RC4559 TI | Alldatasheet
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Technical content
RC4559 Dual High-Performance Operational Amplifier
1 Features
- Matched gain and offset between amplifiers
- Unity-gain bandwidth: 3MHz typical
- Slew rate: 1.5V/µs typical
- Low equivalent input noise voltage 2μV/Hz maximum (20Hz to 20kHz)
- No frequency compensation required
- No latch up
- Wide common-mode voltage range
- Low power consumption
2 Applications
- AV receivers
- Professional audio mixers
- Soundbars
- Wireless speakers
3 Description
The RC4559 is a dual high-performance operational amplifier. The high common-mode input voltage and the absence of latch-up make this amplifier suitable for low-noise signal applications such as audio preamplifiers and signal conditioners. This amplifier features a dynamic performance that is specified by design and an output drive capability that far exceeds general-purpose type amplifiers. The RC4559 is characterized for operation from 0°C to 70°C.
Package Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM) RC4559 D (SOIC, 8) 4.90 mm × 3.90 mm P (PDIP, 8) 9.81 mm × 6.30 mm Device Information (2) SYMBOLIZATION OPERATING TEMPERATURE RANGE VIO max at 25°CDEVICE PACKAGE SUFFIX RC4559 D, P −0°C to 70°C 6 mV (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) The D packages are available taped and reeled. Add the suffix R to the device type when ordering (for example, RC4559DR). Symbol (Each Amplifier) D or P Package, SOIC or PDIP 8-Pin (Top View) RC4559 SLOS074A – OCTOBER 1983 – REVISED DECEMBER 2024 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
7 Mechanical, Packaging, and Orderable Information....5 RC4559 SLOS074A – OCTOBER 1983 – REVISED DECEMBER 2024 www.ti.com
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4 Specifications
4.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage VCC+ (see (1)) 18 V Supply voltage VCC− (see (1)) −18 V Differential input voltage (see (2)) ±30 V Input voltage (any input, see (1) and 3) ±15 V Short-circuit output current (see (4)) 125 mA Continuous total dissipation 500 mW Operating free-air temperature range 0 70 °C Storage temperature range −65 125 °C Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds 260 °C (1) All voltage values, unless otherwise noted, are with respect to the zero reference level (ground) of the supply voltages where the zero reference level is the midpoint between VCC+ and VCC−. (2) Differential voltages are at the noninverting input terminal with respect to the inverting input terminal. (3) The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 volts, whichever is less. (4) Temperature or supply voltages must be limited to ensure that the dissipation rating is not exceeded.
4.2 Electrical Characteristics
at specified free-air temperature, VCC+ = 15 V, VCC− = −15 V PARAMETER TEST CONDITIONS (1) TA (2) MIN TYP MAX UNIT VIO Input offset voltage VO = 0 25°C 2 6 mV Full Range 7.5 IIO Input offset current VO = 0 25°C 5 100 nA Full range 200 IIB Input bias current VO = 0 25°C 40 250 nA Full range 500 VI Input voltage range 25°C ± 12 ± 13 V VOM Maximum peak output voltage swing RL ≥ 3 kΩ 25°C ± 12 ± 13 RL= 600 Ω 25°C ± 9.5 ± 10 V RL ≥ 2 kΩ Full range ± 10 VI Input voltage range VO = ± 10 V, RL = 2 kΩ 25°C 20 300 V/mV Full range 15 BOM Maximum output-swing bandwidth VOPP = 20 V, RL = 2 kΩ 25°C 24 32 kHz B1 Unity-gain bandwidth 25°C 4 MHz ri Input resistance 25°C 0.3 1 MΩ CMRR Common-mode rejection ratio VO = 0 25°C 80 100 dB kSVS Supply voltage sensitivity (ΔVIO/AVCC) VO = 0 25°C 10 75 μV/V Vn Equivalent input noise voltage (closed loop) AVD = 100, RS = 1 kΩ, f = 20 Hz to 20 kHz 25°C 1.4 2 μV In Equivalent input noise current f = 20 Hz to 20 kHz 25°C 25 pA ICC Supply current (both amplifiers) No load, No signal 25°C 3.3 5.6 mA0°C 4 6.6 70°C 3 5 VO 1/VO 2 Crosstalk attenuation AVD = 100, RS = 1 kΩ, f = 10 kHz 25°C 90 dB (1) All characteristics are specified under open-loop operation, unless otherwise noted. (2) Full range operating free-air temperature range is 0°C to 70°C. www.ti.com RC4559 SLOS074A – OCTOBER 1983 – REVISED DECEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: RC4559
4.3 Matching Characteristics
at VCC+ = 15 V, VCC− = −15 V, TA = 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIO Input offset voltage VO = 0 ± 0.2 mV IIO Input offset current VO = 0 ± 7.5 nA IIB Input bias current VO = 0 ± 15 nA AVD Large-signal differential voltage amplification VO = ± 10 V, RL = 2 kΩ ± 1 dB
4.4 Operating Characteristics
VCC+ = 15 V, VCC− = −15 V, TA = 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tr Rise time VI = 20 mV, RL = 2 kΩ, CL = 100 pF 80 μs Overshoot 18% SR Slew rate at unity gain VI = 10 mV, RL = 2 kΩ, CL = 100 pF 1.5 2 V/μs RC4559 SLOS074A – OCTOBER 1983 – REVISED DECEMBER 2024 www.ti.com
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5 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.
5.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
5.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
5.3 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
6 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision * (June 1988) to Revision A (December 2024) Page
- Removed the minimum limit for the Maximum output-swing bandwidth parameter in the Electrical
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com RC4559 SLOS074A – OCTOBER 1983 – REVISED DECEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: RC4559
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) RC4559D Obsolete Production SOIC (D) | 8 - - Call TI Call TI 0 to 70 RC4559 RC4559DR Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 RC4559 RC4559DR.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 RC4559 RC4559P Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 RC4559P RC4559P.A Active Production PDIP (P) | 8 50 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 RC4559P (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) RC4559DR SOIC D 8 2500 353.0 353.0 32.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) RC4559P P PDIP 8 50 506 13.97 11230 4.32 RC4559P.A P PDIP 8 50 506 13.97 11230 4.32 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
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