RDP60-005-005FF YAMAICHI | Alldatasheet
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Pin counts from 10 to 80 Various mating heights RDP 60 - 0** - 005 F * Part Number (Details) Outline Dimensions Series Pin Count Height Coding Code Dim H* Dim J* 005 0.5mm 2.0mm 010 1.0mm 3.0mm 015 1.5mm 3.5mm 180° SMT F = Au Flash (Mating Area) Solder Area: F = Au Flash (Dim. H = 0.5mm only) L = Sn (Dim. H = 1.0 and 1.5mm only) RDP034-010-005-FL 34 8.0 11.0 10.0 8.5 RDP034-015-005-FL 34 8.0 11.0 10.0 8.5 RDP038-010-005-FL 38 9.0 12.0 11.0 9.5 RDP038-015-005-FL 38 9.0 12.0 11.0 9.5 RDP046-010-005-FL 46 11.0 14.0 13.0 11.5 RDP054-010-005-FL 54 12.5 16.0 15.0 13.5 RDP068-010-005-FL 68 16.5 19.5 18.5 17.0 RDP068-015-005-FL 68 16.5 19.5 18.5 17.0 Recommended PCB Layout RDS Top View Mating Height = Dim. H + H RDP *see drawing RDP022-005-005-FF 22 5.0 8.0 7.0 5.5 RDP022-010-005-FL 22 5.0 8.0 7.0 5.5 RDP026-010-005-FL 26 6.0 9.0 8.0 6.5 RDP032-005-005-FF 32 7.5 10.5 9.5 8.0 RDP032-015-005-FL 32 7.5 10.5 9.5 8.0 Part Number Pin Count A B C D Part Number Pin Count A B C D Dimensional Information
Connectors SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETERD-70 Trading Division Series RDS 180° SMT Female Header Specifications Insulation Resistance: 100MΩ min. Voltage Rating: 50V AC Withstanding Voltage: 200V ACrms Current Rating: 0.5A Contact Resistance: 50mΩ max. initial Operating Temp. Range: –40°C to +80°C Mating Force: 90g max. / contact Unmating Force: 10g min. / contact Mating Cycles: 50 insertions Soldering Temp.: 230°C min. / 60 sec., 260°C peak Materials and Finish Housing: High Temperature Thermoplastic, UL 94V-0 rated Contacts: Copper Alloy (t=0.2mm) Mating Area - Au Flash Solder Area - Au Flash or Sn Fitting Nail: Copper Alloy (t=0.2mm), lead free solder Pin counts from 10 to 80 Various mating heights RDS 60 - 0** - 005 F * Part Number (Details) Outline Dimensions RDS014-020-005-FF 14 3.0 8.0 5.0 5.5 RDS014-030-005-FL 14 3.0 8.0 5.0 5.5 RDS018-020-005-FF 18 4.0 9.0 6.0 6.5 RDS022-020-005-FF 22 5.0 10.0 7.0 7.5 RDS022-030-005-FL 22 5.0 10.0 7.0 7.5 RDS028-020-005-FF 28 6.5 11.5 8.5 9.0 RDS028-030-005-FL 28 6.5 11.5 8.5 9.0 RDS032-020-005-FF 32 7.5 12.5 9.5 10.0 RDS034-030-005-FL 34 8.0 13.0 10.0 10.5 RDS034-040-005-FL 34 8.0 13.0 10.0 10.5 RDS038-030-005-FL 38 9.0 14.0 11.0 11.5 RDS044-030-005-FL 44 10.5 15.5 12.5 13.0 RDS054-030-005-FL 54 12.5 18.0 15.0 15.5 Recommended PCB Layout Mating Height = Dim. H + H RDS Series Pin Count Height Coding Code Dim H* Dim G* 020 2.0mm 1.5mm 030 3.0mm 2.5mm 040 4.0mm 3.5mm 180° SMT F = Au Flash (Mating Area) Solder Area: F = Au Flash (Dim H = 2.0mm only) L = Sn (Dim H = 3.0 and 4.0mm only) RDP Note: Heights of 2.5 and 8.0 available on request Part Number Pin Count A B C D Part Number Pin Count A B C D *see drawing Dimensional Information Top View