RCLAMP01071ZC SEMTECH | Alldatasheet

Document overview

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Technical content

Features

  • ESD withstand voltage Œ IEC 61000-4-2 (ESD) ±10kV (contact)
  • Low insertion loss: 0.31dB Maximum at 13GHz
  • Very small PCB area
  • Protects one high-speed data line
  • Working voltage: 1.0V
  • Low reverse leakage current: 100nA max at VR=1.0V
  • Solid-state silicon-avalanche technology Mechanical Characteristics
  • Package: DFN 0.60x0.30x0.25mm 2-Lead
  • Pb-Free, Halogen Free, RoHS/WEEE Compliant
  • Lead Finish: Pb-Free
  • Marking : Marking Code
  • Packaging : Tape and Reel

Applications

  • Thunderbolt 4
  • USB Type-C
  • USB 3.2 and USB4 Nominal Dimensions in mm Package Dimension Schematic and Pin Configuration Femto Farad RailClamp® 1-Line, 150fF ESD Protection DFN 0.6 x 0.3 x 0.25mm 2-Lead (Bottom View)

Description

RClamp®01071ZC is an ultra low capacitance “FemtoClamp®” ESD protection device specifically designed to protect high-speed differential lines. It offers desirable characteristics for board level protection including fast response time, low operating voltage and low clamping voltage. RClamp01071ZC features extremely good ESD protection characteristics highlighted by low ESD clamping voltage, and high ESD withstand voltage per IEC 61000-4-2 (±10kV contact). RClamp01071ZC has a low insertion loss (0.31dB Maximum at 13GHz), allowing it to be used on high speed lines such as USB4 and Thunderbolt 4. Each device will protect one high-speed data line. RClamp01071ZC is in a DFN 0.60x0.30x0.25mm 2-Lead package. The small package gives the designer the flexibility to protect single lines in applications where arrays are not practical. 0.300 0.600 0.250 0.160

0.355 BSC

0.220

Final Datasheet Rev 1.0 4/27/2023 www.semtech.com 2 of 10 Semtech Proprietary & Confidential Absolute Maximum Ratings Electrical Characteristics (T=25OC unless otherwise specified) Rating Symbol Value Units Peak Pulse Current (tp = 8/20µs) IPP 2.5 A ESD per IEC 61000-4-2 (Contact)(1) ESD per IEC 61000-4-2 (Air)(1) VESD ±10 kV ±12 Junction Temperature & Operating Temperature TJ & TOP -40 to +85 OC Storage Temperature TSTG -55 to +150 OC Parameter Symbol Conditions Min. Typ. Max. Units Reverse Stand-Off Voltage VRWM 1.0 V Reverse Breakdown Voltage VBR It = 1mA 1.4 1.66 2.3 V Reverse Leakage Current IR VRWM = 1.0V 100 nA Clamping Voltage(2) VC tp = 1.2/50µs (Voltage), 8/20µs (Current) Combination Waveform, RS = 2Ω IPP = 2.5A 3.1 4 V ESD Clamping Voltage(3) VC tp = 0.2/100ns (TLP) Itlp = 4A 3.5 VItlp = 8A 4.7 Itlp = 16A 11.6 Dynamic Resistance(3), (4) RDYN tp = 0.2/100ns (TLP) 0.3 Ω Junction Capacitance CJ VR = 0V, f = 1MHz 0.17 0.2 pF Junction Capacitance(5) CJ VR = 0V, f = 5GHz 0.115 Insertion Loss(5) IL f =10 GHz 0.21 0.3 dBf= 13 GHz 0.26 0.31 f= 15 GHz 0.29 0.34 Return Loss(5) RL f =10 GHz 23.6 dBf= 13 GHz 21.2 f= 15 GHz 19.6 Notes: (1): ESD gun return path connected to Ground Reference Plane (GRP) (2): Measured using a 1.2/50µs voltage, 8/20µs current combination waveform, RS =2Ω. Clamping is defined as the peak voltage across the device after the device snaps back to a conducting state. (3): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. (4): Dynamic resistance calculated from ITLP = 4A to ITLP = 8A (5): Guaranteed by design, not production tested.

Final Datasheet Rev 1.0 4/27/2023 www.semtech.com 3 of 10 Semtech Proprietary & Confidential Typical Characteristics ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) TLP Characteristic (Positive Pulse) Clamping Voltage vs. Peak Pulse Current (tP=1.2/50μs) 0 2 4 6 8 10 12 14 TLP Current (A) Clamping Voltage (V) tP = 100ns, tR = 0.2ns tMEAS = 70-90ns 0.5 1.5 2.5 3.5 4.5 0 0.5 1 1.5 2 2.5 Clamping Voltage - VC (V) Peak Pulse Current - IPP (A) Waveform Parameters: tr = 1.2us td = 50us -18 -16 -14 -12 -10 TLP Current (A) Clamping Voltage (V) tP = 100ns, tR = 0.2ns tMEAS = 70-90ns 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 Capacitance - CJ (pF) Reverse Voltage - VR (V) f = 1 MHz. -10 10 30 50 70 90 Clamping Voltage - VC (V) Time (ns) Waveform IEC61000-4-2 +8kV. Measured with and corrected for 50Ω, 20dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Ground Reference Plane. -30 -25 -20 -15 -10 -10 10 30 50 70 90 Clamping Voltage - VC (V) Time (ns) Waveform IEC61000-4-2 -8kV. Measured with and corrected for 50Ω, 20dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to ESD Ground Plane. TLP Characteristic (Negative Pulse) Capacitance vs. Reverse Voltage

Final Datasheet Rev 1.0 4/27/2023 www.semtech.com 4 of 10 Semtech Proprietary & Confidential Typical Characteristics (Continued) Insertion Loss (S21) Return Loss (S11) -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 5 10 15 20 Insertion Loss (dB) Frequency (GHz) -70 -60 -50 -40 -30 -20 -10 0 5 10 15 20 Return Loss (dB) Frequency (GHz)

Final Datasheet Rev 1.0 4/27/2023 www.semtech.com 7 of 10 Semtech Proprietary & Confidential

Application Information

The small size of this device means that some care must be taken during the mounting process to ensure reliable solder joints. The figure at the right details Semtech’s recommended mounting pattern. Recommended as- sembly guidelines are shown in Table 1. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Solder Stencil Stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad. The area ratio of the stencil aperture will determine how well the stencil will print. The area ratio takes into account the aperture shape, aperture size, and stencil thickness. A minimum area ratio of 0.66 is preferred for the subject package. The area ratio of a rectangular aperture is given as: Area Ratio = (L * W )/ (2 * (L + W) * T) Where: L = Aperture Length W = Aperture Width T = Stencil Thickness Semtech recommends a stencil with square aperture and rounded corners for consistent solder release. The stencil should be laser cut with electro-polished finish. A stencil thickness of 0.075mm (0.003”) is recommended. A 0.100mm (0.004”) stencil may be used, however the stencil opening may need to be increased slightly to achieve the desired area ratio to ensure proper solder coverage on the pad. Recommended Mounting Pattern Assembly Parameter Recommendation Solder Stencil Design Laser Cut, Electro-Polished Aperture Shape Rectangular with Rounded Corners Solder Stencil Thickness 0.075mm (0.003”) or 0.100mm (0.004”) Solder Paste Type Type 4 Size Sphere or Smaller Solder Reflow Profile Per JEDEC J-STD-020 PCB Solder Pad Design Solder Mask Defined or Non Solder Mask Defined PCB Pad Finish OSP or NiAu Table 1 - Assembly Guidelines 0.300 0.270 0.175 0.675 0.250 All Dimensions are in mm. Land Pad. Stencil opening Component 0.600 Component Stencil opening Land Pattern

Final Datasheet Rev 1.0 4/27/2023 www.semtech.com 8 of 10 Semtech Proprietary & Confidential Outline Drawing - DFN 0.60 x 0.30 x 0.25mm 2-Lead Land Pattern - DFN 0.60 x 0.30 x 0.25mm 2-Lead CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). NOTES: aaa N E L e DIM A 0.180 0.320 0.140 0.280 0.08 0.160 0.300 0.240 0.265 DIMENSIONS MIN 0.200 NOM 0.235 0.220 0.250 BOTTOM VIEW b D 0.580 0.6200.600 bbb 0.10 D E A B aaa C C A SEATING PLANE e bbb C A B TOP VIEW A1 0.000 0.010 0.050 bxN A1 e/2 2X L R0.025 TYP THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR NOTES: COMPANY'S MANUFACTURING GUIDELINES ARE MET. 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DIM Y G MILLIMETERS 0.675 0.250 0.175 DIMENSIONS Z X 0.270 G X Y Z(C) (C) (0.425)

Final Datasheet Rev 1.0 4/27/2023 www.semtech.com 9 of 10 Semtech Proprietary & Confidential Marking Code Tape and Reel Specification

Ordering Information

Part Number Qty per Reel Reel Size RClamp01071ZC.F 15000 7 Inch RailClamp and RClamp are registered trademarks of Semtech Corporation. 1010 Notes: Device is electrically symmetrical. Note: All dimensions are nominal dimensions in mm.

Final Datasheet Rev 1.0 4/27/2023 10 of 10 Semtech Contact Information Semtech Corporation

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com Important Notice Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2023 Proprietary & Confidential