RABS15M TSC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 4
Technical content
- Ideal for automated placement, for compact PCB design - High surge current capability - Ultrafast reverse recovery time for high frequency - Negligible leakage current - Halogen-free according to IEC 61249-2-21 Molding compound, UL flammability classification rating 94V-0 Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test SYMBOL UNIT V RRM V VRMS V VDC V IF(AV) A trr ns I2tA 2s TJ °C TSTG °C Document Number: DS_D1412015 Version: C15 TJ=25°C 1.5A, 1000V RABS15M Taiwan Semiconductor Miniature Fast Recovery Glass Passivated Surface Bridge Rectifier
FEATURES
- Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC MECHANICAL DATA Case: Molded plastic body Polarity: Polarity as marked on the body Weight: 0.09 g (approximately) Rating for fusing (t<8.3ms) Maximum instantaneous forward voltage (Note 1) IF= 1.5A Maximum reverse current @ rated VR TJ=125°C - 55 to +150 Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 50 RθJL RθJA Moisture sensitivity: level 1, per J-STD-020 Typical thermal resistance 1IR MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER Maximum repetitive peak reverse voltage ABS-L A Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 1.5 V F Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Operating junction temperature range Storage temperature range Note 1: Pulse test with PW=300μs, 1% duty cycle μA200 Maximum reverse recovery time per diode (Note 2) - 55 to +150 V °C/W RABS15M 500 1.30 1000 700 1000
PART NO. Note 1: Whole series with green compound PART NO. (TA=25°C unless otherwise noted) Document Number: DS_D1412015 Version: C15
ORDERING INFORMATION
PART NO. SUFFIX
DESCRIPTION
Green compoundGREHRABS15MRABS15MHREG EXAMPLE PART NO. SUFFIX H 5,000 / 13" Paper reel 1,000 / 7" Plastic reel PACKING PREFERRED P/N PACKING CODE PACKING CODE SUFFIX PACKAGE RABS15M (Note 1) RE G ABS-L RG ABS-L RABS15M Taiwan Semiconductor RATINGS AND CHARACTERISTICS CURVES PACKING CODE PACKING CODE SUFFIX 0.5 1.5 0 25 50 75 100 125 150 AVERAGE FORWARD CURRENT (A) LEAD TEMPERATURE (°C) FIG.1 MAXIMUM FORWARD CURRENT DERATING CURVE 100 11 0 1 0 0 PEAK FORWARD SURGE CURRENT (A) NUMBER OF CYCLES AT 60 Hz FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 8.3ms Single Half Sine-Wave 0.01 0.1 100 0 2 04 06 08 0 1 0 0 INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLYAGE(%) FIG. 2 TYPICAL REVERSE CHARACTERISTICS TJ=25°C TJ=125°C 100 0.1 1 10 100 JUNCTION CAPACITANCE (pF) a REVERSE VOLTAGE (V) FIG. 4 TYPICAL JUNCTION CAPACITANCE f=1MHz Vsig=50mVp-p
B 4.30 4.50 0.169 0.177 C 6.25 6.65 0.246 0.262 D 0.60 0.70 0.024 0.028 E 3.90 4.10 0.154 0.161 F 4.90 5.10 0.193 0.201 G 1.25 1.35 0.049 0.053 H 1.20 1.30 0.047 0.051 I 0.05 0.15 0.002 0.006 J 0.30 0.70 0.012 0.028 K 0.15 0.25 0.006 0.010 P/N = Specific Device Code YW = Date Code F = Factory Code Document Number: DS_D1412015 Version: C15 SUGGESTED PAD LAYOUT RABS15M Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) ABS-L Symbol Unit (mm) A1 . 5 0 B0 . 9 0 F5 . 7 2 MARKING DIAGRAM C4 . 2 2 D7 . 2 2 E2 . 0 5 0.225 Unit (inch) 0.059 0.035 0.166 0.284 0.081 0.1 INSTANTANEOUS FORWARD CURRENT (A) FORWARD VOLTAGE (V) FIG. 5 TYPICAL FORWARD CHARACTERISTICS TJ=25°C TJ=125°C
assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1412015 Version: C15 RABS15M Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,