RD05

RD05 LUMILEDS | Alldatasheet

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Reliability Datasheet RD05 Agilent HPWT-TH00/FH00/TL00/FL00

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The following cumulative test results have been obtained from testing performed at Agilent Technologies in accordance with the latest revision of MIL-STD-883. Agilent tests parts at the absolute maximum rated conditions recommended for the device. The actual performance you obtain from Agilent parts depends on the electrical and environmental characteristics of your applicatio n, but will probably be better than the performance outlined in Table 1. SnapLED 70 Emitter Reliability Data Sheet TTaabbllee 11:: LLiiffee TTeessttss DDeemmoonnssttrraatteedd PPeerrffoorrmmaannccee PPooiinntt TTyyppiiccaall PPeerrffoorrmmaannccee SSttrreessss TTeesstt TToottaall UUnniittss UUnniittss FFaaiilluurree RRaattee CCoolloorrss CCoonnddiittiioonnss DDeevviiccee HHoouurrss TTeesstteedd FFaaiilleedd MMTTBBFF ((%% //11KK HHoouurrss)) TS AllnGaP T A = 55°C, 70,000 70 0 70,000 < 1.429 Amber and I F = 70 mA Red-Orange TS AllnGaP T A = 85°C, 42,000 42 0 42,000 < 2.381 Amber and I F = 70 mA Red-Orange TS AllnGaP T A = 25°C, 42,000 42 0 42,000 < 2.381 Amber and I F = 70 mA Red-Orange TS AllnGaP T A = 85°C, 85% RH 42,000 42 0 42,000 < 2.381 Amber and I F = 70 mA Red-Orange Failure Rate Prediction The failure rate of semiconductor devices is determined by the junction temperature of the device. The relationship between ambient temperature and 2 actual junction temperature is given by the following: TJ (°C) = TA (°C) + θJA PAVG where: TA = ambient temperature in °C θJA = thermal resistance of junction-to-ambient in °C/watt PAVG = average power dissipated in watts The estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using an Arrhenius model for temperature acceleration. Results of such calculations are shown in the table on the following pag e using an activation energy of 0.43 eV (reference MIL-HDBK-217).

SnapLED 70 Emitter Reliability Datasheet RD05 (3/04) 2 TTaabbllee 22:: FFaaiilluurree RRaattee PPrreeddiiccttiioonn ((IIFF -- 7700mmAA)) PPooiinntt TTyyppiiccaall PPeerrffoorrmmaannccee PPeerrffoorrmmaannccee iinn TTiimmee [[11]] iinn TTiimmee [[22]] ((6600%% CCoonnffiiddeennccee)) ((9900%% CCoonnffiiddeennccee)) AAmmbbiieenntt JJuunnccttiioonn FFaaiilluurree RRaattee FFaaiilluurree RRaattee TTeemmppeerraattuurree ((°°CC)) TTeemmppeerraattuurree ((°°CC)) MMTTBBFF [[11]] ((%%//11KK HHoouurrss)) MMTTBBFF [[22]] ((%%//11KK HHoouurrss)) 85 110 23,000 4.314 10,000 9.932 75 100 33,000 3.044 14,000 7.009 65 90 47,000 2.107 21,000 4.852 55 80 70,000 1.429 30,000 3.289 45 70 106,000 0.947 46,000 2.180 35 60 163,000 0.612 71,000 1.410 25 50 259,000 0.385 113,000 0.887 NNootteess:: [1] The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number of failures. In the case of zero failures, one failure is assumed for this calculation. [2] The 90% Confidence MTBF represents the minimum level of reliability performance which is expected from 90% of all samples. This confi- dence interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is commonly used in describing useful life failures. Refer to MIL-STD-690B for details on this methodology. [3] A failure is any LED which does not emit light and max. % I v degradation is > 50%. [4] Assuming 115°C/W of θJA Example of Failure Rate Calculation Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given 168 hours/week is: (8 hours/day) x (5 days/week) / (168 hours/week) = 0.25 The point failure rate per year (8760 hours) at 25°C ambient temperature is: (0.060% / 1K hours) x (0.25) x (8760 hours/year) = 0.131% per year Similarly, 90% confidence level failure rate per year at 25°C: (0.137% / 1K hours) x (0.25) x (8760 hours/year) = 0.300% per year TTaabbllee 33:: EEnnvviirroonnmmeennttaall TTeessttss TTeesstt NNaammee RReeffeerreennccee TTeesstt CCoonnddiittiioonnss UUnniittss TTeesstteedd UUnniittss FFaaiilleedd Temperature Cycle MIL-STD-883 -55 °C to 100°C, 15 min. dwell, 5 min. transfer Method 1010 20 cycles 6090 0 100 cycles 6090 0 Temperature Cycle MIL-STD-883 -40 °C to 120°C, 15 min. dwell, 5 min. transfer Method 1010 20 cycles 1071 0 100 cycles 1071 0 Power Temperature Internal -40 °C to 85°C, 18 min. dwell, 42 min. transfer, Cycle Reference 70 mA, 5 min on/off 100 cycles 98 0

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