RCIAMP10012PQ SEMTECH | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 14

Technical content

Features

  • Transient Protection to Œ IEC 61000-4-2 (ESD) 17kV (Air), 12kV (Contact) Œ IEC 61000-4-4 (EFT) 4kV (5/50ns) Œ IEC 61000-4-5 (Lightning) 3A (8/20µs)
  • ESD protection for two high-speed lines
  • Package design optimized for easy layout
  • TVS Diode Working Voltage: 30V
  • TVS Trigger Voltage: >100V
  • Solid-State Silicon-Avalanche Technology
  • Qualified to AEC-Q100, Grade 1 Mechanical Characteristics
  • Package 2.0 x 1.0 x 0.60mm 5-Lead
  • Pb-Free, Halogen Free, RoHS/WEEE Compliant
  • Molding Compound Flammability Rating: UL 94V-0
  • Marking : Marking Code + Date Code
  • Packaging : Tape and Reel

Applications

  • OPEN Alliance 100/1000BASE-T1 Ethernet
  • Automotive in-vehicle network lines Circuit Diagram Pin Configuration 2-Line ESD Protection for Automotive Ethernet Top View

Description

RClamp®10012PQ is a 2-line interface solution designed specifically for ESD protection of Ethernet interfaces in automotive applications. These devices utilize silicon avalanche technology for superior protection performance compared to ceramic-based solutions. These bidirectional TVS diodes have a trigger voltage >100V and have a deep snap-back characteristic for minimizing ESD clamping voltage. They feature maximum ESD withstand voltage of ±12kV contact, ±17kV air discharge per IEC 61000-4-2. These devices are designed for OPEN Alliance Ethernet interfaces in automotive applications and are qualified to AEC-Q100, Grade 1. RClamp10012PQ is in a DFN 2.0 x 1.0 x 0.60mm 5-Lead package. Flow-through package design simplifies PCB layout and maintains signal integrity on high-speed lines. GND Line 1 Line 2 N/C N/C

Final Datasheet Rev 2.3 3/15/2022 www.semtech.com Page 2 of 14 Semtech Proprietary and Confidential Parameter Symbol Conditions Min. Typ. Max. Units Reverse Stand-Off Voltage VRWM -40OC to 125OC, Pin 1 or 3 to Pin 2 30 V Trigger Voltage VTrig Pin 1 or 3 to Pin 2 T = 25OC 110 125 140 V -40OC to 125OC 105 150 Reverse Leakage Current IR VRWM = 30V Pin 1 or 3 to Pin 2 T = 25OC <1 200 nA T = 125OC 5 500 Clamping Voltage (4) VC IPP = 3A, tp = 1.2/50μs (Voltage), 8/20μs (Current) Combination Waveform 25 V ESD Clamping Voltage(5) VC tp = 0.2/100ns (TLP), Pin 1 or 3 to Pin 2 ITLP = 4A 30 V ITLP = 16A 58 Dynamic Resistance(5), (6) RDYN tp = 0.2/100ns (TLP), Pin 1 or 3 to Pin 2 2.3 Ohms Capacitance CJ VR = 0V, f = 1MHz, Pin 1 or 3 to Pin 2 1.2 1.4 pF Capacitance matching ΔC CLine1 - CLine2 , or CLine2 - CLine1 0.02 0.1 pF Notes: (1): ESD Gun return path to Ground Reference Plane (GRP) (2): ESD pulse applied to Pin 1 or Pin 3 (3): ESD Gun return path to Horizontal Coupling Plane (HCP); Test conditions: 150pF/330pF, 2kΩ (4): Measured using a 1.2/50μs voltage, 8/20μs current combination waveform, RS = 42 Ohms. Clamping is defined as the peak voltage across the device after the device snaps back to a conducting state. (5): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. (6): Dynamic resistance calculated from ITLP = 4A to ITLP = 16A Absolute Maximum Ratings Electrical Characteristics (T=25OC unless otherwise specified) Rating Symbol Value Units Peak Pulse Current (tp = 8/20µs) IPP 3 A ESD per IEC 61000-4-2 (Contact) (1), (2) ESD per IEC 61000-4-2 (Air) (1), (2) VESD ±12 ±17 kV ESD per ISO-10605 (Contact)(2) (3) ESD per ISO-10605 (Air)(2) (3) VESD ±15 ±22 kV Junction Temperature and Operating Temperature TJ & TOP -40 to +125 °C Storage Temperature TSTG -55 to +150 °C

Final Datasheet Rev 2.3 3/15/2022 www.semtech.com Page 3 of 14 Semtech Proprietary and Confidential Typical Characteristics ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) ESD Clamping (+8kV Contact ISO-10605 150pF 330 Ohm) 100 150 200 250 300 350 400 450 -10 10 30 50 70 90 Clamping Voltage - VC (V) Time (ns) TA = 25OC. +8kV Waveform ISO-10605 150pF 330 Ohm. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Horizontal Coupling Plane. RClamp10012PQ_AR_P8_ESD_ISO -450 -400 -350 -300 -250 -200 -150 -100 -50 -10 10 30 50 70 90 Clamping Voltage - Vc (V) Time (ns) TA = 25OC. -8kV Waveform ISO-10605 150pF 330 Ohm. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Horizontal Coupling Plane. RClamp10012PQ_AR_N8_ESD_ISO 100 150 200 250 300 350 400 450 -10 10 30 50 70 90 Clamping Voltage - VC (V) Time (ns) TA = 25OC. Waveform IEC61000-4-2 +8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Horizontal Coupling Plane. RClamp10012PQ_AR_P8_ESD_IEC -450 -400 -350 -300 -250 -200 -150 -100 -50 -10 10 30 50 70 90 Clamping Voltage - Vc (V) Time (ns) TA = 25OC. Waveform IEC61000-4-2 -8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Ground Reference Plane. RClamp10012PQ_AR_N8_ESD_IEC ESD Clamping (-8kV Contact ISO-10605 150pF 330 Ohm) ESD Clamping (+8kV Contact ISO-10605 330pF 330 Ohm) 100 150 200 250 300 350 400 450 -10 10 30 50 70 90 Clamping Voltage - Vc (V) Time (ns) TA = 25OC. +8kV Waveform ISO-10605 330pF and 330 Ohm. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Horizontal Coupling Plane. RClamp10012PQ_AR_P8_ESD_ISO ESD Clamping (-8kV Contact ISO-10605 330pF 330 Ohm) -450 -400 -350 -300 -250 -200 -150 -100 -50 -10 10 30 50 70 90 Clanmping Voltage - VC (V) Time (ns) TA = 25OC. -8kV Waveform ISO-10605 330pF and 330 Ohm. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Horizontal Coupling Plane. RClamp10012PQ_AR_N8_ESD_ISO

Final Datasheet Rev 2.3 3/15/2022 www.semtech.com Page 4 of 14 Semtech Proprietary and Confidential Typical Characteristics ESD Clamping (+8kV Contact ISO-10605 150pF 2 kOhm) ESD Clamping (-8kV Contact ISO-10605 150pF 2 kOhm) ESD Clamping (+8kV Contact ISO-10605 330pF 2 kOhm) 100 150 200 250 300 350 400 450 -10 10 30 50 70 90 Clamping Voltage - VC (V) Time (ns) TA = 25OC. +8kV Waveform ISO-10605 330pF and 2 kOhm. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Horizontal Coupling Plane. RClamp10012PQ_AR_P8_ESD_ISO -450 -400 -350 -300 -250 -200 -150 -100 -50 -10 10 30 50 70 90 Clamping Voltage - Vc (V) Time (ns) TA = 25OC. -8kV Waveform ISO-10605 330pF and 2 kOhm. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Horizontal Coupling Plane. RClamp10012PQ_AR_N8_ESD_ISO 100 150 200 250 300 350 400 450 -10 10 30 50 70 90 Clamping Voltage - VC (V) Time (ns) TA = 25OC. +8kV Waveform ISO-10605 150pF and 2 kOhm. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Horizontal Coupling Plane. RClamp10012PQ_AR_P8_ESD_ISO -450 -400 -350 -300 -250 -200 -150 -100 -50 -10 10 30 50 70 90 Clamping Voltage - Vc (V) Time (ns) TA = 25OC. -8kV Waveform ISO-10605 150pF and 2 kOhm. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Horizontal Coupling Plane. RClamp10012PQ_AR_N8_ESD_ISO ESD Clamping (-8kV Contact ISO-10605 330pF 2 kOhm) TLP Characteristic (Positive) -10 10 30 50 70 90 110 130 150 TLP Current (A) Clamping Voltage (V) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns RClamp10012PQ_AR_TLP_POS TLP Characteristic (Negative) -30 -25 -20 -15 -10 -150 -100 -50 0 TLP Current (A) Clamping Voltage (V) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns RClamp10012PQ_AR_TLP_NEG

Final Datasheet Rev 2.3 3/15/2022 www.semtech.com Page 5 of 14 Semtech Proprietary and Confidential Typical Characteristics Clamping Characteristic (Ipp = 3A, tp=1.2/50us) Junction Capacitance vs. Reverse Voltage Reverse Leakage vs. Temperature -50 -35 -20 -5 10 25 40 55 70 85 100 115 130 Leakage Current - IR (nA) Temperature (°C) RClamp10012PQ_AR_IR_Temp 100 120 140 160 -50 -35 -20 -5 10 25 40 55 70 85 100 115 130 Trigger Voltage - VTrig (V) Temperature (°C) EClamp10012PQ_AR_VTrig_Temp 100 120 140 160 -10 10 30 50 70 Clamping Voltage (V) Time (ns) Waveform Parameters: 1.2/50µs (Voltage) / 8/20µs (Current) combination waveform with 42Ωsource impedance. Source Voltage =138 V RClamp10012PQ_AR_1.2x50 0.2 0.4 0.6 0.8 1.2 1.4 0 5 10 15 20 25 30 Capacitance (pF) Reverse Voltage (V) TA = 25OC. f = 1 MHz. RClamp10012PQ_AR_Cap Trigger Voltage (VTrig) vs. Temperature

Final Datasheet Rev 2.3 3/15/2022 www.semtech.com Page 6 of 14 Semtech Proprietary and Confidential Typical Characteristics Differential to Common Mode Rejection (Ssd21) -50 -45 -40 -35 -30 -25 -20 -15 -10 1 10 100 1,000 Return Loss (dB) Frequency (MHz) RClamp10012PQ_AR_RL -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 1 10 100 1000 Differential to Common-mode Rejection (dB) Frequency (MHz) RClamp10012PQ_AR_DCMR Return Loss (SDD11) Insertion Loss (SDD21) 1 10 100 1,000 Insertion Loss (dB) Frequency (MHz) RClamp10012PQ_AR_IL

Final Datasheet Rev 2.3 3/15/2022 www.semtech.com Page 7 of 14 Semtech Proprietary and Confidential

Application Information

RClamp10012PQ is an ESD/EOS protection device designed for OPEN Alliance Ethernet interfaces in automotive applications. Each device integrates two TVS diodes with a rated working voltage of 30V and a minimum trigger voltage of 100V. RClamp10012PQ is qualified to AEC-Q100, Grade 1. OPEN Alliance IEEE 100BASE-T1 EMC Test Specification for ESD Suppression Devices The OPEN Alliance test specification is intended to be a standardized scale for EMC testing of ESD protection devices to be used in 100BASE-T1 Ethernet interfaces in automotive applications. It includes test set up, test procedures, and recommended limits for the following:

  • Evaluation of datasheet parameters
  • Mixed mode S-Parameter measurement
  • ESD Withstand Voltage
  • Impact to ESD discharge current in a defined 100BASE-T1 network
  • Unwanted clamping effect at RF immunity tests RClamp10012PQ has been characterized to the ESD and mixed mode insertion loss requirements of the OPEN Alliance IEEE 100BASE-T1 EMC Test Specification for ESD suppression devices. A summary of test results is detailed below. For detailed set up information and test procedures, refer to the OPEN Alliance IEEE 100BASE-T1 EMC Test Specification for ESD suppression devices. ESD Withstand Voltage RClamp10012PQ is designed using silicon avalanche technology which yields low TLP dynamic resistance resulting in low ESD clamping voltage. Additionally, there is no inherent wear out mechanism associated with solid-state protection technology; RClamp10012PQ will withstand >1000 discharges as required by the OPEN Alliance test specification without damage or degradation. RClamp10012PQ has a maximum ESD withstand voltage of ±12kV contact, ±17kV air discharge per IEC 61000-4-2. Figure 1 - RClamp10012PQ Schematic Diagram

Final Datasheet Rev 2.3 3/15/2022 www.semtech.com Page 9 of 14 Semtech Proprietary and Confidential RF Clamping An RF clamping test is defined in the OPEN Alliance specification to ensure the TVS device does not affect the EMC performance of the complete module. RClamp10012PQ is evaluated for unwanted RF clamping using a network analyzer in conjunction with a specified RF amplifier, RF attenuator, and device test fixture. The test fixture includes RClamp10012PQ and a common mode choke designed for 100BASE-T1 applications. RClamp10012PQ was evaluated for Class I (33dBm), Class II (36dBm), and Class III (39dBm). RClamp10012PQ does not exhibit an RF clamping effect up to 39dBm (Class III). Device Connection and Layout Guidelines A typical 100BASE-T1 protection example using RClamp10012PQ is shown in Figure 7. Signal lines enter at pins 1 and 3 and connect to external coupling capacitors in series with a common mode choke. A bidirectional TVS (ESD protection diode) is connected between each line and pin 2. Pin 2 is connected to ground. The capacitance of each TVS diode to ground is limited to 1.4pF to ensure signal integrity. Termination resistors matched to 1% are connected between pins 1 and pins 3. The resistors are connected to ground via a capacitor (a parallel 10kΩ resistor is optional). It is recommended that the capacitor have a minimum voltage rating of 100V. The internal TVS diodes will protect the capacitors from damage during an ESD event. Figure 6 - Differential to Common Mode Rejection (Ssd21) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 1 10 100 1000 Differential to Common-mode Rejection (dB) Frequency (MHz) IEEE 100BASE-T1 DCMR Limit RClamp10012PQ Measured DCMR (Ssd21) LPF

100 BASE-T1 MDI

4.7nF To Connector To Connector 10kW (optiona l) 1kW 1kW

Final Datasheet Rev 2.3 3/15/2022 www.semtech.com Page 10 of 14 Semtech Proprietary and Confidential Layout Guidelines Placement of the protection component is a critical element for effective ESD suppression. RClamp10012PQ should be placed before the CM choke and as close to the connector as possible. Placing the protection device close to the connector minimizes transient coupling into nearby traces. Ground connections should be made directly to the ground plane using micro-vias. This reduces parasitic inductance in the ground path and minimizes the clamping voltage seen by the protected device. MDI interface Figures 7 and 8 shows the layout examples of MDI circuitry which will be used for each PHY port. The common mode termination depends on OEM requirements and might vary for different OEMs. The common mode choke is expected to be compliant to the OPEN Alliance CMC specification. The 100nF coupling capacitors should have maximum 10% tolerance and ≥100V voltage range. For the 10kΩ resistor and 4.7nF capacitor, there is no specific power rating required, but components should be rated for a minimum of 50V. The differential signal pair TRX_P/TRX_M shall be routed close together with a controlled impedance of 100Ohm. Since the symmetry is critical for the EMC performance, keep both traces of the differential pair as identical as possible. To increase the effectiveness of the choke or transformer for higher frequencies and to minimize parasitic capacitances, a cut-out of the ground plane may be placed beneath the differential signal path from the PHY to the connector. The choke shall be placed close to the PHY. 100nF 100nF 4.7nF 10kWW1kWW 1kWW Figure 7 - Layout Example of RClamp10012PQ Protection for 100 BASE-T1 MDT. Placement of 1.05KΩ Resistors, 10KΩ Resistor and 4.7nF Cap is on Bottom (Y ellow) Layer

Final Datasheet Rev 2.3 3/15/2022 www.semtech.com Page 11 of 14 Semtech Proprietary and Confidential Assembly Guidelines The figure at the right details Semtech’s recommended mounting pattern. Recommended assembly guidelines are shown in Table 2. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Semtech’s recommended mounting pattern is based on the following design guidelines: Land Pattern The recommended land pattern follows IPC standards and is designed for maximum solder coverage. Detailed dimensions are shown elsewhere in this document. Solder Stencil Stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad. The area ratio of the stencil aperture will determine how well the stencil will print. The area ratio takes into account the aperture shape, aperture size, and stencil thickness. An area ratio of 0.70 – 0.75 is preferred for the subject package. The area ratio of a rectangular aperture is given as: Area Ratio = (L * W )/ (2 * (L + W) * T) Where: L = Aperture Length W = Aperture Width T = Stencil Thickness Semtech recommends a stencil thickness of 0.100mm for this device. The stencil should be laser cut with electro- polished finish. The stencil should have a positive taper of approximately 5 degrees. Electro polishing and tapering the walls results in reduced surface friction and better paste release. Due to the small aperture size, a solder paste with Type 4 or smaller particles are recommended. Assuming a 100um thick stencil, the aperture dimensions shown will yield an area ratio of approximately 0.75. Recommended Mounting Pattern All Dimensions are in mm. Land Pad. Stencil opening Component 0.220 2.000 1.000 0.550 0.900 0.180 Component Stencil Opening Land Pattern (follow drawing) Table 2 - Recommended Assembly Guidelines Assembly Parameter Recommendation Solder Stencil Design Laser Cut, Electro-Polished Aperture Shape Rectangular Solder Stencil Thickness 0.100mm (0.004”) Solder Paste Type Type 4 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD-020 PCB Solder pad Design Non-Solder Mask Defined PCB Pad Finish OSP or NiAu

Final Datasheet Rev 2.3 3/15/2022 www.semtech.com Page 12 of 14 Semtech Proprietary and Confidential Outline Drawing - DFN 2.0 x 1.0 x 0.60mm 5-Lead Land Pattern - DFN 2.0 x 1.0 x 0.60mm 5-Lead b bbb aaa N D DIM A 0.250.15 0.20 0.08 0.10 2.00 MILLIMETERS MAX 0.05 0.65 DIMENSIONS MIN 0.00 NOM 0.55 0.03 (0.127) 0.60 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). NOTES: 1.00E 2.051.95 0.95 1.05 PIN 1 INDICATOR (LASER MARK) bbb C A B BA aaa C C SEATING PLANE e 0.80 BSC L1 0.55 0.60 0.65 e/2 e bxN D E e D/2 E/2 L 0.20 0.25 0.30 1 2 N Ref. 4x L L1 A THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY . CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR NOTES: COMPANY'S MANUFACTURING GUIDELINES ARE MET . CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).1. DIM X G C MILLIMETERS (0.95) 0.20 0.85 0.15 DIMENSIONS 1.50Z P 0.80 Y 0.50 (P) G1 0.50 P/2 P G X Y Z(C)

Final Datasheet Rev 2.3 3/15/2022 www.semtech.com Page 13 of 14 Semtech Proprietary and Confidential Marking Code YYWW R10012 Tape and Reel Specification

Ordering Information

Part Number Qty per Reel Reel Size Carrier Tape Pitch RClamp10012PQTCT 3000 7 Inch Plastic 4mm RailClamp and RClamp are trademarks of Semtech Corporation. Pin 1 Location (Towards Sprocket Holes ) R10012 YYWW R10012 YYWW YYWW = Alphanumeric character Date Code

Final Datasheet Rev 2.3 3/15/2022 Page 14 of 14 Semtech Proprietary and Confidential Contact Information Semtech Corporation

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com Important Notice Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2022