R5323X RICOH | Alldatasheet

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Technical content

NO.EA-089-0607 OUTLINE The R5323x Series are CMOS-based voltage regulator ICs with high output voltage accuracy, low supply current, low dropout, and high ripple rejection. Each of these voltage regulator ICs consists of a voltage reference unit, an error amplifier, resistors for setting Output Voltage, a current limit circuit, and a chip enable circuit. These ICs perform with low dropout voltage due to built-in transistor with low ON resistance, and a chip enable function prolongs the battery life of each system. The line transient response and load transient response of the R5323x Series are excellent, thus these ICs are very suitable for the power supply for hand-held communication equipment. The output voltage of these ICs is internally fixed with high accuracy. Since the packages for these ICs are SOT-23-6, PLP1820-6 and WL-CSP-6 package, 2ch LDO regulators are included in each package, high density mounting of the ICs on boards is possible.

FEATURES

Typ. 65dB(VOUT < = 2.4V) , Typ. 60dB(VOUT < = 2.5V) (f=10kHz) 1.5V to 4.0V is possible

  • Built-in chip enable circuit (A/B: active high)
  • Ceramic Capacitor is recommended. (1.0µF or more)

APPLICATIONS

  • Power source for handheld communication equipment.
  • Power source for electrical appliances such as cameras, VCRs and camcorders.
  • Power source for battery-powered equipment.

Error Amp. R1_1 R2_1 Vref R1_2 R2_2 Error Amp. Current Limit Current Limit R5323xxxxB Vref Current Limit Error Amp. R1_1 R2_1 Vref Current Limit Error Amp. R1_2 R2_2

The output voltage, mask option, and the taping type for the ICs can be selected at the user's request. The selection can be made with designating the part number as shown below; R5323xxxx x-xx-x ←Part Number a b c d e Code Contents a Designation of Package Type: N : SOT-23-6 K : PLP1820-6 Z : WL-CSP-6 b Setting combination of 2ch Output Voltage (VOUT) : Serial Number for Voltage Setting, Stepwise setting with a step of 0.1V in the range of 1.5V to 4.0V is possible for each channel. c Designation of Mask Option: A version: without auto discharge function at OFF state. B version: with auto discharge function at OFF state. d Designation of Taping Type: Ex. TR (refer to Taping Specifications; TR type is the standard direction.) e Designation of composition of plating: −F : Lead free plating (SOT-23-5,WL-CSP-6) None : Au plating (PLP1820-6) PIN CONFIGURATION z SOT-23-6 z PLP1820-6 z WLCSP-6 64 5 CE1 CE2 GND 123 VOUT1 VDD (mark side) VOUT2 Top View 6 54 1 2 3 Bottom View 4 56 321 V OUT1 VDD VOUT2 CE1 GND CE2

  • SOT-23-6 PLP1820-6 Pin No. Symbol Description Pin No. Symbol Description

1 V OUT1 Output Pin 1 1 V OUT2 Output Pin 2

2 V DD Input Pin 2 V DD Input Pin

3 V OUT2 Output Pin 2 3 V OUT1 Output Pin 1

4 CE2 Chip Enable Pin 2 4 GND Ground Pin

5 GND Ground Pin 5 CE1 Chip Enable Pin 1

6 CE1 Chip Enable Pin 1 6 CE2 Chip Enable Pin 2

  • Tab in the parts have GND level. (They are connected to the reverse side of this IC.) Do not connect to other wires or land patterns.
  • WLCSP-6 Pin No. Symbol Description

1 V OUT1 Output Pin 1

2 V DD Input Pin

3 V OUT2 Output Pin 2

4 CE2 Chip Enable Pin 2

5 GND Ground Pin

6 CE1 Chip Enable Pin 1

VIN Input Voltage 6.5 V VCE Input Voltage (CE Pin) 6.5 V VOUT Output Voltage −0.3 to VIN + 0.3 V IOUT1 Output Current 1 200 mA IOUT2 Output Current 2 200 mA Power Dissipation (SOT-23-6)*1 420 Power Dissipation (PLP1820-6) *1 880 PD Power Dissipation (WL-CSP-6) 633 mW Topt Operating Temperature Range −40 to 85 °C Tstg Storage Temperature Range −55 to 125 °C ∗1 For Power Dissipation, please refer to PACKAGE INFORMATION to be described.

ELECTRICAL CHARACTERISTICS

  • R5323xxxxA/B Topt =25°C Symbol Item Conditions Min. Typ. Max. Unit VOUT Output voltage VIN=Set VOUT+1V 1mA < = IOUT < = 30mA VOUT ×0.98 VOUT ×1.02 V IOUT Output Current VIN−VOUT = 1.0V 150 mA ∆VOUT/∆IOUT Load regulation VIN=Set VOUT+1V 1mA < = IOUT < = 150mA 15 40 mV VDIF Dropout Voltage Refer to the Electrical Characteristics by Output Voltage ISS Supply Current VIN=Set VOUT+1V 90 120 µA Istandby Supply Current(Standby) VIN=Set VOUT+1V VCE=GND 0.1 1.0 µA ∆VOUT/∆VIN Line regulation Set VOUT+0.5V < = VIN < = 6.0V IOUT=30mA 0.02 0.10 %/V RR Ripple Rejection Ripple 0.5Vp−p VIN=Set VOUT+1V IOUT=30mA (In case that VOUT < = 1.7V, VIN=Set VOUT+1.2V) ∗Note1 ∗Note2 dB VIN Input Voltage 2.0 6.0 V ∆VOUT/ ∆Topt Output Voltage Temperature Coefficient IOUT=30mA −40°C < = Topt < = 85°C ±100 ppm /°C Ilim Short Current Limit VOUT=0V 40 mA RPD Pull-down resistance for CE pin 0.7 2.0 8.0 MΩ VCEH CE Input Voltage “H” 1.5 6.0 V VCEL CE Input Voltage “L” 0.0 0.3 V en Output Noise BW=10Hz to 100kHz 30 µVrms RLOW Low Output Nch Tr. ON Resistance (of B version) VCE=0V 60 Ω ∗Note1: f=1kHz, 70dB as to VOUT > = 2.5V Output type. ∗Note2: f=10kHz, 60dB as to VOUT > = 2.5V Output type.
  • Electrical Characteristics by Output Voltage Dropout Voltage VDIF (V) Output Voltage VOUT (V) Condition Typ. Max. VOUT=1.5 0.38 0.70 VOUT=1.6 0.35 0.65 VOUT=1.7 0.33 0.60 1.8V < = VOUT < = 2.0V 0.32 0.55 2.1V < = VOUT < = 2.7V 0.28 0.50 2.8V < = VOUT < = 4.0V IOUT=150mA 0.22 0.35 TYPICAL APPLIATION OUT2 OUT1 IN VOUT2 VOUT1 GND CE1 CE2 VDD R5323x Series C3 (External Components) Ceramic Capacitor Type C 1,C2,C3 Recommended Ceramic capacitor for Output: GRM219R61A105K (Murata) General Example of External Components Ceramic Capacitors: C1608X5R0J105K (TDK) GRM188R60J105K (Murata)

V V VOUT2 IOUT2 VOUT1 IOUT1 R5323x Series CE2 V OUT2 CE1 V OUT1 VDD GND C1 C2 A ISS Fig.1 Standard test Circuit Fig.2 Supply Current Test Circuit R5323x Series CE2 V OUT2 CE1 V OUT1 VDD GND IOUT2 IOUT1 PG Pulse Generator R5323x Series CE2 V OUT2 CE1 V OUT1 VDD GND C1 IOUT1b IOUT1a IOUT2a IOUT2b Fig.3 Ripple Rejection, Line Transient Respon se Fig.4 Load Transient Response Test Circuit Test Circuit

1) Output Voltage vs. Output Current (Topt =25°C) 1.5V (VR1) 1.5V (VR2) 1.6 1.4 1.2 0.8 0.6 0.4 0.2 Output Current IOUT (mA) Output Voltage VOUT (V) 0 100 200 300 400 VIN=1.8V VIN=2.0V VIN=3.5V VIN=2.5V 1.6 1.4 1.2 0.8 0.6 0.4 0.2 0 100 200 300 400 Output Current IOUT (mA) Output Voltage VOUT (V) VIN=1.8V VIN=2.0V VIN=3.5V VIN=2.5V 2.8V (VR1) 2.8V (VR2) 2.5 1.5 0.5 0 100 200 300 400 Output Current IOUT (mA) Output Voltage VOUT (V) VIN=3.1V VIN=4.8V 2.5 1.5 0.5 0 100 200 300 400 Output Current IOUT (mA) Output Voltage VOUT (V) VIN=3.1V VIN=4.8V 4.0V (VR1) 4.0V (VR2) 0 100 200 300 400 Output Current IOUT (mA) Output Voltage VOUT (V) VIN=4.3V VIN=6.0V 0 100 200 300 400 Output Current IOUT (mA) Output Voltage VOUT (V) VIN=4.3V VIN=6.0V

2) Output Voltage vs. Input Voltage (Topt=25°C) 1.5V (VR1) 1.5V (VR2) 1.6 1.4 1.5 1.3 1.1 1.2 123 56 4 Input Voltage VIN(V) Output Voltage VOUT (V) 1mA 30mA 50mA 1.6 1.4 1.5 1.3 1.1 1.2 123 56 4 Input Voltage VIN(V) Output Voltage VOUT (V) 1mA 30mA 50mA 2.8V (VR1) 2.8V (VR2) 2.9 2.6 2.8 2.5 2.1 2.3 123 56 4 2.7 2.4 2.2 Input Voltage VIN(V) Output Voltage VOUT (V) 1mA 30mA 50mA 2.9 2.6 2.8 2.5 2.1 2.3 123 56 4 2.7 2.4 2.2 Input Voltage VIN(V) Output Voltage VOUT (V) 1mA 30mA 50mA 4.0V (VR1) 4.0V (VR2) 4.2 3.8 3.6 3.4 123 56 4 3.2 Input Voltage VIN(V) Output Voltage VOUT (V) 1mA 30mA 50mA 4.2 3.8 3.6 3.4 123 56 4 3.2 Input Voltage VIN(V) Output Voltage VOUT (V) 1mA 30mA 50mA

3) Dropout Voltage vs. Temperature 1.5V (VR1) 1.5V (VR2) 0.6 0.5 0.4 0.3 0.2 0.1 Output Current IOUT (mA) Dropout Voltage VDIF(V) 0 25 50 100 125 15075 Topt= 85°C 25°C -40°C 0.6 0.5 0.4 0.3 0.2 0.1 0 25 50 100 125 15075 Output Current IOUT (mA) Dropout Voltage VDIF(V) Topt= 85°C 25°C -40°C 2.8V (VR1) 2.8V (VR2) 0.4 0.35 0.25 0.3 0.2 0.15 0.1 0.05 0 25 50 100 125 15075 Output Current IOUT (mA) Dropout Voltage VDIF(V) Topt= 85°C 25°C -40°C 0.4 0.35 0.25 0.3 0.2 0.15 0.1 0.05 0 25 50 100 125 15075 Output Current IOUT (mA) Dropout Voltage VDIF(V) Topt= 85°C 25°C -40°C 4.0V (VR1) 4.0V (VR2) 0.4 0.35 0.25 0.3 0.2 0.15 0.1 0.05 0 25 50 100 125 15075 Output Current IOUT (mA) Dropout Voltage VDIF(V) Topt= 85°C 25°C -40°C 0.4 0.35 0.25 0.3 0.2 0.15 0.1 0.05 0 25 50 100 125 15075 Output Current IOUT (mA) Dropout Voltage VDIF(V) Topt= 85°C 25°C -40°C

4) Output Voltage vs. Temperature 1.5V (VR1) 1.5V (VR2) 1.54 1.53 1.52 1.51 1.50 1.49 1.48 1.47 1.46 Temperature Topt(°C ) -50 -25 0 50 75 10025 Output Voltage VOUT (V) VIN=2.5V, IOUT =30mA 1.54 1.53 1.52 1.51 1.50 1.49 1.48 1.47 1.46 -50 -25 0 50 75 10025 VIN=2.5V, IOUT =30mA Temperature Topt(°C ) Output Voltage VOUT (V) 2.8V (VR1) 2.8V (VR2) 2.86 2.84 2.82 2.80 2.78 2.76 2.74 -50 -25 0 50 75 10025 VIN=3.8V, IOUT =30mA Temperature Topt(°C ) Output Voltage VOUT (V) 2.86 2.84 2.82 2.80 2.78 2.76 2.74 -50 -25 0 50 75 10025 VIN=3.8V, IOUT =30mA Temperature Topt(°C ) Output Voltage VOUT (V) 4.0V (VR1) 4.0V (VR2) 4.08 4.06 4.02 4.00 3.98 3.94 3.92 -50 -25 0 50 75 10025 4.04 3.96 VIN=5.0V, IOUT =30mA Temperature Topt(°C ) Output Voltage VOUT (V) 4.08 4.06 4.02 4.00 3.98 3.94 3.92 -50 -25 0 50 75 10025 4.04 3.96 VIN=5.0V, IOUT =30mA Temperature Topt(°C ) Output Voltage VOUT (V)

5) Supply Current vs. Input Voltage (Topt=25°C) 1.5V 2.8V 100 Input Voltage VIN(V) 012 456 3 Supply Current ISS (µA) VR1 VR2 100 012 456 3 Input Voltage VIN(V) Supply Current ISS (µA) VR1 VR2 4.0V 100 012 456 3 Input Voltage VIN(V) Supply Current ISS (µA) VR1 VR2 6) Supply Current vs. Temperature 1.5V (VR1) 1.5V (VR2) 100 -50 -25 25 50 75 100 VIN=2.5V Supply Current ISS (µA) Temperature Topt(°C ) 100 -50 -25 25 50 75 100 VIN=2.5V Supply Current ISS (µA) Temperature Topt(°C )

2.8V (VR1) 2.8V (VR2) 100 -50 -25 25 50 75 100 VIN=3.8V Supply Current ISS (µA) Temperature Topt(°C ) 100 -50 -25 25 50 75 100 VIN=3.8V Supply Current ISS (µA) Temperature Topt(°C ) 4.0V (VR1) 4.0V (VR2) 100 -50 -25 25 50 75 100 VIN=5.0V Supply Current ISS (µA) Temperature Topt(°C ) 100 -50 -25 25 50 75 100 VIN=5.0V Supply Current ISS (µA) Temperature Topt(°C ) 7) Dropout Voltage vs. Set Output Voltage (Topt=25°C) VR1 VR2 Set Output Voltage Vreg(V) 0.6 0.5 13 4 Dropout Voltage VDIF(V) 0.3 0.2 0.4 0.1 10mA 30mA 50mA 150mA 0.6 0.5 13 4 0.3 0.2 0.4 0.1 Set Output Voltage Vreg(V) Dropout Voltage VDIF(V) 10mA 30mA 50mA 150mA

8) Ripple Rejection vs. Frequency (Topt =25°C) 1.5V (VR1) 1.5V (VR2) 0.1 1 10 100 Ripple Rejection RR(dB) Frequency f(kHz) VIN=2.5V+0.5Vp-p, COUT =Ceramic 1.0µF IOUT =1mA IOUT =30mA IOUT =150mA 0.1 1 10 100 VIN=2.5V+0.5Vp-p, COUT =Ceramic 1.0µF Ripple Rejection RR(dB) Frequency f(kHz) IOUT =1mA IOUT =30mA IOUT =150mA 1.5V (VR1) 1.5V (VR2) 0.1 1 10 100 VIN=2.5V+0.5Vp-p, COUT =Ceramic 2.2µF Ripple Rejection RR(dB) Frequency f(kHz) IOUT =1mA IOUT =30mA IOUT =150mA 0.1 1 10 100 VIN=2.5V+0.5Vp-p, COUT =Ceramic 2.2µF Ripple Rejection RR(dB) Frequency f(kHz) IOUT =1mA IOUT =30mA IOUT =150mA 2.8V (VR1) 2.8V (VR2) 0.1 1 10 100 VIN=3.8V+0.5Vp-p, COUT =Ceramic 1.0µF Ripple Rejection RR(dB) Frequency f(kHz) IOUT =1mA IOUT =30mA IOUT =150mA 0.1 1 10 100 VIN=3.8V+0.5Vp-p, COUT =Ceramic 1.0µF Ripple Rejection RR(dB) Frequency f(kHz) IOUT =1mA IOUT =30mA IOUT =150mA

2.8V (VR1) 2.8V (VR2) 0.1 1 10 100 VIN=3.8V+0.5Vp-p, COUT =Ceramic 2.2µF Ripple Rejection RR(dB) Frequency f(kHz) IOUT =1mA IOUT =30mA IOUT =150mA 0.1 1 10 100 VIN=3.8V+0.5Vp-p, COUT =Ceramic 2.2µF Ripple Rejection RR(dB) Frequency f(kHz) IOUT =1mA IOUT =30mA IOUT =150mA 4.0V (VR1) 4.0V (VR2) 0.1 1 10 100 VIN=5.0V+0.5Vp-p, COUT =Ceramic 1.0µF Ripple Rejection RR(dB) Frequency f(kHz) IOUT =1mA IOUT =30mA IOUT =150mA 0.1 1 10 100 VIN=5.0V+0.5Vp-p, COUT =Ceramic 1.0µF Ripple Rejection RR(dB) Frequency f(kHz) IOUT =1mA IOUT =30mA IOUT =150mA 4.0V (VR1) 4.0V (VR2) 0.1 1 10 100 VIN=5.0V+0.5Vp-p, COUT =Ceramic 2.2µF Ripple Rejection RR(dB) Frequency f(kHz) IOUT =1mA IOUT =30mA IOUT =150mA 0.1 1 10 100 VIN=5.0V+0.5Vp-p, COUT =Ceramic 2.2µF Ripple Rejection RR(dB) Frequency f(kHz) IOUT =1mA IOUT =30mA IOUT =150mA

9) Ripple Rejection vs. Input Voltage (DC bias) C OUT = Ceramic 1.0µF (Topt=25°C) 2.8V (VR1) 2.8V (VR2) 100 2.9 3 3.2 3.3 3.1 IOUT =1mA Ripple Rejection RR(dB) Input Voltage VIN(V) f=1kHz f=10kHz f=100kHz 100 2.9 3 3.2 3.3 3.1 IOUT =1mA Ripple Rejection RR(dB) Input Voltage VIN(V) f=1kHz f=10kHz f=100kHz 2.8V (VR1) 2.8V (VR2) 100 2.9 3 3.2 3.3 3.1 IOUT =30mA Ripple Rejection RR(dB) Input Voltage VIN(V) f=1kHz f=10kHz f=100kHz 100 2.9 3 3.2 3.3 3.1 IOUT =30mA Ripple Rejection RR(dB) Input Voltage VIN(V) f=1kHz f=10kHz f=100kHz 2.8V (VR1) 2.8V (VR2) 100 2.9 3 3.2 3.3 3.1 IOUT =50mA Ripple Rejection RR(dB) Input Voltage VIN(V) f=1kHz f=10kHz f=100kHz 100 2.9 3 3.2 3.3 3.1 IOUT =50mA Ripple Rejection RR(dB) Input Voltage VIN(V) f=1kHz f=10kHz f=100kHz

10) Input Transient Response R5323N001x(2.8V, VR1) Time T(µs) 2.79 2.84 2.85 Output Voltage VOUT (V) Input Voltage VIN(V) 2.80 2.81 2.82 2.83 0 1 02 03 04 05 06 07 08 0 9 0 1 0 0 IOUT =30mA, tr=tf=5µs, C OUT =Ceramic 1.0µF VIN VOUT R5323N001x(2.8V, VR1) 2.79 2.84 2.85 2.80 2.81 2.82 2.83 0 1 02 03 04 05 06 07 08 0 9 0 1 0 0 Topt=25°C, COUT =Ceramic 2.2µF Time T(µs) Output Voltage VOUT (V) Input Voltage VIN(V)VIN VOUT R5323N001x(2.8V, VR1) 2.79 2.84 2.85 2.80 2.81 2.82 2.83 0 1 02 03 04 05 06 07 08 0 9 0 1 0 0 Topt=25°C, COUT =Ceramic 4.4µF Time T(µs) Output Voltage VOUT (V) Input Voltage VIN(V)VIN VOUT

R5323N001x(2.8V, VR2) 2.79 2.84 2.85 2.80 2.81 2.82 2.83 0 1 02 03 04 05 06 07 08 0 9 0 1 0 0 Time T(µs) Output Voltage VOUT (V) Input Voltage VIN(V) Topt=25°C, COUT =Ceramic 1.0µF VIN VOUT R5323N001x(2.8V, VR2) 2.79 2.84 2.85 2.80 2.81 2.82 2.83 0 1 02 03 04 05 06 07 08 0 9 0 1 0 0 Topt=25°C, COUT =Ceramic 2.2µF Time T(µs) Output Voltage VOUT (V) Input Voltage VIN(V)VIN VOUT R5323N001x(2.8V, VR2) 2.79 2.84 2.85 2.80 2.81 2.82 2.83 0 1 02 03 04 05 06 07 08 0 9 0 1 0 0 Topt=25°C, COUT =Ceramic 4.4µF Time T(µs) Output Voltage VOUT (V) Input Voltage VIN(V)VIN VOUT

11) Load Transient Response 2.8V (VR1) 2.8V (VR2) 2.80 0 5 10 15 20 Output Current IOUT1 (mA ) 2.85 2.85 150 100 2.80 2.75 2.75 C IN=Ceramic 1.0µF, COUT =Ceramic 1.0µF Time T(µs) Output Voltage VOUT (V) VOUT1 VOUT2 IOUT2 =30mA IOUT1 2.80 0 5 10 15 20 2.85 2.85 150 100 2.80 2.75 2.75 C IN=Ceramic 1.0µF, COUT =Ceramic 1.0µF Output Current IOUT2 (mA ) Time T(µs) Output Voltage VOUT (V) VOUT1 VOUT2 IOUT1 =30mA IOUT2 2.8V (VR1) 2.8V (VR2) 2.80 2.70 3.00 2.95 2.70 0 5 10 15 20 2.85 2.90 2.85 150 100 2.80 2.75 2.75 C IN=Ceramic 1.0µF, COUT =Ceramic 4.4µF Output Current IOUT1 (mA ) Time T(µs) Output Voltage VOUT (V) VOUT1 VOUT2 IOUT2 =30mA IOUT1 2.80 0 5 10 15 20 2.85 2.85 150 100 2.80 2.75 2.75 C IN=Ceramic 1.0µF, COUT =Ceramic 1.0µF Output Current IOUT2 (mA ) Time T(µs) Output Voltage VOUT (V) 2.70 3.00 2.95 2.70 2.90 VOUT1 VOUT2 IOUT1 =30mA IOUT2 2.8V (VR2) 2.8V (VR2) 2.80 2.70 3.00 2.95 2.70 0 5 10 15 20 2.85 2.90 2.85 150 100 2.80 2.75 2.75 C IN=Ceramic 1.0µF, COUT =Ceramic 2.2µF Output Current IOUT2 (mA ) Time T(µs) Output Voltage VOUT (V) VOUT1 VOUT2 IOUT1 =30mA IOUT2 2.80 2.70 3.00 2.95 2.70 0 5 10 15 20 2.85 2.90 2.85 150 100 2.80 2.75 2.75 C IN=Ceramic 1.0µF, COUT =Ceramic 4.4µF Output Current IOUT2 (mA ) Time T(µs) Output Voltage VOUT (V) VOUT1 VOUT2 IOUT1 =30mA IOUT2

12) Minimum Operating Voltage 1.5V Minimum Operating Voltage Range 2.3 2.2 1.9 1.7 1.5 Output Current IOUT (mA) VDD (V) 0 75 150 2.1 1.8

1.6 VDD

VIN(MIN) TECHNICAL NOTES When using these ICs, consider the following points: In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, be sure to use a 1.0 µF or more capacitance C OUT with good frequency characteristics and ESR (Equivalent Series Resistance) of which is in the range described as follows: The relations between I OUT (Output Current) and ESR of Output Capacitor are shown in the typical characteristics above. The conditions when the white noise level is under 40 µV (Avg.) are marked as the hatched area in the graph. Test these ICs with as same external components as ones to be used on the PCB. ⋅ Make VDD and GND lines sufficient. When their impedance is high, the noise pick-up or incorrect operation may result. ⋅ Connect the capacitor with a capacitance of 1µF or more between VDD and GND as close as possible. ⋅ Set external components, especially Output Capacitor, as close as possible to the ICs and make wiring as short as possible.

ESR vs. Output Current R5323N/K 1.5V (VR1) R5323N/K 1.5V (VR2) Output Current IOUT (mA) 100 0.1

0.01 ESR( Ω)

Topt=25°C, CIN=C OUT =Ceramic 1.0µF, VIN=25V, f=10Hz to 2MHz(BW=30Hz) 100 0.1 Topt=25°C, CIN=C OUT =Ceramic 1.0µF, VIN=25V, f=10Hz to 2MHz(BW=30Hz) Output Current IOUT (mA) R5323N/K 2.8V (VR1) R5323N/K 2.8V (VR2) 100 0.1 Output Current IOUT (mA) C IN=C OUT =Ceramic 1.0µF, VIN=2.5V, f=10Hz to 2MHz(BW=30Hz) 100 0.1 C IN=C OUT =Ceramic 1.0µF, VIN=2.5V, f=10Hz to 2MHz(BW=30Hz) Output Current IOUT (mA) R5323Z 1.5V (VR1/VR2) R5323Z 2.8V (VR1/VR2) 100 0.1 0.01 Output Current IOUT (mA) 0 100 50 150 ESR( Ω) C IN=Ceramic 1.0µF, COUT =Ceramic 1.0µF 100 0.1 0.01 Output Current IOUT (mA) 0 100 50 150 ESR( Ω) C IN=Ceramic 1.0µF, COUT =Ceramic 1.0µF

PACKAGE INFORMATION PE-SOT-23-6-0510

  • SOT-23-6 (SC-74) Unit: mm PACKAGE DIMENSIONS 1.9±0.2 0.8±0.1 0 to 0.1 0.4+0.1 −0.2 1.1+0.2 −0.1 2.9±0.2 2.8±0.3 1.6 +0.2 −0.1 (0.95) (0.95) +0.1 −0.050.15 0.2 MIN. TAPING SPECIFICATION 564 213 2.0±0.05 3.3 4.0±0.12.0MAX. TR User Direction of Feed 3.5±0.05 8.0±0.3 1.75±0.1 3.2 ∅1.1±0.1 TAPING REEL DIMENSIONS (1reel=3000pcs) 11.4±1.0 9.0±0.3 2±0.5 13±0.2 180 −1.5 21±0.8

PACKAGE INFORMATION PE-SOT-23-6-0510 POWER DISSIPATION (SOT-23-6) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plactic (Double sided) Board Dimensions 40mm × 40mm × 1.6mm Copper Ratio Top side : Approx. 50% , Back side : Approx. 50% Through-hole φ0.5mm × 44pcs Measurement Result ( T o p t = 2 5 °C,Tjmax=125°C) Standard Land Pattern Free Air Power Dissipation 420mW 250mW Thermal Resistance θja=(125−25°C)/0.42W=263°C/W 400 °C/W 0 50 10025 75 85 125 150 Ambient Temperature (°C) 200 100 300 400 420 500 600Power Dissipation PD(mW) On Board Power Dissipation Measurement Board Pattern IC Mount Area Unit : mm RECOMMENDED LAND PATTERN 0.7 MAX. 0.950.95 1.9 2.4 1.0 (Unit: mm)

PACKAGE INFORMATION PE-PLP1820-6-0611

  • PLP1820-6 Unit: mm PACKAGE DIMENSIONS A B1.80 2.00 0.05 0.05 × 4 INDEX 0.6Max. 0.05 M AB0.20±0.1 0.25±0.1 1.0±0.1 0.25±0.1 4 6 0.5 0.3±0.1 1.6±0.1 0.1NOM. Bottom View Attention: Tabs or Tab suspension leads in the parts have VDD or GND level.(They are connected to the reverse side of this IC.) Refer to PIN DISCRIPTION. Do not connect to other wires or land patterns. TAPING SPECIFICATION 1.5 +0.1 00.25±0.1 1.1Max. 4.0±0.1 2.0±0.05 4.0±0.1 2.2 2.4 1.1±0.1 1.75±0.13.5±0.05 8.0±0.3 TR User Direction of Feed TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-08Bc) (1reel=5000pcs) (R5323K,R5325K : 1reel=3000pcs) 2±0.5 21±0.8 11.4±1.0 9.0±0.3 60∅ +1 180∅ 0 −1.5 13±0.2∅

PACKAGE INFORMATION PE-PLP1820-6-0611 POWER DISSIPATION (PLP1820-6) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plactic (Double sided) Board Dimensions 40mm × 40mm × 1.6mm Copper Ratio Top side : Approx. 50% , Back side : Approx. 50% Through-hole φ0.54mm × 30pcs Measurement Result (Topt=25°C,Tjmax=125°C) Standard Land Pattern Power Dissipation 880mW Thermal Resistance θja=(125−25°C)/0.88W=114°C/W 0 50 10025 75 85 125 150 Ambient Temperature (°C) 400 200 600 800 880 1000Power Dissipation PD(mW) On Board 1200 Power Dissipation Measurement Board Pattern IC Mount Area Unit : mm RECOMMENDED LAND PATTERN 1.00 0.450.75 1.60 0.35 0.25 0.5 0.5 (Unit: mm)

PACKAGE INFORMATION PE-WLCSP-6-P1-0606

  • WLCSP-6-P1 Unit: mm PACKAGE DIMENSIONS 0.5 0.5 0.05 INDEX A 1.29 0.10 S B0.79 0.40±0.02 0.08±0.03 0.06 S S SA B 0.5 ∅0.05∅0.16±0.03 MBottom View TAPING SPECIFICATION(TR: Standard Type) User Direction of Feed 1.2MAX. Dummy Pocket 0.18±0.1 8.0±0.3 4.0±0.1 ∅0.5±0.1 2.0±0.05 1.38 2.0±0.05∅1.5+0.1 0.88 0.7 0.95 1.0 2.0 TAPING REEL DIMENSIONS (1reel=3000pcs) 21±0.8 2±0.5 13±0.2 180 –1.5 11.4±1.0 9.0±0.3

PACKAGE INFORMATION PE-WLCSP-6-P1-0606 POWER DISSIPATION (WLCSP-6-P1) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plactic (Double sided) Board Dimensions 40mm × 40mm × 1.6mm Copper Ratio Top side : Approx. 50% , Back side : Approx. 50% Through-hole − Measurement Result (Topt=25°C,Tjmax=125°C) Standard Land Pattern Power Dissipation 633mW Thermal Resistance θja=(125−25°C)/0.633W=158°C/W 0 50 10025 75 85 125 150 Ambient Temperature (°C) 200 100 300 400 633 500 600Power Dissipation PD(mW) On Board Measurement Board Pattern Power Dissipation IC Mount Area (Unit : mm)

PACKAGE INFORMATION PE-WLCSP-6-P1-0606 RECOMMENDED LAND PATTERN (WLCSP) NSMD Solder Mask (resist) Copper Pad Substrate SMD （Unit : mm） NSMD and SMD Pad Definition Pad definition Copper Pad Solder Mask Opening NSMD (Non-Solder Mask defined) 0.20mm Min. 0.30mm SMD (Solder Mask defined) Min. 0.30mm 0.20mm * Pad layout and size can be modified by customers material, equipment, method. * Please adjust pad layout according to your conditions. * Since lead free WL-CSP components are not compatible with the tin/lead solder process, you shall not mount lead free WL-CSP components using the tin/lead solder paste.

MARK INFORMATION ME-R5323N-0610 R5323N SERIES MARK SPECIFICATION

  • SOT-23-6 (SC-74) 1 2 3 4 1 , 2 : Product Code (refer to Part Number vs. Product Code) 3 , 4 : Lot Number
  • Part Number vs. Product Code Product Code Product Code Product Code Part Number 1 2 Part Number 1 2 Part Number 1 2 R5323N001B N 0 R5323N030B N Z R5323N001A U G R5323N002B N 1 R5323N031B U 0 R5323N002A N 9 R5323N003B N 2 R5323N032B U 1 R5323N003A N A R5323N004B N 3 R5323N033B U 2 R5323N013A N C R5323N005B N 4 R5323N034B U 3 R5323N019A N J R5323N006B N 5 R5323N035B U 4 R5323N020A N L R5323N007B N 6 R5323N036B U 5 R5323N023A N Q R5323N008B N 7 R5323N037B U 7 R5323N024A N S R5323N009B N 8 R5323N038B U 8 R5323N030A N Y R5323N010B N B R5323N039B U 9 R5323N011B U 6 R5323N040B U A R5323N012B N W R5323N041B U B R5323N013B N T R5323N042B U C R5323N014B N D R5323N043B U H R5323N015B N E R5323N044B U J R5323N016B N F R5323N017B N G R5323N018B N H R5323N019B N K R5323N020B N M R5323N021B N N R5323N022B N P R5323N023B N R R5323N024B U D R5323N025B U E R5323N026B N X R5323N027B N U R5323N028B U F R5323N029B N V

MARK INFORMATION ME-R5323K-0610 R5323K SERIES MARK SPECIFICATION

  • PLP1820-6 1 2 3 4 5 6 1 to 4 : Product Code (refer to Part Number vs. Product Code) 5 , 6 : Lot Number
  • Part Number vs. Product Code Product Code Product Code Product Code Part Number 1 2 3 4 Part Number 1 2 3 4 Part Number 1 2 3 4 R5323K001B C 0 0 1 R5323K030B C 0 3 4 R5323K001A C 0 5 1 R5323K002B C 0 0 2 R5323K031B C 0 3 5 R5323K002A C 0 1 0 R5323K003B C 0 0 3 R5323K032B C 0 3 6 R5323K003A C 0 1 1 R5323K004B C 0 0 4 R5323K033B C 0 3 7 R5323K013A C 0 1 3 R5323K005B C 0 0 5 R5323K034B C 0 3 8 R5323K019A C 0 1 9 R5323K006B C 0 0 6 R5323K035B C 0 3 9 R5323K020A C 0 2 1 R5323K007B C 0 0 7 R5323K036B C 0 4 0 R5323K023A C 0 2 5 R5323K008B C 0 0 8 R5323K037B C 0 4 2 R5323K024A C 0 2 7 R5323K009B C 0 0 9 R5323K038B C 0 4 3 R5323K030A C 0 3 3 R5323K010B C 0 1 2 R5323K039B C 0 4 4 R5323K011B C 0 4 1 R5323K040B C 0 4 5 R5323K012B C 0 3 1 R5323K041B C 0 4 6 R5323K013B C 0 2 8 R5323K042B C 0 4 7 R5323K014B C 0 1 4 R5323K043B C 0 5 2 R5323K015B C 0 1 5 R5323K044B C 0 5 3 R5323K016B C 0 1 6 R5323K017B C 0 1 7 R5323K018B C 0 1 8 R5323K019B C 0 2 0 R5323K020B C 0 2 2 R5323K021B C 0 2 3 R5323K022B C 0 2 4 R5323K023B C 0 2 6 R5323K024B C 0 4 8 R5323K025B C 0 4 9 R5323K026B C 0 3 2 R5323K027B C 0 2 9 R5323K028B C 0 5 0 R5323K029B C 0 3 0

MARK INFORMATION ME-R5323Z-0505 R5323Z SERIES MARK SPECIFICATION

  • WLCSP-6-P1 1 32 1 : G (Fixed) 2 , 3 : Lot Number
  • Product Code vs. Marking Product Code Product Code Product Code Product CodePart Number Part Number Part Number Part Number R5323Z001A G R5323Z021A G R5323Z001B G R5323Z021B G R5323Z002A G R5323Z022A G R5323Z002B G R5323Z022B G R5323Z003A G R5323Z023A G R5323Z003B G R5323Z023B G R5323Z004A G R5323Z024A G R5323Z004B G R5323Z024B G R5323Z005A G R5323Z025A G R5323Z005B G R5323Z025B G R5323Z006A G R5323Z026A G R5323Z006B G R5323Z026B G R5323Z007A G R5323Z027A G R5323Z007B G R5323Z027B G R5323Z008A G R5323Z028A G R5323Z008B G R5323Z028B G R5323Z009A G R5323Z029A G R5323Z009B G R5323Z029B G R5323Z010A G R5323Z030A G R5323Z010B G R5323Z030B G R5323Z011A G R5323Z031A G R5323Z011B G R5323Z031B G R5323Z012A G R5323Z032A G R5323Z012B G R5323Z032B G R5323Z013A G R5323Z033A G R5323Z013B G R5323Z033B G R5323Z014A G R5323Z034A G R5323Z014B G R5323Z034B G R5323Z015A G R5323Z035A G R5323Z015B G R5323Z035B G R5323Z016A G R5323Z036A G R5323Z016B G R5323Z036B G R5323Z017A G R5323Z037A G R5323Z017B G R5323Z037B G R5323Z018A G R5323Z038A G R5323Z018B G R5323Z038B G R5323Z019A G R5323Z039A G R5323Z019B G R5323Z039B G R5323Z020A G R5323Z040A G R5323Z020B G R5323Z040B G R5323Z041A G R5323Z041B G