RDBG1-25SE1 HIROSE | Alldatasheet
Document overview
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Technical content
0 : HRS RD><G SERIES General The “RDG” Series Right-angled D-Subminiature con- The PCB mounting section has been reduced in size nectors are specially developed to answer the needs while the mating section maintains the same configura- for smaller and lighter equipment such as personal tion as the conventional models. computers peripherals and workstations. Female 9, 15 and 25 position sizes are available. : J] a a - me i ’ oo + EHH A BN oot — ae RAtMHU MMM amen | | | het ss atc a af nf Will _ eS \\ Conve RSA PDE ROP) TT —— <x) “aan am Aw iilitlisiltd | _ _ | oe ee ee ee ee _ Space} saving fine (RY*G) Features . Conventional type (RD*D) —_Space-saving type (RD*G) (1) 35% Space-saving is achieved in terms of depth Te and mounting area as compared to the convention- Lc al models (HIROSE’s RD%D) LH (2) Weight is approximately 10% less than convention- * ry al models. wih 5.08 | Yl ase (3) Full interchangeability in terms of mating with con- 731 ventional D-Subminiature connectors. The mating section meets the international standard, (4) For smoother insertion and withdrawal, reliable (7) Two lock pin lengths for substrate thickness: (same as the conventional models). (8) There are two Dip post lengths of 3.5mm and (5) The lock pin grounding system which solders 2.8mm. directly to the substrate eliminates troublesome (9) The new connectors are suitable for robotic inser- hold down hardware. tion. (6) Since they are fixed to the insulator (caulked), the (10) UL94V-0 insulator material offers excellent heat metallic shells and lock pins do not become loose resistant and chemical resistant capability. even when the lock screws are removed. This has (11) Metal shell structure offers improved grounding improved assembly productivity of the units. and EMI immunity.
Applications
Electronic equipment such as personal computers, peripherals, workstations, measuring instruments, communica- tions equipment, FA and control devices.
[sia [comner[Niteroitrg [nswitor [Por edn [eucktuwa, | : Product Numbering System , R_D 1 t T - 25 SE 1 , | (1) Series name: D Sub-right angled (2) Shell size: E (9), A (15), B (25) (3) Model type: G=Space saving type (4) Dip post length: Blank=3.5mm (.138") 1=2.8mm (.110") (5) No of contacts: 9, 15, 25 (6) Connector style: S=Female (7) Mounting style: E=Grounding lock pin (Note) Locking screws are available separately.
B PLL gpg | wm: epee eet I ——— eee Ze { 7 B RDBG-25SE1 1 rH 6 =e | (Garam: Fe ‘ aan iy a mL — WY HEH + y 0.64 S a 5.08 2.54 Unit: mm Applicable HRS No. Part Number No. of Contacts} A c substrate thickness CL211-6200-7 | RDEG-SSET | 16.34 | is | | CL2i7-6201-0 | ROEG-9SE2 | [42] RDAG-15SE1 30.14 | 3332 | 2466 [ 16 | CL211-5205-0 [ RDAG-15SE2 : ° " CL211-5206-3 | RDBG-25SE1 404 38.38 [16 | ROBG-25SE2 | 32 | RDEG-9SET 1634 [4.6 | RDEG1-9SE2 : [42] CL211-5254-6 | RDAG1-15SE1 9332 28 [16 | CL211-5255-9 | RDAG1-15SE2 “ CL211-5256-1 | RDBG1-25SE1 C1211-5257-4 | RDBG1-25S62 | = | soe | aoe | 88 [2
a < ‘ 5 2, 6 = BI Washer cLait-s182-7-01 RDG-LNA-W2(01) pd M2.6X0.45 : Female thread Applicable panel | Packaging unit SDS TRAIT [e200 | ROG-INAAWON waexoas [1+ oan _| ROG-INAW2I0N [2 oe] ADG-LNAVG-40}09) [0 20] €L211-5184-2-01 | RDG-LNA(4-40)-W1(01) No.aaounc | 7 at | RDG-LNA(@-40-W2(01) er es ee *All models are nickel-plated Panel Mounting Dimensions ; For hexagon locking screws a — _ 4-RL6 / 10° Unit: mm [= | me [ma | [a [a [ms | [8 [wo [aa
PC Board Layout (mm) : @ RDEG-9SE1 (Substrate thickness t=1.6) @ RDEG1-9SE1 (Substrate thickness t=1.6) @ RDEG-9SE2 (Substrate thickness t=1.2) @ RDEG1-9SEz (Substrate thickness t=1.2) ore} 59 - NST ° a? 1,37 z py 4 5 24.99 a Edge of substrate (Open side of connector) 2 @ RDAG-15SE1 (Substrate thickness t=1.6) @ RDAG1-15SE1 (Substrate thickness t=1.6) @ RDAG-15SE2 (Substrate thickness t=1.2) 96 @ RDAG1-15SE2 (Substrate thickness t=1.2) 6.86 15-41 al o , 1.37 ba 7, 2m |e 5.49 2 2» 5 ; » 8.23 = v 33.32 Edge of substrate (pen side of connector) @ RDBG-25SE1 (Substrate thickness t=1.6) 16.56 @ RDBG1-25SE1 (Substrate thickness t=1.6) 13.82 @ RDBG-25SEz (Substrate thickness t=1.2) 1.08 @ RDBG1-25SE2 (Substrate thickness t=1.2) 3.28 25-41 5.54 aN 2.77 = 14 2 Ry 4.14 5 Ry 6.91 °
968 Eaige of substrate
12.42 (pen side of connector) 15.19 47.04