RB520S-30_12 COMCHIP | Alldatasheet

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Technical content

Features

Low reverse current. Designed for mounting on small surface. Extremely thin package. Majority carrier conduction. Mechanical data Case: SOD-523 standard package, molded plastic. Terminals: solderable per MIL-STD-750 ,method 2026. Marking code: cathode band & B Mounting position: Any Weight: 0.0012 gram(approx.). Circuit Diagram RoHS Device SMD Schottky Barrier Diodes

RATING AND CHARACTERISTIC CURVES (RB520S-30) Page 2 REV:B Capacitance between terminals, (PF) Reverse voltage, (V) 100 0 25 50 75 100 125 Ambient temperature, (°C) Average forward current,(%) Fig.4 - Derating curveFig. 3 - Capacitance between terminals characteristics 0 1510 20 100 5 25 30 Reverse current ( A ) Reverse voltage, (V) 10u 100n 0 10 20 25 30 Fig. 2 - Reverse characteristics 100u 155 10n O 25 C O -25 C O 75 C O 125 C f = 1 MHz 150 Comchip Technology CO., LTD. Fig.1 Forward Characteristics IF, Forward Current (A) Forward Voltage, (V) 0 0.4 0.7 100m 10μ 100μ 10m O TA C O TA=75C O T 25C O TA=-25C QW-BB023 (Mounting on glass epoxy PCBs) SMD Schottky Barrier Diodes

REV:B o 120 Trailer Device Leader 10 pitches (min)10 pitches (min) D1 D2 D T C Direction of Feed Reel Taping Specification Comchip Technology CO., LTD. QW-BB023 Index hole d E F W A P B Polarity B C d D D2D1 SOD-523 SYMBOL A (mm) (inch) 2.142 ± 0.016 2.00 ± 0.10 178 ± 1.00 SYMBOL (mm) E F P P0 P1 W W1 1.75 ± 0.10 0.069 ± 0.004 3.50 ± 0.05 0.138 ± 0.002 SOD-523 0.90 ± 0.10 0.035 ± 0.004 1.94 ± 0.10 0.076 ± 0.004 0.73 ± 0.10 0.029 ± 0.004 9.50 ± 1.00 0.374 ± 0.039 8.00 0.30 /+ –0.10 SMD Schottky Barrier Diodes

REV:B Part Number RB520S-30 Marking Code B Marking Code Comchip Technology CO., LTD. B QW-BB023 Suggested PAD Layout SIZE (inch) 0.055 (mm) 1.40 0.60 0.70 0.024 0.028 SOD-523 2.00 0.079 E 0.80 0.031 A B C D SMD Schottky Barrier Diodes A B C E D SOD-523 Standard Packaging Case Type 3,000 REEL ( pcs ) Reel Size (inch) REEL PACK