOIC D 8 2500 346.0 346.0 29.0 REF1004I-2.5/2K5 SOIC D 8 2500 346.0 346.0 29.0 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 Pack Materials-Page 2

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