RB520S-30 TSC | Alldatasheet

Document overview

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Technical content

Features

—Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed —Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code —High temperature soldering guaranteed: 260°C/10s C D mW A V30 200 Reverse Voltage V R VRRM Power Dissipation Repetitive Peak Reverse Voltage PD UnitsSymbol Suggested PAD Layout —Polarity : Indicated by cathode band —Weight : 1.68±0.5 mg Rating at 25°C ambient temperature unless otherwise specified.

Ordering Information

E B0520LW Storage Temperature Range T J,TSTG Mean Forward Current @ TL=100℃ (Lead Temperature) Thermal Resistance (Junction to Ambient) IO RθJA Non-Repetitive Peak Forward Surge Current (Note 1) I FSM -55 to + 125 °C V mA °C/W500 200 Pin Configuration —Marking Code: B Dimensions F Unit (inch) A B Unit (mm) D A B C E F Version :A11

200mW, Low VF SMD Schottky Barrier Diode Small Signal Diode Maximum Ratings Reverse Breakdown Voltage I R= Forward Voltage I F= Reverse Leakage Current V R= Carrier & Reel specification 8.10 ±0.20 P0 4.00 ±0.10 Embossment center P1 2.00 ±0.05 Overall tape thickness T Carrier width A 0.22 ±0.05 13.0 ±0.20 Sprocke hole position E 1.75 ±0.10 Reel inner diameter D1 54.4 ±0.40 Carrier length B 3.94 ±0.05 Dimension (mm) D Min 3.15 ±0.10 0.60 Rating at 25°C ambient temperature unless otherwise specified. Type Number V(BR) Symbol 12.3 ±0.20 3.50 ±0.05 Reel width W1 Reel outside diameter Tape width d C 178 ±1 Carrier depth 1.35 ±0.10 1.75 ±0.10 Item Symbol Sprocket hole W Punch hole position Sprocke hole pitch Feed hole width F 500uA - Units V30 Max μAIR 200mA 10V VVF D1D2D User Direction of Feed Top Cover Tape Carieer Tape Any Additional Label (If Required) TSC label T C d P1 A B F W E Version : A11

200mW, Low VF SMD Schottky Barrier Diode Small Signal Diode Rating and Characteristic Curves Fig.1 Total Capacitance Fig.2 Forward Voltage vs Ambient Fig.3 Reverse Current vs Reverse Version : A11