RB520S30T1 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Extremely Fast Switching Speed
  • Extremely Low Forward V oltage 0.6 V (max) @ IF = 200 mA
  • Low Reverse Current
  • ESD Rating: Class 3B per Human Body Model Class C per Machine Model
  • These are Pb−Free Devices MAXIMUM RATINGS Rating Symbol Value Unit Reverse Voltage VR 30 Vdc Forward Current DC IF 200 mA Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR−5 Board, (Note 1) TA = 25°C Derate above 25°C PD 200 1.57 mW mW/°C Thermal Resistance, Junction−to−Ambient R/C0113JA 635 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C 1. FR−5 Minimum Pad. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Reverse Leakage (VR = 10 V) IR − − 1.0 /C0109A Forward Voltage (IF = 200 mA) VF − − 0.60 Vdc

30 VOLT SCHOTTKY

Device Package Shipping †

ORDERING INFORMATION

RB520S30T1 SOD−523* 3000/Tape & Ree l CATHODE ANODE RB520S30T1G SOD−523* 3000/Tape & Ree l http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. SOD−523 CASE 502 PLASTIC MARKING DIAGRAM *This package is inherently Pb−Free. 5J = Device Code M = Date Code* /C0071= Pb−Free Package *Date Code orientation position may vary depending upon manufacturing location. (Note: Microdot may be in either location) 5J M /C0071 /C0071

http://onsemi.com PACKAGE DIMENSIONS SOD−523 CASE 502−01 ISSUE B 0.40 0.0157 0.40 0.0157 1.40 0.0547 /C0466mm inches/C0467SCALE 10:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. −T− SEATING PLANE B A −X− −Y− D 2 PL TM0.08 (0.003) X Y C SJ K DIM MIN NOM MAX MILLIMETERS A 1.10 1.20 1.30 B 0.70 0.80 0.90 C 0.50 0.60 0.70 D 0.25 0.30 0.35 J 0.07 0.14 0.20 K 0.15 0.20 0.25 S 1.50 1.60 1.70 0.043 0.047 0.051 0.028 0.032 0.035 0.020 0.024 0.028 0.010 0.012 0.014 0.0028 0.0055 0.0079 0.006 0.008 0.010 0.059 0.063 0.067 MIN NOM MAX INCHES12 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 RB520S30T1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.