RCIAMP01001ZC SEMTECH | Alldatasheet

Document overview

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  • PDF pages: 7

Technical content

Features

  • ESD and EOS Protection
  • ESD withstand voltage Œ IEC 61000-4-2 (ESD) ±18kV (air), ±12kV (contact)
  • Ultra-Low capacitance: 0.25pF Maximum
  • Low working voltage: 1.0 V
  • Protects one high-speed data line
  • Solid-state silicon-avalanche technology Mechanical Characteristics
  • Package: DFN 0.60 x 0.30 x 0.25 mm-2 Lead
  • Pb-Free, Halogen Free, RoHS/WEEE Compliant
  • Lead Finish: NiAu
  • Marking : Marking Code
  • Packaging : Tape and Reel

Applications

  • USB 3.1 Gen 1 and Gen 2
  • USB Type-C
  • Thunderbolt 3
  • DisplayPort 2.0 Nominal Dimensions(mm) Schematic and Pin Configuration Low Voltage RailClamp® 1.0V ESD and EOS Protection RClamp01001ZC (Bottom View)

Description

RClamp®01001ZC is a low capacitance ESD protection device specifically designed to protect high-speed differential lines. It offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. RClamp01001ZC features extremely good ESD protection characteristics highlighted by low peak ESD clamping voltage, and high ESD withstand voltage (+/- 12kV contact per IEC 61000-4-2). RClamp01001ZC has a maximum capacitance of 0.25pF allowing it to be used on Thunderbolt and USB 3.1 high speed lines. These devices may also be used for EOS protection due to their high peak pulse current capability (5A, tp = 8/20µs). Each device will protect one high-speed data line operating up to 1 volts. RClamp01001ZC is in a DFN 0.60 x 0.30 x 0.25 mm-2 Lead package. Leads are finished with NiAu. The small package gives the designer the flexibility to protect single lines in applications where arrays are not practical. 0.300 0.600 0.250 0.160

0.355 BSC

0.220

Final Datasheet Rev 2.0 10/21/2019 www.semtech.com Semtech Proprietary & Confidential Absolute Maximum Ratings Electrical Characteristics (T=25OC unless otherwise specified) Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) PPK 20 W Peak Pulse Current (tp = 8/20µs) IPP 5 A ESD per IEC 61000-4-2 (Air)(1) ESD per IEC 61000-4-2 (Contact)(1) VESD ±18 ±12 kV Operating Temperature TOP -40 to +85 OC Storage Temperature TSTG -55 to +150 OC Parameter Symbol Conditions Min. Typ. Max. Units Reverse Stand-Off Voltage VRWM -40OC to 85OC 1 V Reverse Breakdown Voltage VBR It = 1mA 1.2 3 4.5 V Reverse Leakage Current IR VRWM = 1V T = 25OC 30 250 nA Clamping Voltage2 VC IPP =5A, tp = 1.2/50µs (Voltage), 8/20µs (Current) Combination Waveform, RS = 2Ω 2.7 V ESD Clamping Voltage3 VC IPP = 4A, tp = 0.2/100ns (TLP) 2.4 V ESD Clamping Voltage3 VC IPP = 16A, tp = 0.2/100ns (TLP) 5 Dynamic Resistance3, 4 RDYN tp = 0.2/100ns (TLP) 0.22 Ω Junction Capacitance CJ VR = 0V, f = 1MHz T = 25OC 0.23 0.25 pF Insertion Loss S21 f = 10GHz 0.75 dB Notes: (1): ESD gun return path connected to Ground Reference Plane (GRP). (2): Measured using a 1.2/50µs voltage, 8/20µs current combination waveform, RS = 2 Ω. Clamping is defined as the peak voltage across the device after the device snaps back to a conducting state. (3): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. (4): Dynamic resistance calculated from ITLP = 4A to ITLP = 16A

Final Datasheet Rev 2.0 10/21/2019 www.semtech.com Semtech Proprietary & Confidential Typical Characteristics ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) TLP IV Curve (Positive) Insertion Loss (S21) 0 2 4 6 8 10 12 DUT Current (A) DUT Voltage (V) TA = 25OC tP = 100ns, tR = 0.2ns tMEAS = 70-90ns -3.5 -2.5 -1.5 -0.5 0 2 4 6 8 10 12 14 16 18 Insertion Loss (dB) Frequency (GHz) RClamp01001ZC_IL_Probe -35 -30 -25 -20 -15 -10 DUT Current (A) DUT Voltage (V) TA = 25OC tP = 100ns, tR = 0.2ns tMEAS = 70-90ns TA = 25OC tP = 100ns, tR = 0.2ns tMEAS = 70-90ns 0.1 0.2 0.3 0.4 Capacitance (pF) Reverse Voltage (V) TA = 25OC f = 1 MHz -20 100 120 140 -10 10 30 50 70 90 Clamping Voltage(V) Time(ns) TA = 25OC. Waveform IEC61000-4-2 +8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Ground Reference Plane. TA = 25OC. Waveform IEC61000-4-2 +8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Ground Reference Plane. TA = 25OC. Waveform IEC61000-4-2 +8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Ground Reference Plane. -140 -120 -100 -80 -60 -40 -20 -10 10 30 50 70 90 Clamping Voltage(V) Time(ns) TA = 25OC. Waveform IEC61000-4-2 -8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Ground Reference Plane. TLP IV Curve (Negative) Capacitance vs. Reverse Voltage

Final Datasheet Rev 2.0 10/21/2019 www.semtech.com Semtech Proprietary & Confidential

Application Information

The figure at the right details Semtech’s recommended mounting pattern. Recommended assembly guidelines are shown in Table 1. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Solder Stencil Stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad. The area ratio of the stencil aperture will determine how well the stencil will print. The area ratio takes into account the aperture shape, aperture size, and stencil thickness. A minimum area ratio of 0.66 is preferred for the subject package. The area ratio of a rectangular aperture is given as: Area Ratio = (L * W )/ (2 * (L + W) * T) Where: L = Aperture Length W = Aperture Width T = Stencil Thickness Semtech recommends a stencil with square aperture and rounded corners for consistent solder release. The stencil should be laser cut with electro-polished finish. A stencil thickness of 0.075mm (0.003”) is recommended. A 0.100mm (0.004”) stencil may be used, however the stencil opening may need to be increased slightly to achieve the desired area ratio to ensure proper solder coverage on the pad. Recommended Mounting Pattern Assembly Parameter Recommendation Solder Stencil Design Laser Cut, Electro-Polished Aperture Shape Rectangular with Rounded Corners Solder Stencil Thickness 0.075mm (0.003”) or 0.100mm (0.004”) Solder Paste Type Type 4 Size Sphere or Smaller Solder Reflow Profile Per JEDEC J-STD-020 PCB Solder Pad Design SMD and NSMD PCB Pad Finish OSP or NiAu Table 1 - Assembly Guidelines 0.300 0.270 0.175 0.675 0.250 All Dimensions are in mm. Land Pad. Stencil opening Component 0.600 Component Stencil opening Land Pattern

Final Datasheet Rev 2.0 10/21/2019 www.semtech.com Semtech Proprietary & Confidential Outline Drawing - DFN 0.60 x 0.30 x 0.25 mm - 2 Lead Land Pattern - DFN 0.60 x 0.30 x 0.25 mm - 2 Lead CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). NOTES: aaa N E L e DIM A 0.180 0.320 0.140 0.280 0.08 0.160 0.300 0.240 0.265 DIMENSIONS MIN 0.200 NOM 0.235 0.220 0.250 BOTTOM VIEW b D 0.580 0.6200.600 bbb 0.10 D E A B aaa C C A SEATING PLANE e bbb C A B TOP VIEW A1 0.000 0.010 0.050 bxN A1 e/2 2X L R0.025 TYP THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR NOTES: COMPANY'S MANUFACTURING GUIDELINES ARE MET. 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DIM Y G MILLIMETERS 0.675 0.250 0.175 DIMENSIONS Z X 0.270 G X Y Z(C) (C) (0.425)

Final Datasheet Rev 2.0 10/21/2019 www.semtech.com Semtech Proprietary & Confidential Marking Code Tape and Reel Specification

Ordering Information

Part Number Qty per Reel Reel Size RClamp01001ZCFT 15000 7 Inch RailClamp and RClamp are registered trademarks of Semtech Corporation. Notes: Device is electrically symmetrical. Note: All dimensions are nominal dimensions in mm.

Final Datasheet Rev 2.0 10/21/2019 Semtech Contact Information Semtech Corporation

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com Important Notice Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2019 Proprietary & Confidential