R281

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 11

Technical content

© Semiconductor Components Industries, LLC, 2016 March, 2018 − Rev. 4

1 Publication Order Number:

Always-Listening, Voice Trigger Solution Introduction BelaSigna® R281 is an ultra−low−power voice trigger solution for a wide range of consumer electronic devices. In a typical application BelaSigna R281 is “always listening” and will detect a single, user−trained trigger phrase, asserting a wake−up signal when this trigger phrase is detected. “Always−listening” key phrase detection with an average power consumption of less than 300 /C0109W (not including the power consumption of the microphone) preserves Standby battery life. BelaSigna R281 is an ultra−miniature solution that is available in a 2.45 mm x 2.77 mm WLCSP package. It can be designed onto a single layer PCB with 5 mil routing and with a minimal amount of external components. An external, I 2C host controller is required to configure the device for operation. Key Features Proven Ultra−Low−Power Digital Signal Processing (DSP) Technology

• Audio DSP Technology Originally Developed for Hearing Aids Offers the Required Computational Power at Extremely Low Current Consumption
• < 300 /C0109W Average Current Consumption (not including microphone) Mixed−Signal System−on−Chip (SoC)
• Audio−grade, Analog Input with Onboard Pre−amplifier
• Built−in, Regulated V oltages Including Onboard Microphone Bias for Power Efficient Operation
• Supports Analog or Digital Microphone Input Interfaces and Peripherals
• I2C−based Device Configuration and Control
• GPIO Wake Signal
• Internal Oscillator

Applications

• Mobile Phones
• Tablets
• Portable Electronic Devices
• Wearables
• Toys See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet.

ORDERING INFORMATION

0W689−001 = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week /C0071 = Pb−Free Package www.onsemi.com WLCSP31 CASE 567NB 0W703− 001 AWLYYWW /C0071

Table 1. ABSOLUTE MAXIMUM RATINGS should not be assumed, damage may occur and reliability may be affected. Table 2. RECOMMENDED OPERATING CONDITIONS Table 3. ESD AND LATCH−UP CHARACTERISTICS design and/or characterization. production test limits, design, or characterization data. Table 4. SYSTEM DC ELECTRICAL CHARACTERISTICS

Table 5. DIGITAL I/O PINS (I2C, WAKE_UP, DMIC) DC ELECTRICAL CHARACTERISTICS Table 6. VDDA REGULATOR DC & AC ELECTRICAL CHARACTERISTICS Table 7. VREG REGULATOR DC & AC ELECTRICAL CHARACTERISTICS Table 8. VDDD REGULATOR DC & AC ELECTRICAL CHARACTERISTICS

Figure 1. BelaSigna R281 WLCSP Suggested PCB Routing

Figure 2. BelaSigna R281 System Diagram (WLCSP Package)

www.onsemi.com Description of Operation Efficient implementation of the trigger phrase recognition algorithm is accomplished through the use of three processing units running concurrently. In addition to the main DSP core performing system configuration and signal processing, an input/output processor continuously collects frames of input speech signals which are analyzed by a highly optimized frequency domain co−processor. There are two main modes of operation: Recognition Mode and Training Mode. Recognition Mode When in Recognition Mode, the entire system remains in an extremely low−power, “always−on” state continuously listening for speech. When speech is detected, the algorithm proceeds to extract features from the collected audio data, comparing these features to a known set of data computed during the training process. If the features appear to be similar enough to the trained feature data, a match is indicated on the WAKE_UP pin. Once the feature extraction and comparison is complete, the system returns to its original low−power state, once again waiting until speech is detected. Training Mode Before BelaSigna R281 can be placed into Recognition Mode, it must be trained. Training involves recording and analyzing three utterances of a trigger phrase. A trigger phrase can be any collection of words or sounds, in any language, up to a maximum length of approximately 1.5 seconds. When speaking a given phrase, a human will naturally say the same phrase subtly different each time. Having multiple instances of the same phrase, each slightly different, helps to make the matching algorithm more robust. Training must be performed in a quiet environment, or the trigger phrase match results in Recognition Mode will be unpredictable. BelaSigna R281 is placed into Training Mode by issuing an appropriate SetMode command via I 2C. The algorithm stores relevant feature data from the three separate utterances of the trigger phrase, also known as training templates. Once training is complete, the training templates can be read from memory and stored offline. This template data can then be loaded into memory in the event of a power cycle and the device can be placed directly into Recognition Mode, thus avoiding the need to re−train the device. This same procedure can be used to recognize multiple trigger phrases, provided they have each been individually trained and stored offline. Only one trigger phrase can be active at any one time. Refer to AND9267/D for more information on the different modes, as well as a description of the I 2C host control protocol. Initial Power−On State When BelaSigna R281 is powered on, the device will perform a brief initialization procedure and then wait for a connection to be made from an external host via I 2C. At this point, the host controller must connect to BelaSigna R281 and load its memory with the algorithm binary image, as well as the training template data. Once this has been completed, the device can be put into Recognition Mode. If no training template data is available (e.g. the training procedure has never been performed), then BelaSigna R281 must be placed into Training Mode and the training procedure performed before entering Recognition Mode. Whenever power is removed from the device, the contents of memory are lost and must be re−loaded. For more information refer to AND9267/D.

Figure 3. Recognition Rate Versus SNR present. The results are presented in Table 9. Table 9. AVERAGE CURRENT CONSUMPTION able to reliably trigger the device. which is used to indicate that the trigger phrase was detected. For more information refer to AND9267/D. in slave mode at an address of 0x62.

Table 10. PIN DESCRIPTION C1 VDDA Analog supply voltage (output), capacitor to VSSA, or connected to VBAT (max.

1. The value of the I 2C pull−ups is 10 K
2. Pull−up is disabled when the DMIC interface is enabled.

www.onsemi.com Reflow Information The reflow profile depends on the equipment that is used for the re−flow and the assembly that is being re−flowed. Information from JEDEC Standard 22−A113D and J−STD−020D.01 can be used as a guideline. Electrostatic Discharge (ESD) Device CAUTION: ESD sensitive device. Permanent damage may occur on devices subjected to high−energy electrostatic discharges. Proper ESD precautions in handling, packaging and testing are recommended to avoid performance degradation or loss of functionality. To order BelaSigna R281, please contact your account manager. Chip Identification Chip identification information can be retrieved using the GetChipID I2C command. Refer to AND9267/D for more details regarding supported I2C commands. Company or Product Inquiries For more information about ON Semiconductor Sales products or services visit our website at http://onsemi.com. Part Number Chip ID Package Option Shipping† BR281W31A101V1G 0x5000 WLCSP31 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

www.onsemi.com PACKAGE DIMENSIONS WLCSP31, 2.77x2.45 CASE 567NB ISSUE A SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF THE SOLDER BALLS. 4. DATUM C, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5. DIMENSION b IS MEASURED AT THE MAXIMUM BALL DIAMETER PARALLEL TO DATUM C. DIM A MIN NOM −−− MILLIMETERS D E b 0.20 0.225 e 0.40 BSC −−− ÈÈÈ ÈÈÈ ÈÈÈ E D A B PIN A1 REFERENCE A0.03 BC 0.15 C 0.05 C 31X b E C A 0.08 C C 0.17 0.20 0.20 31X DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.52 0.40 TOP VIEW SIDE VIEW BOTTOM VIEW NOTE 3 e RECOMMENDED PACKAGE OUTLINE 123 PITCH G I PITCH K M e1 0.52 BSC

0.405 REF

F D B H J L e/2 0.20 DETAIL A A DETAIL A A3 0.025 REF 2.74 2.77 2.42 2.45 MAX 0.25 0.635 0.23 2.80 2.48 R281/D BELASIGNA is a registered trademark of Semiconductor Components Industries, LLC. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries i n the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . A listing of ON Semiconductor’s product/patent ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the right s of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.