RCLAMP03384P SEMTECH | Alldatasheet

Document overview

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  • PDF pages: 9

Technical content

Features

  • Transient Protection to Œ IEC 61000-4-2 (ESD) ±15 kV (Air), ±10kV (Contact) Œ IEC 61000-4-5 (Lightning) 5A (8/20µs)
  • Protects four High-Speed Data Lines
  • Package design optimized for high speed lines
  • Working voltage: 3.3V
  • Low clamping voltage
  • Low capacitance: 0.20pF maximum (I/O to GND)
  • Solid-State Silicon-Avalanche Technology Mechanical Characteristics
  • Package: DFN 2.5 x 1.0 x 0.55mm 10-Lead
  • Pb-Free, Halogen Free, RoHS/WEEE Compliant
  • Marking : Marking Code + Date Code
  • Packaging : Tape and Reel

Applications

  • HDMI 2.0 and 2.1
  • Embedded Display Port (eDP)
  • Display Port
  • LVDS
  • V-by-One RClamp03384P Low Capacitance RailClamp® 4-Line Surge and ESD Protection

Description

RailClamp® TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from over voltage caused by ESD (electrostatic discharge) and CDE (Cable Discharge Events). RClamp03384P has a maximum capacitance of only 0.20 pF between I/O pins and GND. ESD characteristics are highlighted by high ESD withstand voltage (±10kV Contact per IEC 61000-4-2), each device will protect four lines operating at 3.3 volts. RClamp03384P is in a DFN 2.5 x 1.0 x 0.55mm 10-Lead package. The flow- through package design simplifies PCB layout. 1.00 2.50 0.55 Pin 1 Pin 2 Pin 3, 8 Pin 4 Pin 5 I/O GND I/O I/OI/O Nominal Dimension Functional Schematic Device SchematicNominal Dimensions in mm Final Datasheet

Final Datasheet Rev 2.2 Revision Date 4/24/2024 www.semtech.com 2 of 9 Semtech Proprietary and Confidential Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Current (tp = 8/20µs) PPK 27.5 W Peak Pulse Current (tp = 8/20µs) IPP 5 A ESD per IEC 61000-4-2 (Contact)(1) ESD per IEC 61000-4-2 (Air)(1) VESD ±10 ±15 kV Operating Temperature TOP -55 to +85 °C Storage Temperature TSTG -55 to +150 °C Electrical Characteristics (T=25OC unless otherwise specified) Parameter Symbol Conditions Min. Typ. Max. Units Reverse Stand-Off Voltage VRWM Any I/O pin to GND 3.3 V Reverse Breakdown Voltage VBR It = 10mA -40°C to +85 °C 5.5 8.3 10 V Holding Current IH 80 mA Reverse Leakage Current IR VRWM = 3.3V <1 50 nA Clamping Voltage VC IPP = 5A, tp= 1.2/50us (voltage), 8/20µs (current) combination waveform 5.2 5.5 V ESD Clamping Voltage(2) VC tp = 0.2/100ns (TLP), Any I/O pin to GND IPP = 4A 3.8 V IPP = 16A 6.7 Dynamic Resistance(2),(3) RDYN tp = 0.2/100ns (TLP) 0.25 Ohms Junction Capacitance CJ VR = 0V, f = 1MHz, any I/O pin to GND 0.17 0.20 pF Notes: (1) ESD gun return path connected to Ground Reference Plane (GRP) (2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. (3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A Final Datasheet

Final Datasheet Rev 2.2 Revision Date 4/24/2024 www.semtech.com 3 of 9 Semtech Proprietary and Confidential Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Characteristic (5A, Combination Waveform) ESD Clamping (+8kV Contact per IEC 61000-4-2) TLP Characteristic (Positive Pulse) -10 10 30 50 70 90 Clamping Voltage - VC (V) Time (ns) TA = 25OC. Waveform IEC61000-4-2 +8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Ground Reference Plane. RClamp03384P_AR_P8_ESD 0 5 10 15 20 TLP Current (A) TLP Voltage (V) RClamp03384P_TLP_POS TA = 25OC tP = 100ns, tR = 0.2ns tMEAS = 70-90ns -90 -80 -70 -60 -50 -40 -30 -20 -10 -10 10 30 50 70 90 Clamping Voltage - VC (V) Time (ns) TA = 25OC. Waveform IEC61000-4-2 -8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to ESD Ground Plane. RClamp03384P_AR_IEC_N8_ESD -35 -30 -25 -20 -15 -10 -20 -15 -10 -5 0 TLP Current (A) TLP Voltage (V) TA = 25OC tP = 100ns tR = 0.2ns tMEAS = 70-90ns RClamp03384P_TLP_NEG 0.01 0.1 0.1 1 10 100 Peak Pulse Power - PPP (kW) Pulse Duration - tp (us) -5 0 5 10 15 20 25 30 35 Clamping Voltage - VC (V) Time (µs) RClamp03384P_AR_1.2_50 Surge Waveform Parameters: 1.2/50µS (Voltage) / 8/20µS (Current) combination waveform with 12Ω source impedance. I/O to GND ESD Clamping (-8kV Contact per IEC 61000-4-2) TLP Characteristic (Negative Pulse) Final Datasheet

Final Datasheet Rev 2.2 Revision Date 4/24/2024 www.semtech.com 4 of 9 Semtech Proprietary and Confidential Typical Characteristics Capacitance vs. Reverse Voltage Insertion Loss (S21) 0.05 0.1 0.15 0.2 0.25 0 0.5 1 1.5 2 2.5 3 3.5 Capacitance - CJ (pF) Reverse Voltage - VR (V) TA = 25OC. f = 1 MHz. RClamp03384PV_AR_CAPvV -18.0 -16.0 -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 0 5 10 15 20 Insertion Loss (dB) Frequency (GHz) RClamp03384P_Insertion_Loss HDMI 2.0 and 2.1 Eye-Diagram Final Datasheet

Final Datasheet Rev 2.2 Revision Date 4/24/2024 www.semtech.com 5 of 9 Semtech Proprietary and Confidential Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The figure at the right details Semtech’s recommended mounting pattern. Recommended assembly guidelines are shown in Table 2. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Semtech’s recommended mounting pattern is based on the following design guidelines: Land Pattern The recommended land pattern follows IPC standards and is designed for maximum solder coverage. Detailed dimensions are shown elsewhere in this document. Solder Stencil Stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad. The area ratio of the stencil aperture will determine how well the stencil will print. The area ratio takes into account the aperture shape, aperture size, and stencil thickness. The area ratio of a rectangular aperture is given as: Area Ratio = (L * W )/ (2 * (L + W) * T) Where: L = Aperture Length W = Aperture Width T = Stencil Thickness Semtech recommends a stencil thickness of 0.100mm - 0.125mm for this device. The stencil should be laser cut with electro-polished finish. The stencil should have a positive taper of approximately 5 degrees. Electro polishing and tapering the walls results in reduced surface friction and better paste release. Due to the small aperture size, a solder paste with Type 4 or smaller particles is recommended. Assuming a 125um thick stencil, the aperture dimensions shown will yield an area ratio of 0.72 for the small pads and 1.25 for the large. Recommended Stencil Design 2.500 Stencil opening Land Pad. (Follow Drawing) Component All Dimensions are in mm. Land Pad. Stencil opening Component 1.000 0.150 0.200 0.675 Table 2 - Recommended Assembly Guidelines Assembly Parameter Recommendation Solder Stencil Design Laser Cut, Electro-Polished Aperture Shape Rectangular Solder Stencil Thickness 0.100mm (0.004”) - 0.125mm (0.005”) Solder Paste Type Type 4 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD-020 PCB Solder pad Design Non-Solder Mask Defined PCB Pad Finish OSP or NiAu Final Datasheet

Final Datasheet Rev 2.2 Revision Date 4/24/2024 www.semtech.com 6 of 9 Semtech Proprietary and Confidential Outline Drawing - DFN 2.5 x 1.0 x 0.55mm 10-Lead Land Pattern - DFN 2.5 x 1.0 x 0.55mm 10-Lead Final Datasheet

Final Datasheet Rev 2.2 Revision Date 4/24/2024 www.semtech.com 7 of 9 Semtech Proprietary and Confidential Marking Code 3384P YYWW Tape and Reel Specification (4mm) Notes: Dot indicates pin 1 location 3384P YYWW 3384P YYWW User Direction of Feed Final Datasheet

Final Datasheet Rev 2.2 Revision Date 4/24/2024 www.semtech.com 8 of 9 Semtech Proprietary and Confidential Tape and Reel Specification (2mm)

Ordering Information

Part Number Qty per Reel Pocket Pitch Reel Size RClamp03384P .C 3,000 4mm 7” RClamp03384P .A 5,000 4mm 7” RClamp03384P .N 10,000 2mm 7” RailClamp and RClamp are registered trademarks of Semtech Corporation 3384P YYWW 3384P YYWW User Direction of Feed 3384P YYWW 3384P YYWW Final Datasheet

Final Datasheet 2.2 Revision date 4/24/2024 9 of 9 Semtech Proprietary and Confidential Contact Information Semtech Corporation

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com Important Notice Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2024 Final Datasheet