R533I347000P0M

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Technical content

1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Built Into Tomorrow Benefits

• A pprovals: ENEC, UL, cUL, CQC X

2 CLASS (IEC 60384-14)

T HB Grade IIIB: 85°C, 85% RH, 1,000 hours at 310 VAC acc. to IEC 60384-14 T HB Grade IIIB: 85°C, 85% RH, 1,000 hours at 560 VDC acc. to IEC 60384-14 R ated voltage: 310 VAC 50/60 Hz

• Recommended DC Voltage 630 VDC C apacitance range: 0.1 – 22 µF L ead spacing: 15.0 – 37.5 mm
• C apacitance tolerance: ±20%, ±10% C limatic category 40/110/56, IEC 60068-1 T ape & Reel in accordance with IEC 60286-2 R oHS compliant and lead-free terminations O perating temperature range of -40°C to +110°C 00% screening factory test at 1,900 VDC
• S elf healing properties
• A utomotive (AEC-Q200) grade Overview The R53 series is constructed of metallized polypropylene film encapsulated with self-extinguishing resin in a box of material that meets the r equirements of UL 94 V–0. The R53 series is ideal for harsh environmental conditions and meets the demanding Automotive Electronics Council's AEC–Q200 qualification requirements.

Applications

For worldwide use in electromagnetic interference (EMI) suppression in across-the-line applications that require X2 safety classification. Intended for use in situations in which capacit or failure would not result in exposure to electric shock. Typical applications include connection in series with the mains, capacitive power supplies and energy meters, with special emphasis in automotive applications for severe ambient conditions such as On Board Chargers. Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Part Number System R53 3 I 3470 00 P0 M Series Rated Voltage (VAC) Lead Spacing (mm) Capacitance Code (pF) Packaging Internal Use Capacitance Tolerance X2, Metallized Polypropylene 3 = 310 I = 15.0 N = 22.5 R = 27.5 W = 37.5 The last three digits represent significant figures. T he first digit s pecifies number o f zeros to be ad ded. See Ordering Options Table K = ±10% M = ±20%

2© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Ordering Options Table Lead Spacing Nominal (mm) Type of Leads and Packaging Lead Length (mm) Lead and Packaging Code 22.5 Standard Lead and Packaging Options Bulk (Bag) – Short Leads 4 +2/-0 00 Pizza Pack – Short Leads 4 +2/-0 BB Ammo Pack H0 = 18.5 ±0.5 DQ Other Lead and Packaging Options Tape & Reel (Large Reel) H0 = 18.5 ±0.5 CK Bulk (Bag) – Short Leads 2.7 +0.5/−0 JA Bulk (Bag) – Short Leads 3.5 + 0.5/−0 JB Bulk (Bag) – Short Leads 4.0 +0.5/−0 JE Bulk (Bag) – Short Leads 3.2 + 0.3/−0.2 JH Bulk (Bag) – Long Leads 18 ±1 JM Bulk (Bag) – Long Leads 30 +5/−0 40 Bulk (Bag) – Long Leads 25 +2/−1 50 27.5 Standard Lead and Packaging Options Bulk (Tray) – Short Leads 4 +2/−0 00 Pizza Pack – Short Leads 4 +2/-0 BB Tape & Reel (Large Reel) H0= 18.5 ±0.5 CK1 Other Lead and Packaging Options Bulk (Tray) – Short Leads 2.7 +0.5/−0 JA Bulk (Tray) – Short Leads 3.5 + 0.5/−0 JB Bulk (Tray) – Short Leads 4.0 +0.5/−0 JE Bulk (Tray) – Short Leads 3.2 + 0.3/−0.2 JH Bulk (Tray) – Long Leads 18 ±1 JM Bulk (Tray) – Long Leads 30 +5/−0 40 Bulk (Tray) – Long Leads 25 +2/−1 50 37.5 Standard Lead and Packaging Options Pizza Pack – Short Leads 4 +2/-0 00 Other Lead and Packaging Options Pizza Pack – Short Leads 2.7 +0.5/−0 JA Pizza Pack – Short Leads 3.5 + 0.5/−0 JB Pizza Pack – Short Leads 4.0 +0.5/−0 JE Pizza Pack – Short Leads 3.2 + 0.3/−0.2 JH Pizza Pack – Long Leads 18 ±1 JM Pizza Pack – Long Leads 30 +5/−0 40 Pizza Pack – Long Leads 25 +2/−1 50 1 Not for all sizes, see "Packaging Quantities" table.

3© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Dimensions – Millimeters F L T H LL S FRONT VIEW SIDE VIEW S T H L F Nominal Tolerance Nominal Tolerance Nominal Tolerance Nominal Tolerance Nominal Tolerance Note: See Ordering Options Table for lead length (LL/H 0) options.

4© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Performance Characteristics * Typical value Dielectric Polypropylene fi lm Plates Metal layer deposited by evaporation under vacuum Winding Non-inductive type Leads Tinned wire Protection Plastic case, thermosetting resin filled. Box material is solvent resistant and flame retardant according to UL94. Related Documents IEC 60384-14, EN 60384-14 Rated Voltage V R 310 VAC (50/60 Hz) Recommended DC Voltage ≤ 630 VDC Capacitance Range 0.1 –22 µF Capacitance Values E6 series (IEC 60063) measured at 1 kHz and +20 ±1°C Capacitance Tolerance ±10%, ±20% Temperature Range −40°C to +110°C Climatic Category 40/110/56 IEC 60068-1 Storage Conditions Storage time: months from the date marked on the label package Average relative humidity per year 70% RH 85% for days randomly distributed throughout the year Dew is absent Temperature: −40 to 80°C (see "Maximum Humidity in Storage Conditions" graph below) Approvals ENEC, UL, cUL, CQC Dissipation Factor (tanδ) at kHz C 0.1 µF C > 0.1µF 0.3% 0.2% Test Voltage Between Terminals The 100% screening factory test is carried out at 1,900 VDC. The voltage level is selected to meet the requirements in applicable equipment standards. A ll electrical characteristics are checked after the test. This test cannot be repeated, as there is a risk of d amaging the capacitor. KEMET is not liable in such cases for any failures. Insulation Resistance Measured at +25°C ±5°C, according to IEC 60384–2 Minimum Values Between Terminals Voltage Charge Voltage Charge Time C 0.33 μF C 0.33 μF

100 VDC 1 minute ≥ 1 • 105 MΩ

( ≥ 5 • 105 MΩ )* ≥ 30,000 MΩ • µF

5© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Performance Characteristics cont. 100 −40 −20 0 20 40 60 80 Temperature (°C) Maximum Humidity in Storage Condition Relative Humidity (%)

30 Days

Maximum Irms vs. Th Maximum Irms 20% 40% 60% 80% 100% 120% 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 Temperature Th(°C) Maximum Overtemperature ∆Tlim vs Th Temperature Th(°C) ∆Tlim (°C) 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 Th is the maximum ambient temperature surrounding the capacitor or hottest contact point (e.g. tracks), whichever is higher, in the worst operation conditions in °C. Qualification Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details r egarding test methods and conditions are referenced in document AEC-Q200, Stress T est Qualification for Passive Components. F or additional information regarding the Automotive Electronics Council and AEC-Q200, please visit the website at www.aecouncil.com.

6© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Impedance Graph 0.01 0.1 100 0.1 1 10 100 Z (Ohm) Frequency (MHz) 47nF, p. 10 470nF, p. 15 1.0 µF, p. 22.5 4.7µF, p. 27.5 15µF, p. 37.5 Maximum Voltage (Vrms) Versus Frequency (Sinusoidal Waveform/Th ≤ 80°C) 100 1,000 0.1 1.0 10.0 100.0 Voltage (Vrms) Frequency (kHz) Lead Spacing 37.5 mm 10 µF 15 µF 22 µF 100 1,000 0.1 1.0 10.0 100.0 Voltage (Vrms) Frequency (kHz) Lead Spacing 27.5 mm 1.5 µF 3.3 µF 4.7 µF 6.8 µF 100 1,000 0.1 1.0 10.0 100.0 Voltage (Vrms) Frequency (kHz) Lead Spacing 15 mm 0.1 µF 0.33 µF 0.47 µF 0.68 µF 0.82 µF 100 1,000 0.1 1.0 10.0 100.0 Voltage (Vrms) Frequency (kHz) Lead Spacing 22.5 mm 0.47 µF 1 µF 1.5 µF 2.2 µF

7© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Maximum Current (Irms) Versus Frequency (Sinusoidal Waveform/Th ≤ 80°C) 0.01 0.1 100 0.1 1.0 10.0 100.0 Current (Arms) Frequency (kHz) Lead Spacing 37.5 mm 10 µF 15 µF 22 µF 0.01 0.1 0.1 1.0 10.0 100.0 Current (Arms) Frequency (kHz) Lead Spacing 27.5 mm 2.2 µF 3.3 µF 4.7 µF 6.8 µF 0.01 0.1 0.1 1.0 10.0 100.0 Current (Arms) Frequency (kHz) Lead Spacing 15 mm 0.1 µF 0.33 µF 0.47 µF 0.68 µF 0.82 µF 0.01 0.1 0.1 1.0 10.0 100.0 Current (Arms) Frequency (kHz) Lead Spacing 22.5 mm 0.47 µF 1 µF 1.5 µF 2.2 µF

8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Environmental Test Data Test IEC Publication Procedure Endurance IEC 60384-14 1.25 x VR VAC 50 Hz, once every hour increase to 1,000 VAC for 0.1 second, 1,000 hours at upper rated temperature Endurance IEC 60384-14 1.25 x 630 VDC, 1,000 hours at upper rated temperature Vibration MIL-STD-202 Method 204 5 G for 20 minutes, 12 cycles each of 3 orientations. Use 8" X 5" PCB, 0.031" thick. 7 secure points on one 8" side and 2 secure points at c orners of opposite sides. Parts mounted within from any secure point. Test from 10 – 2,000 Hz. Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213. Condition C Temperature Cycling JESD22-Method JA-104 1,000 cycles (−40°C to 110°C) Note: Measurement at 24 ±4 hours after test conclusion. 30 minute maximum dwell time at each temperature extreme. 1 minute maximum transition time. Active Flammability I EC 60384-14 VR + 20 surge pulses at 2.5 kV (pulse every 5 seconds) Passive Flammability IEC 60384-14 IEC 60384–1, IEC 60695–11–5 Needle flame test Biased Humidity According to Grade IIIB (Certification p ending) 85°C/85% RH and 310 VAC, 1,000 hours Capacitance change (∆C/C): 10% Dissipation factor change (∆tan δ): 10−3 (at 10 kHz) for C ≤ 1 µF D issipation factor change (∆tan δ): 10−3 (at 1 kHz) for C > 1 µF Insulation resistance Rins or time constant τ CR Rins: 50% of initial limit According to Grade IIIB (Certification p ending) 85°C/85% RH and 560 VDC, 1,000 hours Capacitance change (∆C/C): 10% Dissipation factor change (∆tan δ): 10−3 (at 10 kHz) for C ≤ 1 µF D issipation factor change (∆tan δ): 10−3 (at 1 kHz) for C > 1 µF Insulation resistance Rins or time constant τ CR Rins: 50% of initial limit Approvals Certification Body Mark Specification File Number IMQ S-p.A. EN/IEC 60384–14 CA08.00232 UL UL 60384–14 and CAN/CSA E60384–14 (310 VAC) E97797 CQC IEC 60384–14 CQC20001267604 CQC20001267618 CQC20001267599 CQC20001267617 CQC20001267606 CQC20001267616

9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Environmental Compliance All KEMET EMI capacitors are RoHS compliant. Table 1 – Ratings & Part Number Reference Capacitance Value (µF) Dimensions in mm Lead Spacing (S) dV/dt (V/µs) KEMET Part Number Legacy Part NumberT H L Capacitance Value (µF) B (mm) H (mm) L (mm) Lead Spacing (p) dV/dt (V/µs) New KEMET Part Number Legacy Part Number (1) Insert lead and packaging code. See Ordering Options Table for available options.

10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Soldering Process The implementation of the RoHS directive has resulted in the selection of SnAuCu (SAC) alloys or SnCu alloys as primary solder material. This has increased the liquidus temperature from 183°C for SnPb eutectic alloys to 217 221°C for the new allo ys. As a result, the heat stress to the components, even in wave soldering, has increased considerably due to higher pre- heat and wave temperatures. Polypropylene capacitors are especially sensitive to heat (the melting point of polypropylene is 160 170°C). Wave soldering can be destructive, especially for mechanically small polypropylene capacitors (with lead spacing of mm). Great care must be taken during soldering. The recommended solder profiles from KEMET should be used. Consult KEMET with any questions. In general, the wave soldering curve from IEC Publication 61760-1 Edition serves as a solid guideline for successful soldering. See Figur e 1. Reflow soldering is not recommended for through-hole film capacitors. Exposing capacitors to a soldering profile in excess of the above-recommended limits may result to degradation of or permanent damage to the capacitors. Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert through-hole parts after curing surface mount parts. Consult KEMET to discuss the actual temperature profile in the oven, if through-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended. Allow time for the capacitor surface temperature to return to normal temperature before performing the second soldering cy cle. Manual Soldering Recommendations Following is the recommendation for manual soldering with a soldering iron. The soldering iron tip temperature should be set at 350°C (+10°C maximum), with the soldering duration not to exceed more than 3 seconds. Recommended Soldering Temperature 100 150 200 250 300 350 400 0 1 2 3 4 5 6 7 Soldering Time (seconds) Soldering Iron Bit Temperature (°C) Wave Soldering Recommendations 100 150 200 250 300 0 40 80 120 160 200 240 Temperature (°C) Time (seconds) Cooling 2+3 seconds max260°C First Wave Second Wave ∆ T < 150°C ca. 2°C/second ca. 3.5°C/second typical ca. 5°C/second Preheating Tpreheat Typical

11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Soldering Process cont. Wave Soldering Recommendations cont. The table indicates the maximum set-up temperature of the soldering process. Dielectric Film Material Maximum Preheat Temperature Maximum Peak Soldering Temperature Capacitor Pitch mm Capacitor Pitch > 15 mm Capacitor Pitch mm Capacitor Pitch > 15 mm Polyester 130°C 130°C 270°C 270°C Polypropylene 110°C 130°C 260°C 270°C Paper 130°C 140°C 270°C 270°C Polyphenylene Sulphide 150°C 160°C 270°C 270°C 2. The maximum temperature measured inside the capacitor: set the temperature so that the maximum temperature inside the element is below the limit. Dielectric Film Material Maximum Temperature Measured Inside the Element Polyester 160°C Polypropylene 110°C Paper 160°C Polyphenylene Sulphide 160°C Temperature monitored inside the capacitor. Selective Soldering Recommendations Selective dip soldering is a variation of reflow soldering. In this method, the printed circuit board with through-hole components to be soldered is preheated and transported over the solder bath as it is in normal flow soldering, without t ouching the solder. When the board is over the bath, it is stopped. Pre-designed solder pots are lifted from the bath with molten solder, only at the places of the selected components, and pressed against the lower surface of the board to solder the components. The temperature profile for selective soldering is similar to the double wave flow soldering outlined in this document. Howe ver, instead of two baths, there is only one with a time from 3 – 10 seconds. In selective soldering, the risk of overheating is greater than in double wave flow soldering, and great care must be taken so that the parts do not overheat.

12© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Mounting Resistance to Vibration and Mechanical Shock AEC-Q200 Mechanical Stress Tests: Mechanical Shock MIL-SDT-202 Method 213 Test condition C Peak value 100 g, duration 6 ms, half-sine-wave (see MIL-HDBK for details) Vibration MIL-SDT-202 Method 204

5 G for 20 minutes, 12 cycles each of 3 orientations

8"X5" PCB, 0.031" thick. secure points on one side and secure points a t corners of opposite sides. Parts mounted within from any secure point. Test from 10 – 2,000 Hz. The capacitors are designed for PCB mounting. The stand-off pipes must be in good contact with the printed circuit board. The capacitor body has to be properly fixed (e.g. clamped or glued). Construction Detailed Cross Section Self-Extinguishing Resin Molded Plastic Case Molded Plastic Case Leads Metal Contact Layer Metal Contact Layer Margin Single-sided Metallized Polypropylene Film (Second Layer) Single-sided Metallized Polypropylene Film (First Layer) Margin Single-sided Metallized Polypropylene Film FILM WINDING SCHEME OPTIONS

1 Section

Single-sided Metallized Polypropylene Film

2 Sections

3 Sections 4 Sections

Double-sided Metallized Polyester Film

3 Sections

Film DielectricDouble-sided Metallized Polyester Carrier Film Single-sided Metallized Polypropylene Film

4 Sections

Film DielectricDouble-sided Metallized Polyester Carrier Film Polypropylene Film Dielectric Sulfide Film (SMR) Metallized Impregnated Paper Metallized Impregnated Paper Single-sided Metallized Polyester Film Single-sided Metallized Polyester Film Polypropylene Film Dielec- tric AXIAL - Polypropylene Film/Foil AXIAL - Single-sided Metallized Polypropylene Film Single-sided Metallized Polyester Film AXIAL - Single-sided Metallized Polyester Film AXIAL - Double-sided Metallized Polyester Film Winding Scheme

13© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Marking IEC Climatic Category Approval Marks TOPFRONT Series Capacitance, Capacitance Tolerance, Rated Voltage Manufacturing Plant Manufacturer’s Logo Safety Class Self Healing Date Code IEC Climatic Category Approval Marks TOPFRONT Manufacturer’s Logo Manufacturing Plant Capacitance Tolerance Date Code Capacitance, Rated Voltage Series, Safety Class, Self Healing Passive Flammability Category B for volume ≥ 1750 mm C for volume < 1750 mm3 Passive Flammability Category B for volume ≥ 1750 mm3 C for volume < 1750 mm3 Lead Spacing 27.5 mm (alternatives*) and 37.5 mm NOTE: Hot imprinting with or without color or ink jet or laser marking *Differences are caused by technology (clichee, laser, or ink) and production line. Lead Spacing 15 mm, 22.5 mm, and 27.5 mm Manufacturing Date Code (IEC–60062) Year Code Year Code Month Code Month Code

2010 A 2020 M January 1 July 7

2011 B 2021 N February 2 August 8

2012 C 2022 P March 3 September 9

2013 D 2023 R April 4 October O

2014 E 2024 S May 5 November N

2015 F 2025 T June 6 December D

2016 H 2026 U

2017 J 2027 V

2018 K 2028 W

2019 L 2029 X

14© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Packaging Quantities Lead Spacing (mm) Thickness (mm) Height (mm) Length (mm) Bulk Short Leads Bulk Long Leads Standard Reel ø 355 mm Large Reel ø 500 mm Ammo Taped Pizza 5 11 18 2,000 1,000 600 1,250 800 1,122 6 12 18 1,750 900 500 1,000 680 935 7.5 13.5 18 1,000 700 350 800 500 748 7.5 18.5 18 900 500 - 800 500 748 8.5 14.5 18 1,000 500 300 700 440 663 9 12.5 18 1,000 520 270 650 410 612 10 16 18 750 500 300 600 380 561 11 19 18 450 350 - 500 340 510 22.5 6 15 26.5 805 500 - 700 464 660 7 16 26.5 700 500 - 550 380 564 8.5 17 26.5 468 300 - 450 280 468 10 18.5 26.5 396 300 - 350 235 396 11 20 26.5 360 250 - 350 217 360 13 22 26.5 300 200 - 300 - 300 27.5 11 20 32 560 336 - 350 - 300 13 22 32 480 288 - 300 - 250 14 28 32 352 176 - - - 230 16 30 32 288 144 - - - 200 22 37 32 168 112 - - - 150 37.5 20 40 42 - - - - - 58 24 44 42 - - - - - 44 30 45 42 - - - - - 36

16© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) Lead Taping & Packaging (IEC 60286–2) cont. Ammo Specifi cations Dimensions (mm) H W T 360 340 59 Reel Specifi cations Reel Size Dimensions (mm) D H W Standard 355 30 55 MaximumLarge 500 25 D W H H T W

17© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F 3124_R53_X2_310_110C_MIN • 1/20/2021 Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions R53 (Miniature), THB Grade IIIB, Class X2, 310 VAC, 110°C (Automotive Grade) KEMET Electronics Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation.