RAA214223 RENESAS | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 13
Technical content
Datasheet sections
- 1.1 Block Diagram
- 2.1 Pin Assignments
- 2.2 Pin Descriptions
- 3.1 Absolute Maximum Ratin gs
- 3.2 Thermal Information
- 3.3 Recommended Operation Con ditions
- 3.4 Electrical Specifications
- 5.1 Function Overview
- 5.2 Enable Control
- 5.3 Current Limit Protectio n
- 5.4 Over-Temperature Shutdown (OTSD)
- 6.1 Capacitor Selection
- 6.2 Power Dissipation
- 6.3 PCB Layout Recommendations
Features
▪ Wide input voltage range 4V to 20V ▪ Output curren t up to 150mA ▪ Low 3.6µA shutdown current ▪ Accurate output volta ge (-1.75% / +2.5% over-temperature) ▪ Low dropout voltage: 240mV typical at 150mA load ▪ Excellent line and load regulation ▪ Stable with 1µF minimu m MLCC output capacitor ▪ Integrated fault protections including thermal shutdown and current limit ▪ Available in the compa ct and cost effective TSOT23 package
Applications
▪ Battery-powered equipment ▪ MCU power supply ▪ Electric meters ▪ USB devices ▪ Laptop computers and tablets ▪ Portable modules and appliances Figure 1. RAA214223 Typical Application (1) Figure 2. RAA214223 Typi cal Application (2)
1.1 Block Diagram
2.1 Pin Assignments
2.2 Pin Descriptions
Figure 3. Block Diagram ground with 0.1µF or larger high frequency ceramic capacitor to GND. connected to VIN directly or through a resistor divider for automatic turn on. OPTIONAL feedforward capacitor to be placed between this pin and VOUT. pin and GND. Place the capacitor as close to the output of the regulator as possible.
R16DS0352EU0100 Rev.1.00 Page 4 Jun 9, 2023 RAA214223 Datasheet 3. Specifications
3.1 Absolute Maximum Ratings
Caution: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can adversely impact product reliability and result in failures not covered by warranty.
3.2 Thermal Information
Parameter[1] 1. All voltages referenced to VSS unless otherwise specified. Minimum Maximum Unit Supply Voltage, VIN -0.3 +22 V Enable Input Voltage, EN -0.3 +22 V Output Voltage, VOUT -0.3 +22 V OC FF Pin Voltage -0.3 +5.5 V Output Current, IOUT - 150 mA Human Body Model (Tested per JS-001-2017) - 3.5 kV Charged Device Model (Tested per JS-002-2018) - 1.5 kV Latch-Up (Tested per JESD78E; Class 2, Level A) - 100 mA Parameter Package Symbol Conditions Typical Value Unit Thermal Resistance (Typical) 5-pin TSOT23 θJA[1] 1. θ JA is measured in free air with the component mounted on a high-effective thermal conductivity test board with direct attach features. See TB379. Junction to air 215 °C/W θJC[2] 2. For θ JC, the case temperature location is on the top side of the package. Junction to case 140 °C/W Parameter Minimum Maximum Unit Maximum Junction Temperature -40 +150 °C Maximum Storage Temperature Range -65 +150 °C Pb-Free Reflow Profile see TB493
R16DS0352EU0100 Rev.1.00 Page 5 Jun 9, 2023 RAA214223 Datasheet
3.3 Recommended Operation Conditions
3.4 Electrical Specifications
Parameter Minimum Maximum Unit Supply Voltage, VIN +4 +20 V Enable Input Voltage, EN 0 +20 V Output Voltage, VOUT 0+ 3 . 3 V Output Current, IOUT 01 5 0 m A Output Capacitor, COUT 12 0 0 µ F Junction Temperature -40 +125 °C At ambient temperature -40°C to +125°C, IOUT = 1mA, CIN = 1µF, COUT = 2.2µF, VIN = 4.3V, EN = 5V, unless otherwise specified. Typical values are at TA = 25°C. Parameters Symbol Test Conditions Min [1] Typ Max [1] Unit Input Voltage V IN -4 - 2 0 V Output Voltage Accuracy V OUT Line Regulation ∆VOUT%/ ∆VIN VIN = VOUT+1V to 20V - 0.001 0.05 %/V Load Regulation ∆VOUT%/ ∆IOUT IOUT = 100uA to 150mA - 0.003 0.01 %/mA Dropout Voltage[2] VDO IOUT = 10mA, - 25 - mV IOUT = 50mA - 90 - IOUT = 100mA - 175 - IOUT = 150mA - 240 450 Shutdown Current I SHDN EN = 0, VIN = 4.5V - 3.6 10 µA EN = 0, VIN = 20V - 5.2 - Ground Current I GND IOUT = 0 - 96 - µA IOUT = 10mA - 147 - IOUT = 100mA - 176 - IOUT = 150mA - 190 275 Power Supply Ripple Rejection PSRR f = 100Hz, IOUT =10mA, VIN = 5V -8 6- d B f = 10kHz, IOUT = 10mA, VIN = 5V -6 5- dB f = 100kHz, IOUT = 10mA, VIN = 5V -3 4- dB Output Voltage Noise - BW = 10Hz to 100kHz IOUT = 10mA, VIN = 5V - 428 - µV RMS EN Rising Threshold - - 1.35 1.47 1.65 V EN Falling Threshold - - - 1.275 - V
5.1 Function Overview
operates at an input voltage range of 4V to 20V and has a fixed output voltage of 3.3V.
5.2 Enable Control
Enable voltage through a resistor divider.
5.3 Current Limit Protection
short or overload is removed from VOUT, the output returns to normal voltage regulation mode. Figure 14. Output Noise Spectral Density Figure 15. PSRR (VIN = 5V, IOUT = 10mA) Figure 16. Load Transient (0 to 150mA, COUT = 1µF) Figure 17. Line Transient (5V to 12V, C OUT = 1µF,
R16DS0352EU0100 Rev.1.00 Page 9 Jun 9, 2023 RAA214223 Datasheet
5.4 Over-Temperature Shutdown (OTSD)
If the die temperature exceeds the over-temperature threshold of the device, the output of the LDO shuts down until the die temperature cools down to a temperature determined by the hysteresis of the OTSD. The level of power that dissipates, combined with the ambient temperature and the thermal impedance of the package, determines if the junction temperature exceeds the OTSD temperature. 6. Application Information
6.1 Capacitor Selection
Renesas recommends connecting a 1µF ceramic capacitor between VIN and GND at the input to reduce circuit sensitivity to the PCB layout. At a minimum, place a 0.1µF ceramic capacitor close to the input pin for noise decoupling. Higher capacitance improves the line transient response. The device is stable with a minimum of 1µF output capacitor. An optional ceramic capacitor of 10-22pF between the VOUT and OCFF pins can be used to improve overshoot or undershoot in startup or transient situations, although it is not required. This cap may also help improve PSRR at certain frequencies. For both the input and output capacitors, and the optional CFF, Renesas recommends the X7R type because it has a low capacitance variation over-temperature.
6.2 Power Dissipation
The junction temperature must not exceed the range specified in Recommended Operation Conditions. The power dissipation is calculated using Equation 1. To calculate the maximum ambient operating temperature, use the junction-to-ambient thermal resistance (θJA) as shown in Equation 2, where TJ(MAX) is the maximum allowable junction temperature, and TA is the ambient temperature. For any target junction temperature and output voltage, the maximum load that the IC allows decreases as the supply voltage increases. Given the thermal resistance θJA, use Equation 1 and Equation 2 to estimate the maximum load the IC supports up to its maximum junction temperature. The lower θJA is, the more load the device can handle. To lower θJA, a large trace metal area, and ground plane should be applied on the PCB.
6.3 PCB Layout Recommendations
When placing components and routing the trace, minimize the ground impedance and keep the parasitic inductance low. Place the input and output capacitors as close to the IC as possible. The optional feedforward capacitor can be placed between the IC and the output capacitor, but only a small 0402 or 0603 package is needed. VIN, VOUT, and GND traces should be reasonably wide to improve the thermal performance of the IC and to reduce the chance of noise pickup. (EQ. 1) (EQ. 2) PD VIN VOUT– IOUT VIN IGND+=
Figure 18. Recommended Component Placement
R16DS0352EU0100 Rev.1.00 Page 11 Jun 9, 2023 RAA214223 Datasheet 7. Package Outline Drawing N A D E (N/2)21 0.15 DC 0.25 C 2X N/2 TIPSe B ddd M DC A-B b NX 2 3 SEATING PLANE 0.10 C NX 1 3 C D
0.15 A-BC
H c (L1) L 0.25 4° ±4° GAUGE PLANE A MDP0049 TSOT PACKAGE FAMILY SYMBOL MILLIMETERS TOLERANCETSOT5 TSOT6 TSOT8 A 1.00 1.00 1.00 Max A1 0.05 0.05 0.05 ±0.05 A2 0.87 0.87 0.87 ±0.03 b 0.38 0.38 0.29 ±0.07 D 2.90 2.90 2.90 Basic E 2.80 2.80 2.80 Basic E1 1.60 1.60 1.60 Basic e 0.95 0.95 0.65 Basic e1 1.90 1.90 1.95 Basic L 0.40 0.40 0.40 ±0.10 L1 0.60 0.60 0.60 Reference ddd 0.20 0.20 0.13 - N 568 R e f e r e n c e Rev. B 2/07 NOTES: 1. Plastic or metal protrusions of 0.15mm maximum per side are not included. 2. Plastic interlead protrusions of 0.15mm maximum per side are not included. 3. This dimension is measured at Datum Plane “H”. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. 5. Index area - Pin #1 I.D. will be located within the indicated zone (TSOT6 AND TSOT8 only). 6. TSOT5 version has no center lead (shown as a dashed line).
R16DS0352EU0100 Rev.1.00 Page 12 Jun 9, 2023 RAA214223 Datasheet 8. Ordering Information 9. Revision History Part Number[1][2] 1. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. For Moisture Sensitivity Level (MSL), see the RAA214223 product page. For more information about MSL, see TB363. Part Marking[3] 3. The part marking is located on the bottom of the part. Package Description (RoHS Compliant) Pkg. Dwg. # Carrier Type [4] 4. See TB347 for details about reel specifications. Temp Range RAA2142234GP3#JA0 223 5-pin TSOT23 MDP0049 Reel, 3k -40°C to 125°C Revision Date Description 1.00 Jun 9, 2023 Initial release.
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