RD3CYD08 RENESAS | Alldatasheet
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
Features
- Supplied on emboss taping for high-speed automatic mounting.
- Supply voltage range : 2.0 to 3.6 V
- Operating temperature range : –40 to +85°C
- High drive current IOH short = –130 mA (typ) (@VCC = 3.3 V)
- Low sink current IOL short = 45 mA (typ) (@VCC = 3.3 V)
- Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) RD3CYD08CME CMPAK-5 pin PTSP0005ZC–A (CMPAK-5V) CM E (3,000 pcs/reel) RD3CYD08VSE VSON-5pin PUSN0005KA–A (TNP-5DV) VS E (3,000 pcs/reel) Outline and Article Indication
- RD3CYD08 Marking = Control code D 3 Index band CMPAK–5
REJ03D0179-0600 Rev.6.00 Apr 22, 2008 Page 2 of 7 Outline and Article Indication
- RD3CYD08 Marking = Control code D 3 VSON-5 Pin Arrangement (Top view) VCC1 IN B IN A GND OUT Y Logic Diagram YA B Function Table Inputs A B Output Y L L L H L L L H L H H H H : High level L : Low level
REJ03D0179-0600 Rev.6.00 Apr 22, 2008 Page 3 of 7 Block Diagram A input B input Internal circuit Y output Absolute Maximum Ratings Item Symbol Ratings Unit Test Conditions Supply voltage range V CC –0.5 to 4.6 V Input voltage range *1 V I –0.5 to V CC + 0.5 V Output voltage range *1, 2 V O –0.5 to V CC + 0.5 V Input clamp current I IK ±50 mA V I < 0 or VI > VCC Output clamp current I OK ±50 mA V O < 0 or VO > VCC –200 V O = 0 Continuous output current I O 100 mA VO = VCC Continuous current through VCC or GND ICC or IGND ±200 mA Maximum power dissipation at Ta = 25°C (in still air) *3 PT 200 mW Storage temperature Tstg –65 to 150 °C Notes: The absolute maximum ratings are values, which mu st not individually be exceeded, and furthermore no two of which may be realized at the same time. 1. The input and output voltage rati ngs may be exceeded if the input and output clamp-current ratings are observed. When Over shoot / Under shoot pulse width is under 10 ns, input and output voltage permit to –1.5 V or VCC+1.5V. 2. This value is limited to 4.6 V maximum. 3. The maximum package power dissipation was calc ulated using a junction temperature of 150°C. Recommended Operating Conditions Item Symbol Min Max Unit Conditions Supply voltage range V CC 2.0 3.6 V Input voltage range V I 0 V CC V Output voltage range V O 0 V CC V Operating free-air temperature Ta –40 85 °C Note: Unused or floating inputs must be held high or low.
REJ03D0179-0600 Rev.6.00 Apr 22, 2008 Page 4 of 7 Electrical Characteristic Ta = –40 to 85°C Item Symbol V CC (V) Min Typ Max Unit Test condition 2.5 — 0.35 — Input voltage VH 3.3 — 0.40 — V 2.5 –55 –75 –95 IOH short 3.3 –100 –130 –160 VO = 0 V 2.5 20 30 40 Output current IOL short 3.3 30 45 60 mA VO = VCC Input current I IN 3.6 — — ±5 µA V IN = 3.6 V or GND Quiescent supply current ICC 3.6 — — 10 µA VIN = VCC or GND, IO = 0 Input capacitance C IN 3.3 — 2.5 — pF V IN = VCC or GND Switching Characteristics VCC = 2.5 V Ta = –40 to 85°C Item Symbol Min Typ Max Unit Test Conditions FROM (Input) TO (Output) td(ON) — — 65 Propagation delay time td(OFF) — — 200 Output rise time t r — — 700 Output fall time t f — — 2000 ns CL = 6500 pF A or B Y VCC = 3.3 ± 0.3 V Ta = –40 to 85°C Item Symbol Min Typ Max Unit Test Conditions FROM (Input) TO (Output) td(ON) — — 50 Propagation delay time td(OFF) — — 160 Output rise time t r — — 500 Output fall time t f — — 1500 ns CL = 6500 pF A or B Y
REJ03D0179-0600 Rev.6.00 Apr 22, 2008 Page 5 of 7 Test Circuit Pulse Generator outZ = 50 Ω CL = 6500 pF Input Output VCC Note: CL includes probe and jig capacitance. Waveforms Input 10% VIH VOH VOL GND tr 50% 50% tftd(ON) td(OFF) 90% 10% 90% Output Note: Input waveform : duty cycle 50%
REJ03D0179-0600 Rev.6.00 Apr 22, 2008 Page 6 of 7 Application Note (Strobe circuit) IGBT Driver Lineup TYPE No. Specification RD5CYD08 RD5CYDT08 RD3CYD08 Package CMPAK-5 IGBT Lineup TYPE No. Specification Package TSSOP-8 Combination example SYSTEM IGBT IGBT Driver Control IC 3.3 V RD5CYD08 RD5CYDT08
3.3 V signal
5.0 V signal
5.0 V Trigger trance Xenon tube IGBT Luminescence Circuit IGBT Driver Control IC RD3CYD08 RD3CYDT08 CMPAK-5 VSON-5 RD3CYDT08 CMPAK-5 RJP4002ANS RJP4002ASA RJP4003ANS RJP4003ASA TSSOP-8 VSON-8 VSON-8 RJP4003ANS RJP4003ASA RJP4002ANS RJP4002ASA VCES = 400V(max), ICP = 150A(max), 4V drive VCES = 400V(max), ICP = 150A(max), 2.5V drive VCES = 400V(max), ICP = 150A(max), 4V drive VCES = 400V(max), ICP = 150A(max), 2.5V drive VCC = 2.0 to 3.6V CMOS lever input IOH(short) = -130mA(typ) @ VCC = 3.3V IOL(short) = 45mA(typ) @ VCC = 3.3V VCC = 2.0 to 3.6V CMOS lever input IOH(short) = -130mA(typ) @ VCC = 3.3V IOL(short) = 45mA(typ) @ VCC = 3.3V VCC = 4.0 to 6.0V CMOS lever input IOH(short) = -130mA(typ) @ VCC = 5.0V IOL(short) = 40mA(typ) @ VCC = 5.0V VCC = 4.0 to 6.0V TTL lever input IOH(short) = -130mA(typ) @ VCC = 5.0V IOL(short) = 40mA(typ) @ VCC = 5.0V
REJ03D0179-0600 Rev.6.00 Apr 22, 2008 Page 7 of 7 Package Dimensions e A EH E L Q c D b AA Pattern of terminal position areas e LP S AA2 A b c D E e HE L LP x y Q 0.8 0.8 0.15 0.1 1.8 1.15 1.8 0.3 0.2 0.22 0.25 0.9 0.13 0.11 2.0 1.25 0.65 2.1 1.5 0.25 1.1 0.1 1.0 0.3 0.2 0.15 2.2 1.35 2.4 0.7 L 1 0.1 0.5 0.6 0.05 0.05 0.35 0.9 Dimension in MillimetersReference Symbol Min Nom Max ASMx Sy SC-88A 0.006g MASS[Typ.] CMPAK-5 / CMPAK-5VPTSP0005ZC-A RENESAS CodeJEITA Package Code Previous Code b A-A Section c E D E b A H c L 1.0 ±0.1 0.1()0.1() 0.30.20.15 1.31.1 1.55 1.61.55 0.12 0.5e e Lp x y 0.2 1.65 1.65 0.220.07 c ZD b A E D b HE 0.6 1.2 1.6 Reference Symbol Dimension in Millimeters Min Nom Max P-USON5-1.2x1.6-0.50 0.002g MASS[Typ.] TNP-5D/TNP-5DVPUSN0005KA-A RENESAS CodeJEITA Package Code Previous Code
Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas. 13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have any other inquiries. Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan http://www.renesas.com Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2377-3473 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 RENESAS SALES OFFICES © 2008. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .7.2