RCLAMP0561Z SEMTECH | Alldatasheet

Document overview

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Technical content

Features

  • High ESD withstand voltage Œ IEC 61000-4-2 (ESD) 15kV (air), 12kV (contact)
  • Ultra-Low capacitance: 0.12pF Typical
  • Very small PCB area
  • Protects one high-speed data line
  • Working voltage: 5.5V
  • Low reverse leakage current: 50nA max at VR=5.5V
  • Low Insertion Loss: 0.15dB (Typical) at 5GHz
  • Large operating bandwidth: 17.5GHz
  • Solid-state silicon-avalanche technology Mechanical Characteristics
  • SGP0603P2X3 Package
  • Pb-Free, Halogen Free, RoHS/WEEE Compliant
  • Nominal Dimensions: 0.62 x 0.32 x 0.30 mm
  • Lead Finish: NiPdAu
  • Marking : Marking Code
  • Packaging : Tape and Reel

Applications

  • HDMI 1.4 and HDMI 2.0
  • USB 3.0 and USB 3.1
  • USB Type-C
  • Thunderbolt
  • MIPI / MDDI
  • 10GbE
  • DVI Nominal Dimensions in mm Nominal Dimensions Schematic and Pin Configuration Femto Farad RailClamp® 1-Line, 120fF ESD Protection for High-Speed Lines RClamp0561Z (Bottom View)

Description

RClamp®0561Z is an ultra low capacitance ESD protection device specifically designed to protect high- speed differential lines. It offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. RClamp0561Z features extremely good ESD protection characteristics highlighted by low peak ESD clamping voltage, and high ESD withstand voltage (+/-12kV contact per IEC 61000-4-2). RClamp0561Z has a typical capacitance of 0.12pF allowing it to be used in high bandwidth applications such as HDMI 2.0 4K/2K, Thunderbolt, and USB 3.1. Each device will protect one high-speed data line operating up to 5.5 volts. RClamp0561Z is in a 2-pin SGP0603P2X3 package measuring 0.62 x 0.32 mm with a nominal height of only 0.30mm. Leads are finished with NiPdAu. The small package gives the designer the flexibility to protect single lines in applications where arrays are not practical. 0.32 0.62 0.17 0.385 BSC 0.22 0.30

Final Datasheet Rev 6.1 May 19, 2017 www.semtech.com Semtech Absolute Maximum Ratings Electrical Characteristics (T=25OC unless otherwise specified) Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) PPK 50 W Peak Pulse Current (tp = 8/20µs) IPP 2.5 A ESD per IEC 61000-4-2 (Air)(1) ESD per IEC 61000-4-2 (Contact)(1) VESD ±15 ±12 kV Operating Temperature TJ -40 to +85 OC Storage Temperature TSTG -55 to +150 OC Parameter Symbol Conditions Min. Typ. Max. Units Reverse Stand-Off Voltage VRWM -40OC to 85OC 5.5 V Reverse Breakdown Voltage VBR It = 1mA, -40OC to 85OC 6.5 9.5 10.5 V Reverse Leakage Current IR VRWM = 5.5V T = 25OC 0.1 50 nA T = 85OC 1 150 nA Clamping Voltage VC IPP = 2A, tp = 8/20µs, 16.5 20 V ESD Clamping Voltage2 VC IPP = 4A, tp = 0.2/100ns (TLP) 17 V ESD Clamping Voltage2 VC IPP = 16A, tp = 0.2/100ns (TLP) 36 V Dynamic Resistance2, 3 RDYN tp = 0.2/100ns (TLP) 1.5 Ohms Junction Capacitance CJ VR = 0V, f = 1MHz T = 25OC 0.12 0.15 pF Cutoff Frequency FC -3dB 17.5 GHz Notes: (1): Measured with a 40dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to Ground Refer- ence Plane (GRP) (2): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. (3): Dynamic resistance calculated from ITLP = 4A to ITLP = 16A

Final Datasheet Rev 6.1 May 19, 2017 www.semtech.com Semtech Typical Characteristics ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) TLP IV Curve Capacitance vs. Reverse Voltage 0 10 20 30 40 50 60 70 TLP Current (A) Clamping Voltage (V) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 0123456 Junction Capacitance - CJ (pF) Voltage (V) f = 1 MHz 0 5 10 15 20 Insertion Loss (dB) Frequency (GHz) RClamp0561Z‐SW‐SPCD‐IL 0.40 dB @ 10GHz 0.15 dB @ 5GHz 0.05 0.1 0.15 0.2 0.25 -50 -35 -20 -5 10 25 40 55 70 85 100 Junction Capacitancs - CJ (pF) Temperature (°C) f = 1MHz VR = 0V 100 120 140 160 180 -10 0 10 20 30 40 50 60 70 80 Clamping Voltage - VC (V) Time (ns) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane. -180 -160 -140 -120 -100 -80 -60 -40 -20 -10 0 10 20 30 40 50 60 70 80 Clamping Voltage - VC (V) Time (ns) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane. Insertion Loss (S21) Capacitance vs. Temperature

Final Datasheet Rev 6.1 May 19, 2017 www.semtech.com Semtech Typical Characteristics (Continued) 5Gb/s (USB 3.0) Eye Diagram with RClamp0561Z 5Gb/s (USB 3.0) Eye Diagram without RClamp0561Z 10Gb/s (USB 3.1) Eye Diagram with RClamp0561Z 10Gb/s (USB 3.1) Eye Diagram without RClamp0561Z 3.4Gb/s (HDMI) Eye Diagram with RClamp0561Z Horizontal Scale: 49ps/div Vertical Scale: 200mV/div Data Rate: 3.4 Gb/s Mask: HDMI 1.4 Horizontal Scale: 49ps/div Vertical Scale: 200mV/div Data Rate: 3.4 Gb/s Mask: HDMI 1.4 Horizontal Scale: 16.6ps/div Vertical Scale: 200mV/div Data Rate: 10.0 Gb/s Mask: USB 3.1 Horizontal Scale: 49ps/div Vertical Scale: 200mV/div Data Rate: 3.4 Gb/s Mask: HDMI 1.4 Horizontal Scale: 49ps/div Vertical Scale: 200mV/div Data Rate: 3.4 Gb/s Mask: HDMI 1.4 3.4Gb/s (HDMI) Eye Diagram without RClamp0561Z Horizontal Scale: 16.6ps/div Vertical Scale: 200mV/div Data Rate: 10.0 Gb/s Mask: USB 3.1 Horizontal Scale: 33.3ps/div Vertical Scale: 200mV/div Data Rate: 5.0 Gb/s Mask: USB 3.0 Horizontal Scale: 33.3ps/div Vertical Scale: 200mV/div Data Rate: 5.0 Gb/s Mask: USB 3.0

Final Datasheet Rev 6.1 May 19, 2017 www.semtech.com Semtech Typical Characteristics (Continued) 5.94Gb/s (HDMI 2.0) Eye Diagram with RClamp0561Z 5.94Gb/s (HDMI 2.0) Eye Diagram without RClamp0561Z Horizontal Scale: 28ps/div Vertical Scale: 200mV/div Data Rate: 5.94 Gb/s Mask: HDMI 2.0 Horizontal Scale: 28ps/div Vertical Scale: 200mV/div Data Rate: 5.94 Gb/s Mask: HDMI 2.0

Final Datasheet Rev 6.1 May 19, 2017 www.semtech.com Semtech

Application Information

Figure 1 - USB Type-C Top Layer Protection Example Figure 2 - USB Type-C Bottom Layer Protection Example Pins A1 – A12 GND TX1+ TX1- VBUS RX2- RX2+ GND VBUS CC1 SBU1 RClamp0561Z RClamp0561Z RClamp0561Z RClamp0561Z RClamp5011ZA (2 Each) RClamp5011ZA (2 Each) Pins B1 – B12 GND RX1+ RX1- VBUS TX2- TX2+ GND VBUS SBU2 CC2 uClamp0571P RClamp0561Z RClamp5011ZA (2 each) RClamp0561Z RClamp0561Z RClamp0561Z together the D+ pins and D- pins in the plug recepta- cle. This means protection components only need to be placed on the side of the PCB where the traces are routed. RClamp5011ZA is recommended for protection of these lines. Maximum capacitance is only 0.45pF. It also features very good ESD characteristics highlighted by an extremely low dynamic resistance of 0.25 Ohms. Likewise, these devices can be used to protect the con- figuration channel (CC) and Sideband (SBU) pins. VBus pins are connected together within the Type-C plug and bussed together on the PCB. USB Type-C default power is fixed at 5V. Single line devices such as uClamp0571P are recommended for surge and ESD protection. Note that in power delivery (PD) applications, higher working voltage TVS devices may be needed. Options exist for ESD and surge protection up to 24V. Examples of USB Type-C ESD protection topology using single line protection devices are shown in Figures 1 and 2. A multi-line array such as RClamp7534P is an alterna- tive solution for protecting the D+, D-, SBU, and CC pins. Device Placement Placement of the protection component is a critical ele- ment for effective ESD suppression. TVS diodes should be placed as close to the connector as possible. This helps reduce transient coupling to nearby traces. Ground connections should be made directly to the ground plane using micro-vias. This reduces parasitic inductance in the ground path and minimizes the clamp- ing voltage seen by the protected device. USB Type-C Interface Protection USB Type-C is a new 12-pin connector which supports USB 3.1 SuperSpeed+ (10Gb/s) connections and USB power delivery (USB PD). It is also backwards com- patible (via an adaptor) with USB 3.0 and USB 2.0. The USB Type-C connector does not imply the use of USB 3.1 technology. USB Type-C is a connector shape. The underlying technology may be USB 2.0, USB 3.0, or USB 3.1. USB Type-C plugs are reversible (i.e. can be either be inserted right-side up or upside-down position) so there are connections on both the top and bottom of the PCB. The USB Type-C receptacle consists of 24-pins including: SuperSpeed RX and TX signal pairs, USB 2.0 DP and DM data pins, Auxiliary pins, Configuration pins, and Power and Ground Pins. Any of these connections are capable of conducting ESD current and should be protected. Protection Solutions SuperSpeed data line pairs are located on both the top and bottom of the PCB to support Type-C plug reversal (i.e. flip-ability). ESD protection of the SuperSpeed line pairs is achieved using one RClamp0561Z between each line and ground. A total of eight devices are required. The low capacitance of RClamp0561Z (0.15pF maximum) exhibits minimal effect on the transmission line imped- ance and excellent insertion loss characteristics (0.8dB loss at 10GHz). Single line devices make it easier for the designer to route the traces and maintain equal distance between the differential pairs for maximum signal integ- rity. USB 2.0 pins support Type-C plug reversal by shorting

Final Datasheet Rev 6.1 May 19, 2017 www.semtech.com Semtech Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joints. The figure at the right details Semtech’s recommended mounting pattern. Recommended assembly guidelines are shown in Table 1. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Semtech’s recommended mounting pattern is based on the following design guidelines: Land Pattern The recommended land pattern follows IPC standards and is designed for maximum solder coverage. Detailed dimensions are shown elsewhere in this document. Solder Stencil Stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad. The area ratio of the stencil aperture will determine how well the stencil will print. The area ratio takes into account the aperture shape, aperture size, and stencil thickness. A minimum area ratio of 0.66 is preferred for the subject package. The area ratio of a rectangular aperture is given as: Area Ratio = (L * W )/ (2 * (L + W) * T) Where: L = Aperture Length W = Aperture Width T = Stencil Thickness Semtech recommends a stencil with square aperture and rounded corners for consistent solder release. The stencil should be laser cut with electropolished finish. A stencil thickness of 0.075mm (0.003”) is recommended. A 0.100mm (0.004”) stencil may be used, however the stencil opening may need to be increased slightly to achieve the desired area ratio to ensure proper solder coverage on the pad. Recommended Mounting Pattern All Dimensions are in mm. Land Pad. Stencil opening Component 0.620 0.320 0.175 0.272 0.300 Stencil Opening Land Pad Component Table 1 - Recommended Assembly Guidelines Assembly Parameter Recommendation Solder Stencil Design Laser Cut, Electro-Polished Aperture Shape Rectangular with Rounded Corners Solder Stencil Thickness 0.075mm (0.003”) or 0.100mm (0.004”) Solder Paste Type Type 4 Size Sphere or Smaller Solder Reflow Profile Per JEDEC J-STD-020 PCB Solder Pad Design Solder Mask Defined PCB Pad Finish OSP or NiAu

Final Datasheet Rev 6.1 May 19, 2017 www.semtech.com Semtech Outline Drawing - SGP0603P2X3 Land Pattern - SGP0603P2X3 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). NOTES: aaa N E L e DIM A 0.22 0.37 0.12 0.27 0.08 0.17 0.32

0.385 BSC

0.27 0.35 DIMENSIONS MIN 0.17 NOM 0.25 0.22 0.30 BOTTOM VIEW b D 0.57 0.670.62 bbb 0.10 D E A B aaa C C SEATING PLANE e bbb CAB TOP VIEW A1 0.00 0.02 0.03 e/2 A 2xL D/2 E/2bxN THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR NOTES: COMPANY'S MANUFACTURING GUIDELINES ARE MET. 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DIM Y G C MILLIMETERS (0.425) 0.675 0.250 0.175 DIMENSIONS Z X 0.270 Y Z X G(C)

Final Datasheet Rev 6.1 May 19, 2017 www.semtech.com Semtech Marking Code Tape and Reel Specification

Ordering Information

U Notes: Device is electrically symmetrical U U U U Part Number Qty per Reel Reel Size Tape Material RClamp0561Z.TFT 15000 7 Inch Paper RailClamp and RClamp are registered trademarks of Semtech Corporation.

Final Datasheet Rev 6.1 May 19, 2017 Semtech Contact Information Semtech Corporation

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESUL T IN PERSONAL INJURY , LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015