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1 www.semtech.com PRELIMINARYPROTECTION PRODUCTS - Z-PakTM RClamp0531Z Ultra Small RClamp® 1-Line ESD protection Description Features Dimensions Circuit Diagram Revision 12/8/2015

Applications

Mechanical Characteristics SLP0603P2X3B (Bottom View)Nominal Dimensions (mm)  SLP0603P2X3B package  Pb-Free, Halogen Free, RoHS/WEEE Compliant  Nominal Dimensions: 0.6 x 0.3 x 0.25 mm  Lead Finish: NiAu  Marking : Marking code + dot matrix date code  Packaging : Tape and Reel  RF Antenna and Modules  FM Antenna  USB 2.0  MHL  GPS  High ESD withstand Voltage: +/-12kV (Contact) and +/- 15kV (Air) per IEC 61000-4-2  Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4  Ultra-small 0200200200200201 pack1 pack1 pack1 pack1 pack ageageageageage  Protects one high-speed data line  Low reverse current: <5nA typical (VR=5V)  Working voltage: +/- 5V  Low capacitance: 0.30pF typical  Dynamic resistance: 0.67 Ohm (Typ)  Solid-state silicon-avalanche technology RailClamp ® TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. They are designed to replace 0201 size mul- tilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device deg- radation. The RClamp ®0531Z has a typical capacitance of only 0.30pF. This allows it to be used on circuits operating in excess of 5GHz without signal attenuation. The RClamp0531Z is in a 2-pin SLP0603P2X3B pack- age. It measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. The leads are finished with lead-free NiAu. Each device will protect one line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practi- cal. The combination of small size and high ESD surge capability makes them ideal for use in portable applica- tions such as cellular phones, digital cameras, and RF modules. 0.32 0.62 0.22

0.400 BSC

0.250

2© 2015 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp0531Z Absolute Maximum Rating Electrical Characteristics (T=25 oC) gnitaRl obmySe ulaVs tinU )sμ02/8=pt(rewoPesluPkaePk pP0 6s ttaW )sμ02/8=pt(tnerruCesluPkaePP PI3 A )riA(2-4-00016CEIrepDSE 1 )tcatnoC(2-4-00016CEIrepDSE 1 V DSE 51-/+ 21-/+ Vk erutarepmeTgnitarepOT J 521+ot55-C ° erutarepmeTegarotST GTS 051+ot55-C ° retemaraPl obmySs noitidnoCm uminiMl acipyTm umixaMs tinU egatloVffO-dnatSesreveRV MWR 1ot2ro2ot1niP5 V egatloVnwodkaerBesreveRV RB It Am1= 1ot2ro2ot1niP 79 1 1V tnerruCegakaeLesreveRI R V MWR C°52=T,V5= 1ot2ro2ot1niP 50 2A n egatloVgnipmalCV C I PP sμ02/8=pt,A1= 1ot2ro2ot1niP 51V egatloVgnipmalCV C I PP sμ02/8=pt,A3= 1ot2ro2ot1niP 02V egatloVgnipmalCDSE 2 VC ,A4=PPI sn001/2.0=plt 31V egatloVgnipmalCDSE 2 VC ,A61=PPI sn001/2.0=plt 12V ecnatsiseRcimanyD 3,2 RD sn001=pt7 6.0s mhO ecnaticapaCnoitcnuJC j VR zHM1=f,V5otV0=0 3.00 4.0F p ecnaticapaCnoitcnuJ 4 Cj VR zHG1=f,V5otV0=0 4.0F p VrevOecnaticapaCniegnahC R 4 ΔC RVj VR zHM1=f,V5otV0=0 40.0F p Notes 1)ESD gun return path connected to ESD ground reference plane. 2)Transmission Line Pulse Test (TLP) Settings: t p = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A 4)Guaranteed by design. Not production tested

3© 2015 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp0531Z Typical Characteristics Junction Capacitance vs. Reverse Voltage TLP CharacteristicTypical Insertion Loss (S21) ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) -10 110 -10 0 10 20 30 40 50 60 70 80 Time (ns) Voltage (V) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane -110 -90 -70 -50 -30 -10 -10 0 10 20 30 40 50 60 70 80 Time (ns) Voltage (V) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane 0 5 10 15 20 25 30 TLP Voltage (V) TLP Current (A) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 0 0.5 1 1.5 2 2.5 3 3.5 Peak Pulse Current - Ipp (A) Clamping Voltage - VC (V) Waveform Parameters: tr = 8µs td = 20µs 0.00 0.10 0.20 0.30 0.40 0.50 0123456 Reverse Voltage - V R (V) Capacitance - Cj (pF) f = 1MHz Clamping Voltage vs. Peak Pulse Current -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.1 1 10 100 1000 10000 Frequency (MHz) S21 (dB)

4© 2015 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp0531Z Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufactur- ing parameters will require some experimentation to get the desired solder application. retemaraPylbmessAn oitadnemmoceR ngiseDlicnetSredloSd ehsilop-ortcelE,tucresaL epahserutrepA dednuorhtiwralugnatceR srenroc ssenkcihTlicnetSredloS) "400.0(mm001.0 epyTetsaPredloSr ellamsroerehpsezis4epyT eliforPwolfeRredloS0 20-DTS-JCEDEJreP ngiseDdaPredloSBCPd enifedksamredloS-noN hsiniFdaPBCPu AiNROPSO Recommended Mounting Pattern 0.300 0.370 0.088 Stencil Opening Land Pad ( Follow drawing ) All Dimensions are in mm. Land Pad. Stencil opening Component Applications Information

5© 2015 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp0531Z Outline Drawing - SO-8 Land Pattern - SLP0603P2X3B Outline Drawing - SLP0603P2X3B THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR NOTES: COMPANY'S MANUFACTURING GUIDELINES ARE MET. 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DIM Y G C MILLIMETERS (0.425) 0.675 0.250 0.175 DIMENSIONS Z X0 . 2 7 0 Y Z X G(C) aaa N E L e DIM A 0.2500.18 0.08 0.22

0.40 BSC

0.340 0.265 DIMENSIONS MIN 0.300 NOM 0.235 0.320 0.250 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ). NOTES: BOTTOM VIEW b D bbb 0.10 aaa C C SEATING PLANE bbb C A B TOP VIEW A1 0.000 0.010 0.050 bxN 0.3550.285 0.320 0.605 0.6750.620 A B E A e/2 e D 2xL

6© 2015 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp0531Z Carrier Tape Specification 0A0 B0 K AoKo Bo Note: All dimensions in mm unless otherwise specified PIN 1 Location (Towards Sprocket Holes) R R R R R Plastic Tape Device Orientation in Tape Paper Tape

7© 2015 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp0531Z Marking Codes

Ordering Information

RailClamp and RClamp are trademarks of Semtech Corporation. Notes: 1)Dots represent date code matrix and Pin 1 location R Ordering Number Qty per Reel Carrier Tape Reel Size Comments RClamp0531Z.TNT 10,000 Plastic 7 Inch Not recommended for new designs RClamp0531Z.TFT 15,000 Paper 7 Inch Contact Information Semtech Corporation Protection Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: (805)498-2111 FAX (805)498-3804