RDE5C1H102J0S1H03A | DigiCamel IC Datasheet

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RDE5C1H100J0K1H03B MURATA | Alldatasheet

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Product specifications in this catalog are as of Apr. 2024, and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering.Please read rating and Cautions first. ＜Reference＞Please kindly use our website. Please refer to the product information page for more information on ceramic capacitors.→ Ceramic capacitor product information Various data can be obtained directly from the product search.→ Product search (SMD) / Product search (Lead Type) Reference Specification Leaded MLCC for Consumer Electronics & Industrial Equipment RDE Series

OPERATING VOLTAGE Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications. 1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage. (1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage. When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage. (2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage. Typical Voltage Applied to the DC Capacitor (E: Maximum possible applied voltage.) 1-2. Influence of over voltage Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the internal dielectric layers. The time duration until breakdown depends on the applied voltage and the ambient temperature. Use a safety standard certified capacitor in a power supply input circuit (AC filter), as it is also necessary to consider the withstand voltage and impulse withstand voltage defined for each device. 2. OPERATING TEMPERATURE AND SELF-GENERATED HEAT Keep the surface temperature of a capacitor below the upper limit of its rated operating temperature range. Be sure to take into account the heat generated by the capacitor itself. When the capacitor is used in a high-frequency current, pulse current or the like, it may have the self- generated heat due to dielectric-loss. In case of Class 2 capacitors (Temp.Char. : X7R,X7S,X8L, etc.), applied voltage should be the load such as self-generated heat is within 20 °C on the condition of atmosphere temperature 25 °C. Since the self-heating is low in the Class 1 capacitors (Temp.Char.: C0G,U2J,X8G, etc.), the allowable power becomes extremely high compared to the Class 2 capacitors. However, when a load with self-heating of 20°C is applied at the rated voltage, the allowable power may be exceeded. Please confirm that there is no rising trend of the capacitor's surface temperature and that the surface temperature of the capacitor does not exceed the maximum operating temperature. Excessive generation of heat may cause deterioration of the characteristics and reliability of the capacitor. When measuring the self-heating temperature, be aware that accurate measurement may not be possible due to the following effects. ・ The heat generated by other parts ・ Air flow such as convection and cooling fans ・ Temperature sensor used for measuring surface temperature of capacitor In the case using a thermocouple, it is recommended that use a K thermocouple of Φ0.1mm with less heat capacity. 3. FAIL-SAFE Capacitors that are cracked by dropping or bending of the board may cause deterioration of the insulation resistance, and result in a short. If the circuit being used may cause an electrical shock, smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse, to prevent secondary accidents. EGLEDMNO03C Reference only DC Voltage DC+AC Voltage AC Voltage Pulse Voltage E E E E

OPERATING AND STORAGE ENVIRONMENT The insulating coating of capacitors does not form a perfect seal; therefore, do not use or store capacitors in a corrosive atmosphere, especially where chloride gas, sulfide gas, acid, alkali, salt or the like are present. And avoid exposure to moisture. Before cleaning, bonding, or molding this product, verify that these processes do not affect product quality by testing the performance of a cleaned, bonded or molded product in the intended equipment. Store the capacitors where the temperature and relative humidity do not exceed 5 to 40 °C and 20 to 70%. Use capacitors within 6 months. Use capacitors within 6 months after delivered. Check the solderability after 6 months or more. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused by direct sunlight on the terminal electrodes, the solderability and electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high humidity conditions. 5. VIBRATION AND IMPACT Do not expose a capacitor or its leads to excessive shock or vibration during use. 5-1. Mechanical shock due to being dropped may cause damage or a crack in the dielectric material of the capacitor. Do not use a dropped capacitor because the quality and reliability may be deteriorated. 5-2. Excessive shock or vibration may cause to fatigue destruction of lead wires mounted on the circuit board. If necessary, take measures to hold a capacitor on the circuit boards by adhesive, molding resin or coating and other. Please confirm there is no influence of holding measures on the product with an intended equipment. 6. SOLDERING When soldering this product to a PCB/PWB, do not exceed the solder heat resistance specification of the capacitor. Subjecting this product to excessive heating could melt the internal junction solder and may result in thermal shocks that can crack the ceramic element. Please verify that the soldering process does not affect the quality of capacitors. 6-1. Flow Soldering Soldering temperature : 260 ℃ max. Soldering time : 7.5 s max. Preheating temperature : 120 ℃ max. Preheating time : 60 s max. 6-2. Reflow Soldering Do not apply reflow soldering. 6-3. Soldering Iron Temperature of iron-tip : 350 ℃ max. Soldering iron wattage : 60 W max. Soldering time : 3.5 s max. EGLEDMNO03C Reference only 100 150 200 250 300 0 20 40 60 80 100 Time [s] Temp. [°C] Pre-heating Soldering ［Standard Condition for Flow Soldering］

BONDING AND RESIN MOLDING, RESIN COAT In case of bonding, molding or coating this product, verify that these processes do not affect the quality of capacitor by testing the performance of a bonded or molded product in the intended equipment. In case of the amount of applications, dryness / hardening conditions of adhesives and molding resins containing organic solvents (ethyl acetate, methyl ethyl ketone, toluene, etc.) are unsuitable, the outer coating resin of a capacitor is damaged by the organic solvents and it may result, worst case, in a short circuit. The variation in thickness of adhesive or molding resin may cause a outer coating resin cracking and/or ceramic element cracking of a capacitor in a temperature cycling. 8. TREATMENT AFTER BONDING AND RESIN MOLDING, RESIN COAT When the outer coating is hot (over 100 °C) after soldering, it becomes soft and fragile. So please be careful not to give it mechanical stress. Failure to follow the above cautions may result, worst case, in a short circuit and cause fuming or partial dispersion when the product is used. 9. LIMITATION OF APPLICATIONS The products listed in the specification(hereinafter the product(s) is called as the “Product(s)”) are designed and manufactured for applications specified in the specification. (hereinafter called as the “Specific Application”) We shall not warrant anything in connection with the Products including fitness, performance, adequateness, safety, or quality, in the case of applications listed in from (1) to (11) written at the end of this precautions, which may generally require high performance, function, quality, management of production or safety. Therefore, the Product shall be applied in compliance with the specific application. WE DISCLAIM ANY LOSS AND DAMAGES ARISING FROM OR IN CONNECTION WITH THE PRODUCTS INCLUDING BUT NOT LIMITED TO THE CASE SUCH LOSS AND DAMAGES CAUSED BY THE UNEXPECTED ACCIDENT, IN EVENT THAT (i) THE PRODUCT IS APPLIED FOR THE PURPOSE WHICH IS NOT SPECIFIED AS THE SPECIFIC APPLICATION FOR THE PRODUCT, AND/OR (ii) THE PRODUCT IS APPLIED FOR ANY FOLLOWING APPLICATION PURPOSES FROM (1) TO (11) (EXCEPT THAT SUCH APPLICATION PURPOSE IS UNAMBIGUOUSLY SPECIFIED AS SPECIFIC APPLICATION FOR THE PRODUCT IN OUR CATALOG SPECIFICATION FORMS, DATASHEETS, OR OTHER DOCUMENTS OFFICIALLY ISSUED BY US*) 1. Aircraft equipment 2. Aerospace equipment 3. Undersea equipment 4. Power plant control equipment 5. Medical equipment 6. Transportation equipment 7. Traffic control equipment 8. Disaster prevention/security equipment 9. Industrial data-processing equipment 10. Combustion/explosion control equipment 11. Equipment with complexity and/or required reliability equivalent to the applications listed in the above. For exploring information of the Products which will be compatible with the particular purpose other than those specified in the specification, please contact our sales offices, distribution agents, or trading companies with which you make a deal, or via our web contact form. Contact form: https://www.murata.com/contactform *We may design and manufacture particular Products for applications listed in (1) to (11). Provided that, in such case we shall unambiguously specify such Specific Application in the specification without any exception. Therefore, any other documents and/or performances, whether exist or non-exist, shall not be deemed as the evidence to imply that we accept the applications listed in (1) to (11). EGLEDMNO03C Reference only

CLEANING 1-1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality, and select the solvent for cleaning. 1-2. Unsuitable cleaning may leave residual flux or other foreign substances, causing deterioration of electrical characteristics and the reliability of the capacitors. 1-3. To perform ultrasonic cleaning, observe the following conditions. Rinse bath capacity : Output of 20 watts per liter or less. Rinsing time : 5 min maximum. Do not vibrate the PCB/PWB directly. Excessive ultrasonic cleaning may lead to fatigue destruction of the lead wires. 2. SOLDERING AND MOUNTING 2-1. Insert the lead wire into the PCB with a distance appropriate to the lead space. If the lead wires are inserted into different spacing holes, cracks may occur in the outer resin or the internal element. 2-2. When bending the lead wire, excessive force applied to the capacitor body may cause cracks in the outer resin or the internal element. Hold the lead wire closer to the capacitor body than the lead wire bending position with the fixture, then bend it. (See the right figure) 2-3. When cutting and clinching the lead wire, do not apply excessive force to the capacitor body. 2-4. When soldering, insert the lead wire into the PCB without mechanically stressing the lead wire. 3. CAPACITANCE CHANGE OF CAPACITORS

Class 2 capacitors (Temp.Char. : X7R,X7S,X8L etc.) Class 2 capacitors an aging characteristic, whereby the capacitor continually decreases its capacitance slightly if the capacitor leaves for a long time. Moreover, capacitance might change greatly depending on a surrounding temperature or an applied voltage. So, it is not likely to be able to use for the time constant circuit. Please contact us if you need a detail information. 4. CHARACTERISTICS EVALUATION IN THE ACTUAL SYSTEM 4-1. Evaluate the capacitor in the actual system, to confirm that there is no problem with the performance and specification values in a finished product before using. 4-2. Since a voltage dependency and temperature dependency exists in the capacitance of Class 2 ceramic capacitors, the capacitance may change depending on the operating conditions in the actual system. Therefore, be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity, which will affect the capacitance value of the capacitor. 4-3. In addition, voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in the actual system. Evaluate the surge resistance in the actual system as required. 4-4. When using Class 2 ceramic capacitors in AC or pulse circuits, the capacitor itself vibrates at specific frequencies and noise may be generated. Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur. NOTE 1. Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2. You are requested not to use our product deviating from this product specification. EGLEDMNO03C Reference only

Application This product specification is applied to Leaded MLCC RDE series. 1.Specific applications: ･Consumer Equipment: Products that can be used in consumer equipment such as home appliances, audio/visual equipment, communication equipment, information equipment, office equipment, and household robotics, and whose functions are not directly related to the protection of human life and property. ･Industrial Equipment: Products that can be used in industrial equipment such as base stations, manufacturing equipment, industrial robotics equipment, and measurement equipment, and whose functions do not directly relate to the protection of human life and property. ･Medial Equipment [GHTF A/B/C] except for Implant Equipment: Products suitable for use in medical devices designated under the GHTF international classifications as Class A or Class B (the functions of which are not directly involved in protection of human life or property) or in medical devices other than implants designated under the GHTF international classifications as Class C (the malfunctioning of which is considered to pose a comparatively high risk to the human body). ･Automotive infotainment/comfort equipment: Products that can be used for automotive equipment such as car navigation systems and car audio systems that do not directly relate to human life and whose structure, equipment, and performance are not specifically required by law to meet technical standards for safety assurance or environmental protection. 2.Unsuitable Application: Applications listed in “Limitation of applications” in this product specification. 2. Rating

Part Number Configuration ex.) Series Temperature Rated Capacitance Capacitance Dimension Lead Individual Package Characteristics Voltage Tolerance (LxW) Style Specification
Temperature Characteristics
Rated Voltage
Capacitance The first two digits denote significant figures ; the last digit denotes the multiplier of 10 in pF. If there is a decimal point, it is expressed by the capital letter “R”. In this case, all figures are significant digits. ex.) In case of . 10 × 104 = 100000 pF In case of 9R0 . 9.0 pF TEIKAKU 25°C 104 Code Rated voltage 1H DC50V 2A DC100V B Temp. Temp. Range 5C C0G (EIA code) Reference only RDE 5C 1H 104 J 2 P1 H03

Capacitance Tolerance
Dimension (LxW) Please refer to [ Part number list ].
Lead Style *Lead wire is "solder coated CP wire".
Individual Specification Murata’s control code. Please refer to [ Part number list ].
Package 3. Marking Temp. char. : Letter code : A (C0G Char.) Capacitance : Actual numbers (Less than 100pF) 3 digit numbers (100pF and over) Capacitance tolerance : Code Rated voltage : Letter code : 5 (DC50V. Except dimension code : 0,1) Letter code : 1 (DC100V. Except dimension code : 0,1) Company name code : Abbreviation : (Except dimension code : 0,1) (Ex.) Rated voltage Dimension code TEIKAKU DC50V DC100V 0,1 Code Package A Taping type of Ammo B Bulk type P1 Outside crimp type 2.5+/-0.8 S1 Outside crimp taping type 2.5+0.4/-0.2 Lead spacing (mm) K1 Inside crimp type 5.0+/-0.8 M1 Inside crimp taping type 5.0+0.6/-0.2 D +/-0.5pF J +/-5% Code Lead Style Reference only Code Capacitance Tolerance C +/-0.25pF A 102J 104 J5A 223 J1A A 332J

Part number list Unit : mm PNLIST Pack qty. (pcs)L W W1 F T Reference only Customer Part Number Murata Part Number T.C. DC Rated Volt. (V) Cap. Cap. Tol. Dimension (mm) Dimension (LxW) Lead Style

Unit : mm PNLIST Pack qty. (pcs)L W W1 F T Reference only Customer Part Number Murata Part Number T.C. DC Rated Volt. (V) Cap. Cap. Tol. Dimension (mm) Dimension (LxW) Lead Style

Unit : mm PNLIST Pack qty. (pcs)L W W1 F T H/H0 Reference only Customer Part Number Murata Part Number T.C. DC Rated Volt. (V) Cap. Cap. Tol. Dimension (mm) Dimension (LxW) Lead Style

5.Specification No. Specification Test Method (Ref. Standard:JIS C 5101(all parts), IEC60384(all parts)) 1 No defects or abnormalities. Visual inspection. 2 Dimension and Within the specified dimensions and Visual inspection, Using Caliper. Marking Marking 3 Dielectric Between No defects or abnormalities. The capacitor should not be damaged when DC Strength Terminals voltage of 300% of the rated voltage is applied between the terminations for 1 to 5 seconds. (Charge/Discharge current ≦ 50mA.) No defects or abnormalities. The capacitor is placed in a container with metal balls of 1mm diameter so that each terminal, short-circuit, is kept approximately 2mm from the balls, and 250% of the rated DC voltage is impressed for 1 to 5 seconds between capacitor terminals and metal balls. (Charge/Discharge current ≦ 50mA.) 4 Insulation Between 10,000MΩ or 500MΩ・μF min. The insulation resistance should be measured with a Resistance Terminals (Whichever is smaller) DC voltage not exceeding the rated voltage at normal (I.R.) temperature and humidity and within 2 minutes of charging. (Charge/Discharge current ≦ 50mA.) 5 Capacitance Within the specified tolerance. The capacitance, Q should be measured at 25°C at the frequency and voltage shown in the table.

6 Q 30pF ≦ C : Q ≧ 1,000

30pF > C : Q ≧ 400+20C C : Nominal Capacitance (pF) 7 Capacitance Within the specified Tolerance. The capacitance change should be measured after 5 Temperature 25°C to 125°C : 0±30 ppm/°C minutes at each specified temperature stage. Characteristics -55°C to 25°C : 0+30/-72 ppm/°C The temperature coefficient is determined using the capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5 (-55°C to 125°C) the capacitance should be within the specified tolerance for the temperature coefficient and capacitance change as Table A. The capacitance drift is calculated by dividing the differences between the maximum and minimum measured values in the step 1, 3 and 5 by the capacitance value in step 3.

8 Terminal Tensile Termination not to be broken or As in the figure, fix the capacitor body,

Strength Strength loosened apply the force gradually to each lead in the radial direction of the capacitor until reaching 10N and then keep applied the force for 10±1 seconds. Bending Termination not to be broken or Each lead wire should be subjected to a force of 2.5N and then Strength loosened be bent 90° at the point of egress in one direction. Each wire is then returned to the original position and bent 90° in the opposite direction at the rate of one bend per 2 to 3 seconds. 9 Vibration Appearance No defects or abnormalities. The capacitor should be subjected to a simple Resistance Capacitance Within the specified tolerance. harmonic motion having a total amplitude of 1.5mm, Q 30pF ≦ C : Q ≧ 1,000 the frequency being varied uniformly between the 30pF > C : Q ≧ 400+20C approximate limits of 10Hz and 55Hz. The frequency range, from 10Hz to 55Hz and return to 10Hz, shall be C : Nominal Capacitance (pF) traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions (total of 6 hours). 10 Solderability Solder is deposited on unintermittingly The terminal of capacitor is dipped into a solution of immersed portion in axial direction rosin ethanol (25% rosin in weight propotion). covering 3/4 or more in circumferential Immerse in solder solution for 2±0.5 seconds. direction of lead wires. In both cases the depth of dipping is up to about 1.5 to 2mm from the terminal body. Temp. of solder : 245±5°C (Sn-3.0Ag-0.5Cu) ESRDE102D Reference only Test Item Appearance Terminal To External Resin F Nominal Cap. Frequency Voltage Step Temperature(°C) 1 25±2 2 -55±3 3 25±2 4 125±3 5 25±2

No. Specification Test Method (Ref. Standard:JIS C 5101(all parts), IEC60384(all parts)) 11-1 Resistance Appearance No defects or abnormalities. The lead wires should be immersed in the melted solder 1.5 to 2.0mm to Capacitance Within ±2.5% or ±0.25pF from the root of terminal at 260±5°C for 10±1 seconds. Soldering Change (Whichever is larger) Heat Dielectric No defects • Post-treatment (Non- Strength Capacitor should be stored for 24±2 hours at *room condition. Preheat) (Between terminals) 11-2 Resistance Appearance No defects or abnormalities. First the capacitor should be stored at 120+0/-5°C for 60+0/-5 seconds. to Capacitance Within ±2.5% or ±0.25pF Then, the lead wires should be immersed in the melted solder Soldering Change (Whichever is larger) 1.5 to 2.0mm from the root of terminal at 260±5°C for 7.5+0/-1 seconds. Heat Dielectric No defects (On-Preheat) Strength • Post-treatment (Between Capacitor should be stored for 24±2 hours at *room condition. terminals) 11-3 Resistance Appearance No defects or abnormalities. Test condition to Capacitance Within ±2.5% or ±0.25pF Temperature of iron-tip : 350±10°C Soldering Change (Whichever is larger) Soldering time : 3.5±0.5 seconds Heat Dielectric No defects Soldering position (soldering Strength Straight Lead : 1.5 to 2.0mm from the root of terminal. iron method) (Between Crimp Lead : 1.5 to 2.0mm from the end of lead bend. terminals)

Post-treatment Capacitor should be stored for 24±2 hours at *room condition. 12 Temperature Appearance No defects or abnormalities. Repeat 5 cycles according to the 4 heat treatments Cycle Capacitance Within ±5% or ±0.5pF listed in the following table. Change (Whichever is larger) Set at *room condition for 24±2 hours, then measure. Q 30pF ≦ C : Q ≧ 350 10pF ≦ C < 30pF : Q ≧ 275+5C/2 10pF > C : Q ≧ 200+10C C : Nominal Capacitance (pF) I.R. 1,000MΩ or 50MΩ・μF min. (Whichever is smaller) Dielectric No defects or abnormalities. Strength (Between Terminals) 13 Humidity Appearance No defects or abnormalities. Set the capacitor at 40±2°C and relative humidity 90 to 95% (Steady Capacitance Within ±5% or ±0.5pF for 500+24/-0 hours. State) Change (Whichever is larger) Remove and set for 24±2 hours at *room condition, then measure. Q 30pF ≦ C : Q ≧ 350 10pF ≦ C < 30pF : Q ≧ 275+5C/2 10pF > C : Q ≧ 200+10C C : Nominal Capacitance (pF) I.R. 1,000MΩ or 50MΩ・μF min. (Whichever is smaller) 14 Humidity Appearance No defects or abnormalities. Apply the rated voltage at 40±2°C and relative humidity of 90 to 95% Load Capacitance Within ±5% or ± 0.5pF for 500+24/-0 hours. Change (Whichever is larger) Remove and set for 24±2 hours at *room condition, then measure. Q 30pF ≦ C : Q ≧ 200 (Charge/Discharge current ≦ 50mA) 30pF > C : Q ≧ 100+10C/3 C : Nominal Capacitance(pF) I.R. 500MΩ or 25MΩ・μF min. (Whichever is smaller) * “room condition” Temperature : 15 to 35°C, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa ESRDE102D Reference only Test Item Step 1 2 3 4 Max. Operating Temp. ±3 Room Temp. Time (min.) 303 3 max. 303 3 max. Room Temp. Temp. (°C) Min. Operating Temp. ±3

No. Specification Test Method (Ref. Standard:JIS C 5101(all parts), IEC60384(all parts)) 15 High Appearance No defects or abnormalities. Apply 150% of the rated voltage at the maximum Temperature Capacitance Within ±3% or ±0.3pF operating temperature ±3°C for 1000+48/-0 hours. Load Change (Whichever is larger) Remove and set for 24±2 hours at *room condition, then measure. Q 30pF ≦ C : Q ≧ 350 (Charge/Discharge current ≦ 50mA) 10pF ≦ C < 30pF : Q ≧ 275+5C/2 10pF > C : Q ≧ 200+10C C : Nominal Capacitance (pF) I.R. 1,000MΩ or 50 MΩ・μF min. (Whichever is smaller) Marking Legible 16 Solvent Appearance No defects or abnormalities. The capacitor should be fully immersed, unagitated, Resistance Marking Legible in reagent at 20 to 25°C for 30±5 seconds and then remove gently. Marking on the surface of the capacitor shall immediately be visually examined. Regent : Isopropyl alcohol * “room condition” Temperature : 15 to 35°C, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa ESRDE102D Reference only Test Item

Packing specification ・Bulk type (Packing style code : B) The size of packing case and packing way The number of packing = *1 Packing quantity × *2 n *1 : Please refer to [Part number list]. *2 : Standard n = 20 (bag) Note) The outer package and the number of outer packing be changed by the order getting amount. JKBCRPE02A Reference only 340 max. 125 max. 270 max. Partition Unit : mm Plastic bag

・Ammo pack taping type (Packing style code : A) A crease is made every 25 pitches, and the tape with capacitors is packed zigzag into a case. When body of the capacitor is piled on other body under it. The size of packing case and packing way EKTRPE01 Reference only Position of label 51 max. 340 max. 240 max. Unit : mm Base tape Capacitor Hold down tape Hold down tape upper

Taping specification 7-1. Dimension of capacitors on tape Inside crimp taping type < Lead Style : M1 > Pitch of component 12.7mm / Lead spacing 5.0mm Unit : mm Item Code Dimensions Remarks Pitch of component P 12.7+/-1.0 Pitch of sprocket hole P0 12.7+/-0.2 Lead spacing F 5.0+0.6/-0.2 Length from hole center to lead P1 3.85+/-0.7 Deviation along tape, left or right defect ΔS 0+/-2.0 They include deviation by lead bend Carrier tape width W 18.0+/-0.5 Position of sprocket hole W1 9.0+0/-0.5 Deviation of tape width direction Protrusion length ℓ 0.5 max. Diameter of sprocket hole ΦD0 4.0+/-0.1 Lead diameter Φd 0.5+/-0.05 Total tape thickness t1 0.6+/-0.3 Total thickness of tape and lead wire t2 1.5 max. Δh1 Δh2 Portion to cut in case of defect L 11.0+0/-1.0 Hold down tape width W0 9.5 min. Hold down tape position W2 1.5+/-1.5 Coating extension on lead e ETP1M101A Up to the end of crimp Lead distance between reference and bottom plane H0 16.0+/-0.5 They include hold down tape thickness Deviation across tape 2.0 max. (Dimension code : W) 1.0 max. (except as above) Reference only Length from hole center to component center P2 6.35+/-1.3 Deviation of progress direction P2 P L ΦD0 W Δh1 Marking Δh2 ΔSt1 W2F e Φd

Outside crimp taping type < Lead Style : S1 > Pitch of component 12.7mm / Lead spacing 2.5mm Unit : mm Item Code Dimensions Remarks Pitch of component P 12.7+/-1.0 Pitch of sprocket hole P0 12.7+/-0.2 Lead spacing F 2.5+0.4/-0.2 Length from hole center to lead P1 5.1+/-0.7 Deviation along tape, left or right defect ΔS 0+/-2.0 They include deviation by lead bend Carrier tape width W 18.0+/-0.5 Position of sprocket hole W1 9.0+0/-0.5 Deviation of tape width direction Protrusion length ℓ 0.5 max. Diameter of sprocket hole ΦD0 4.0+/-0.1 Lead diameter Φd 0.5+/-0.05 Total tape thickness t1 0.6+/-0.3 Total thickness of tape and lead wire t2 1.5 max. Δh1 Δh2 Portion to cut in case of defect L 11.0+0/-1.0 Hold down tape width W0 9.5 min. Hold down tape position W2 1.5+/-1.5 Coating extension on lead e ETP1S101A Up to the end of crimp Lead distance between reference and bottom plane H0 16.0+/-0.5 They include hold down tape thickness Deviation across tape 1.0 max. Reference only Length from hole center to component center P2 6.35+/-1.3 Deviation of progress direction P2 P L fD0 W Dh1 Dh2 DS Marking F e fd

7-2. Splicing way of tape 1) Adhesive force of tape is over 3N at test condition as below. 2) Splicing of tape (a) When base tape is spliced

Base tape shall be spliced by cellophane tape. (Total tape thickness shall be less than 1.05mm.) (b) When hold down tape is spliced
Hold down tape shall be spliced with overlapping. (Total tape thickness shall be less than 1.05mm.) (c) When both tape are spliced
Base tape and hold down tape shall be spliced with splicing tape. 3) Missing components
There should be no consecutive missing of more than three components.
The number of missing components should be not more than 0.5 % of total components that should be present in a Ammo pack. ETP2R01A Reference only W Hold down tape Base tape Unit : mm Progress direction in production line Hold down tape Base tape Cellophane tapeAbout 30 to 50No lifting for the direction of progressing 20 to 30 Hold down tape Base tapeProgress direction in production line Unit : mm

Product Information

RDE5C1H102J0S1H03A specifications and overview.

Summary

Ceramic Capacitors(Lead) Apr. 2024

Description

Ceramic Capacitors(Lead) Apr. 2024

Source title RDE5C1H102J0S1H03A Datasheet(PDF) - Murata Manufacturing Co., Ltd

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