RDBLS207G TSC | Alldatasheet

Document overview

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Technical content

  • Ideal for automated placement - Reliable low cost construction utilizing molded plastic technique - High surge current capability - Halogen-free according to IEC 61249-2-21 Molding compound, UL flammability classification rating 94V-0 Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test VRRM V VRMS V VDC V IF(AV) A I2tA 2s trr ns TJ °C TSTG °C Note 2: Reverse recovery time test conditions: IF=0.5A, IR=1.0A, IRR=0.25A Document Number: DS_D0000152 Version: A15 Storage temperature range - 55 to +150 IR 500Maximum reverse current @ rated VR TJ=25°C TJ=125°C Maximum instantaneous forward voltage (Note 1) IF= 2 A VF V μA Operating junction temperature range - 55 to +150 Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 10.3 Note 1: Pulse test with PW=300μs,1% duty cycle Typical thermal resistance RθJL RθJA 62 °C/W A PARAMETER SYMBOL 1.15 UNIT Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Rating for fusing (t<8.3ms) Maximum average forward rectified current - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC MECHANICAL DATA Case: Molded plastic body Taiwan Semiconductor 2A, 1000V Fast Recovery Glass Passivated Bridge Rectifier

FEATURES

Moisture sensitivity level: level 1, per J-STD-020 RDBLS207G 1000 700 1000 Maximum reverse recovery time (Note 2) 300 Polarity: Polarity as marked on the body Weight: 0.36 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)

PART NO. *: Optional available PART NO. (TA=25°C unless otherwise noted) Document Number: DS_D0000152 Version: A15 1,500 / 13" Paper reel PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX

DESCRIPTION

SUFFIX (*) PACKAGE PACKING H C1 GD B L S 50 / Tube RD RDBLS207G Taiwan Semiconductor PART NO. SUFFIX

ORDERING INFORMATION

RATINGS AND CHARACTERISTICS CURVES PREFERRED P/N RDBLS207GRDBLS207GHRDG RDBLS207G EXAMPLE 0.5 1.5 2.5 0 20 40 60 80 100 120 140 160 AVERAGE FORWARD CURRENT (A) LEAD TEMPERATURE (°C) FIG.1 FORWARD CURRENT DERATING CURVE Resistive of inductive load with heatsink 1 10 100 PEAK FORWARD SURGE CURRENT (A) NUMBER OF CYCLES AT 60 Hz FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms single half sine wave 0.01 0.1 100 0 2 04 06 08 0 1 0 0 INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG. 2 TYPICAL REVERSE CHARACTERISTICS TJ=25°C TJ=125°C 0.1 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 4 TYPICAL FORWARD CHARACTERISTICS TJ=25°C TJ=125°C

A 5.00 5.20 0.197 0.205 B 1.02 1.20 0.040 0.047 C 8.13 8.51 0.320 0.335 D 2.40 2.60 0.094 0.102 E 9.80 10.30 0.386 0.406 F 6.20 6.50 0.244 0.256 G 0.22 0.33 0.009 0.013 H 1.02 1.53 0.040 0.060 I 0.076 0.33 0.003 0.013 J 3.90 4.10 0.154 0.161 Symbol A B C D E F P/N = Specific Device Code G = Green Compound YW = Date Code F = Factory Code Document Number: DS_D0000152 Version: A15 0.091 0.051 0.272 0.453 0.102 0.362 2.6 9.2 MARKING DIAGRAM SUGGESTED PAD LAYOUT Unit (mm) 2.3 1.3 6.9 11.5 Unit (inch) RDBLS207G Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) DBLS 100 1 10 100 CAPACITANCE (pF) A REVERSE VOLTAGE (V) FIG. 5 TYPICAL JUNCTION CAPACITANCE f=1.0MHz Vsig=50mVp-p

assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D0000152 Version: A15 RDBLS207G Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,