RB520G-30 TSC | Alldatasheet

Document overview

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Technical content

Features

—Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed —Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code —High temperature soldering guaranteed: 260°C/10s C D A B C E F 0.043 1.10 0.80 0.031 0.50 0.020 Version :B12

F SMD Schottk y Barrier Diode Small Signal Diode Rating and Characteristic Curves Fig.Capacitance between terminals characteristics Version : B12

Low VF SMD Schottky Barrier Diode Small Signal Diode

Electrical Characteristics

I F V R Tape & Reel specification μA Type Number 10mA 10V Forward Voltage Reverse Leakage Current Symbol 0.5- VV F I R Min 3.73 ± 0.10 - 0.45 UnitsMax Feed hole width D2 13.0 ± 0.20 Item Symbol Dimension(mm) Carrier depth C 1.68 ±0.10 1.7 ± 0.10 D1 55 Min Sprocket hole 1.5 ± 0.1 4.00 ±0.10 178 ± 1 Carrier width A Reel outside diameter D d Carrier length B Reel inner diameter 8.00 ±0.20 E 1.75 ±0.10 Punch hole position F 3.50 ±0.05 Sprocke hole pitch Embossment center Sprocke hole position Reel width W1 14.4 Max P1 2.00 ±0.05 Overall tape thickness T 0.23 ± 0.05 Tape width W Top Cover Tape Carieer Tape An y Additional Label If Required TSC label D2D T C d P1 A B F W E Version : B12