RDL3081 RFSEMI | Alldatasheet

Document overview

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Technical content

Features

 Peak pulse power, PPP = 300W (tp = 10/1000 μs)  Suitable for surface-mounted design  Reverse standoff voltage : 26V  Low package height : 0.6 mm  Halogen – free

Applications

 Power supply protection  Automotive application  Industrial application  USB Vbus protection  Power management [unit : mm] Schematic & PIN Configuration Absolute Maximum Ratings at TA = 25 o C Rating Symbol Value Unit Peak Pulse Power (tp = 10/1000 μs) PPP 300 Watts Total Power Dissipation PD 500 mW Maximum Peak Pulse Current (tp = 10/1000 μs) IPP 9.5 Amps ESD per IEC 61000-4-2 (air) ESD per IEC 61000-4-2 (contact) VESD ± 30 ± 30 kV Junction Temperature TJ -55 ~ 150 ºC Storage Temperature TSTG -55 ~ 150 ºC Electrical Characteristics at TA = 25 o C Parameter Symbol Conditions Ratings Unit Min Typ Max Reverse Stand-off Voltage VRWM 26 V Reverse Breakdown Voltage VBR IT = 1 mA 28 31.9 V Reverse Leakage Current IR VRWM = 26 V, T = 25 ºC 0.1 μA Forward Voltage VF IF = 10 mA 0.6 0.8 1.2 V Clamping Voltage VC IPP = 9.5 A, tp = 10/1000 μs 40 V

RFsemi Technologies, Inc. Rev. 2

Electrical Characteristics

IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF PPP Peak Power Dissipation Peak Pulse Waveform Power Derating Curve 0 1 2 3 4 5 6 7 8 9 10 11 Surge waveform according to IEC61643-321 tr = 10 s td = 1000 s Clamping Voltage [V] Peak Pulse Current [A] 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 100 150 200 250 300 350 400 450 500 550 600 f = 1 MHz Junction Capacitance [pF] Reverse Voltage [V] 0 1 2 3 4 100 150 Peak Pulse Current, IPP [A] Pulse Duration, TP [ms] 100% IPP : 10s 50% IPP : 1000s 10/1000 s pulse waveform according to IEC 61643-321 0 25 50 75 100 125 150 175 200 100 110 120 % of Rated Power or IPP Ambient Temperature, TA [ o Junction Capacitance vs. Reverse Voltage Junction Capacitance vs. Reverse Voltage Clamping Voltage vs. Peak Pulse Current

RFsemi Technologies, Inc. Rev. 2 Marking Code Package Dimensions Unit : mm Top view Bottom view Side view PA

RFsemi Technologies, Inc. Rev. 2 Soldering Unit : mm 0.5 0.6 0.7 0.5 0.6 0.7 1.8 (2×) 1.7 (2×) 1.9 (2×) 2.1 (2×) 0.6 0.6 2.1 Solder paste Solder resist Solder lands Occupied area R0.05 (8×)