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© Semiconductor Components Industries, LLC, 2012 September, 2012 − Rev. 0

1 Publication Order Number:

BelaSigna® R262 is a complete system−on−chip (SoC) solution that provides wideband advanced noise reduction in voice capture applications such as mobile phones, V oIP applications such as webcams and tablet computers, two−way radios and other applications that will benefit from improved voice clarity. Featuring a novel approach to removing mechanical, stationary and non−stationary noise, the chip preserves voice naturalness for greater voice clarity and speech intelligibility even when the talker is further away or not optimally aligned with the microphones providing unmatched freedom of movement for end −users. Designed to be compatible with a wide range of codecs, baseband chips and microphones without the need for calibration, BelaSigna R262 is easy to integrate, improving manufacturers’ speed to market. Additional features include the ability to provide two simultaneously processed outputs and to configure them depending on the needs of a manufacturer’s device. The chip includes a highly optimized DSP −based application controller with industry −leading energy efficiency and is packaged in two highly compact 5.3 mm WLCSPs to fit into even the most sized−constrained architectures and allows the use of common industry printed circuit board design technologies. Key Features and Benefits

  • Drop−in Solution that Works without Special Tuning
  • Consistently Captures V oice Regardless of Acoustic Environment or the Orientation of the Handheld Device While in Use
  • 360° V oice Pick−up Adjustable From 5 cm to 5 m
  • No Constraints on Industrial Design or Microphone Model
  • Simultaneous Dual−configurable Outputs
  • De−reverberation
  • Low Power Consumption (17 mA active and 40 /C0109A stand−by)
  • Miniature Size Allows Easy Integration into Existing Industrial Designs Typical Applications
  • Mobile Phones
  • Notebook and Tablet Computers
  • Two−W ay Radios and PTT Devices
  • V oIP Applications
  • Any Device that would Benefit from Improved V oice Pick−up http://onsemi.com BR262 W30 ALYW MARKING DIAGRAMS WLCSP−30 W SUFFIX CASE 567CT See detailed ordering and shipping information in the package dimensions section on page 28 of this data sheet.

ORDERING INFORMATION

BR262 = BelaSigna R262 W30 = 30 −ball version W26 = 26 −ball version A = Assembly Location L = Wafer Lot YW = Date Code Year & Week = Pb−Free Package = A1 Corner Indicator WLCSP−26 W SUFFIX CASE 567CY BR262 W26 ALYW ORIENTATION BR262 W30 ALYW ÈÈ ÈÈ (Top View)

Table 1. ABSOLUTE MAXIMUM RATINGS

  1. Time limit at maximum voltage must be less than 100 ms.

NOTE: Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. This device series incorporates latch−up immunity and is tested in accordance with JESD78. Table 2. ELECTRICAL CHARACTERISTICS (The typical parameters in Table 2 were measured at 20°C with a clean

Table 2. ELECTRICAL CHARACTERISTICS (continued) (The typical parameters in Table 2 were measured at 20°C with a clean

  1. Processed bandwidth limited to 8 kHz.

2.048 MHz

2.4 MHz

2.8 MHz

3.072 MHz

  1. Many other clock frequencies are available through custom configuration of the internal PLL and clocking subsystem. See later in this

document and in the BelaSigna R262 Communications and Configuration Guide for more information on custom mode usage.

26 MHz

5.2 MHz

48.2 MHz

  1. Many other clock frequencies are available through custom configuration of the internal PLL and clocking subsystem. See later in this

document and in the BelaSigna R262 Communications and Configuration Guide for more information on custom mode usage.

Table 3. PIN CONNECTIONS

  • Pins C5, D4, D6 and E5 are not available on the WLCSP26 package.

All pins are available on the WLCSP30 package.

Figure 1. Typical Application Diagram for 30−ball WLCSP Package Option

appropriate ground plane, i.e. do not share a ground return. overlap each other if located on different layers in the board. Figure 2. Schematic of Ground Scheme

Figure 3. Proposed Ground Plane Positioning (soldering footprint view) consideration, see Table 4 and Table 5. connect to the star point with separate traces. as possible to the power pads. Table 4. Non−critical signals are outlined in Table 5. More in the Power Supply Unit section.

Table 4. CRITICAL SIGNALS

Table 5. NON−CRITICAL SIGNALS preamplifier is enabled by the ROM −based application. capacitor may be omitted for transparent bass response. VREG (1.0 V) or VDDA (2.0 V) can alternatively be used. Keep audio input traces strictly away from output traces. same to provide matched impedances. Table 6. UNUSED PIN RECOMMENDATIONS

The architecture of BelaSigna R262 is shown in Figure 4. Figure 4. BelaSigna R262 Architecture: A Complete Audio Processing System

http://onsemi.com Advanced Speech and Noise Management System BelaSigna R262 contains an advanced noise reduction algorithm inside its ROM memory which preserves voice quality while significantly reducing background noise. The algorithm identifies and enhances human speech. Many two−microphone algorithms depend on beamforming and rely on the speech originating from a specific direction. As a result, the performance of these algorithms can vary greatly depending on the location of the speech and the noise relative to the microphones, and typically will distort the speech as well as the noise. Other algorithms that depend on a speech−facing microphone and a noise−facing microphone can require a lot of algorithm tuning for reasonable performance. BelaSigna R262 is different as it is a true 360° self−adaptive multi−beamformer that distorts neither speech nor noise. It applies attenuation or gain based on intelligent classification of signals, resulting in a signal where the noise is attenuated, and the speech is enhanced. The attenuated noise is left as natural as possible so other downstream processing is still effective. At the same time it performs de−reverberation of the received signals. The solution is ideal for any voice capture device requiring consistent performance in noisy environments. Unlike other purely directional solutions, BelaSigna R262 will not drop your voice when you change orientation of the handheld device. The algorithm works with two forward−facing microphones spaced 10 to 30 mm apart (typically), and no tuning or matching of microphones is required. The speech source can come from any direction (normally in front of the microphones), as long as it is within the working sphere of the current algorithm mode. The algorithm mode is set based on the required talking distance (distance between the mouth reference point and the microphones), with noise reduction performance decreasing as talk distance increases. BelaSigna R262 can be set to perform maximum noise reduction with a talk distance of 5 to 10 cm, mild noise reduction with improved voice pickup at up to 5 m away, or anywhere in between. The noise reduction algorithm built into BelaSigna R262 can provide two processed outputs, each with different tuning or operating parameters, which can serve two different use cases simultaneously. An unlimited number of use cases can be obtained by configuring BelaSigna R262, where the user can easily select the appropriate distance between the device’s microphones and the user’s mouth. Any two of these use cases can be selected to the output stage, allowing the target application to simultaneously support use cases with mouth −to−microphone distances varying between 5 cm and 5 m. For additional details on the configuration of the algorithm, please refer to BelaSigna R262 Communications and Configuration Guide. Algorithm Performance BelaSigna R262 offers three main algorithm modes; the close−talk mode aggressively filters noise and manages gain to pick up speech within 5 to 10 cm from the microphone array. The algorithm is not sensitive to handset holding style in any mode, including close −talk mode. The near −talk mode can effectively pick up speech within 0.5 m to 1 m from the microphone array, an intermediate situation between far−talk and close−talk modes. This is suitable for capturing speech when using the device at arm’s length. The far−talk mode detects and enhances speech from a distance, but removes less overall environmental noise compared to close−talk mode. Far −talk mode is suitable for recording lectures or processing conference calls on speakerphone. In addition to these three main modes (close, near and far), BelaSigna R262 features a mixing capability, which allows the selection of any two of these three main modes combined through a mixing ratio to create any intermediate mode, allowing manufacturers to fine tune the algorithm based on the microphone−to−user distance on the target device. A selection of performance metrics are shown in Table 7 for some input signal −to−noise ratios and noise types. Signal−to−Noise Ratio Improvement (SNR −I) was measured according to the ITU −T G.160 standard, with BelaSigna R262 operating on reference hardware, in conjunction with common omni −directional microphones (ECMs) positioned 11 mm away from each other. To verify that subjective quality was maintained through the noise management process, a Perceptual Enhancement of Speech Quality (PESQ) measurement was also taken for each condition. PESQ improvement correlates to MOS improvement, the widely −accepted subjective standard in voice quality.

Table 7. ALGORITHM PERFORMANCE cm when the noise around the microphone increases. to 50 dB SPL) with a much larger pick−up distance. performance parameters that can be controlled.

  • The two microphones are facing the user’s mouth
  • The microphone centers are located within 10 to 25 mm from each other As mentioned, other configurations that differ from the above guidelines are fully supported. For example, a 15 cm distance between the two microphones will not degrade the performance as long as the microphones are both facing the user’s mouth. Alternatively, a configuration with one microphone at the front and one microphone at the back will not degrade the performance either, as long as the distance between the microphones is no more than 2 cm. BelaSigna R262 does not require any acoustic microphone calibration procedure. When selecting microphones to be used with BelaSigna R262, the following guidelines should be used:
  • Two omni−directional microphones with similar characteristics should be used
  • The microphone sensitivity should be approximately −42 dB (where 0 dB = 1 V/Pa, at 1 kHz)
  • The microphones are two−terminal microphones
  • The microphone power supply is either 1 V (recommended), or 2 V if it is to be provided by BelaSigna R262
  • The dynamic range of BelaSigna R262 on its analog input channels is 2.0 V peak−to−peak, after amplification by the default gain value of 24 dB using BelaSigna R262’s input preamplifiers
  • When higher sensitivity microphones are used, the preamp gain should be adjusted to match the 2.0 Vpp input voltage swing on BelaSigna R262, but this will require special configuration of the ROM application, as described later. As an example, using microphones with a −22 dB sensitivity typically requires that the preamplifier gains be changed down to 12 dB.
  • When MEMS microphone are to be used, a general increase of the algorithm performance can be expected due to the improved self noise of these microphones, compared to conventional electret microphones. For applications requiring microphone configurations differing significantly from the above recommendations, contact your local ON Semiconductor support representative. Operating Modes The default application stored in the ROM of BelaSigna R262 has four Operating Modes. The Operating Modes are summarized in Table 8.

Table 8. OPERATING MODES SUMMARY 2C command from another mode. the BelaSigna R262 Communications and Configuration Guide. the BelaSigna R262 Communications and Configuration Guide. Sleep Sleep mode can be entered via I2C commands. formation, see the Sleep Control section below. lowest power operating mode.

Table 9. BOOT SELECTION OPTIONS (Note 4) tom application (e.g. a baseband controller). BelaSigna R262 outputs a pure tone on the two output channels. BelaSigna R262 simply copies the input signals to the outputs.

  1. For more details on the various operating modes of BelaSigna R262, please consult the BelaSigna R262 Communications and Configuration

Table 10. CLOCK CONFIGURATION OPTIONS additional details. The performance of the algorithm itself is fully guaranteed. Table 11. CHANNEL CONFIGURATION OPTIONS Table 12. MIXER CONFIGURATION OPTIONS

other software tools provided by ON Semiconductor. been restored or a reset occurs. strategy, as described in the Power Management section. Figure 10. The input stage is comprised of two individual available on the 26−ball WLCSP package option.

a DMIC codec, it is not possible to use the internal oscillator. Communications and Configuration Guide. Figure 13. Power Supply Structure compose the BelaSigna R262 architecture. supply pins of BelaSigna R262. Table 13. POWER SUPPLY VOLTAGES VBAT The primary voltage supplied to BelaSigna R262 is VBAT. It is typically in the range 1.8 V – 3.3 V. external voltage regulators. connected to VDDA. A decoupling capacitor is only required when the output driver is being used. or to ground must be placed to filter power supply noise. devices on digital pins will happen at the level defined on this pin. phone power supply, when the VMIC pin cannot be used. when the VMIC pin cannot be used.

operation can no longer be guaranteed. operation under all supply conditions. are asynchronously reset to their default values. relevant parameters are shown in Table 14. Table 14. POWER MANAGEMENT PARAMETERS

  1. The internal regulators are enabled and allowed to
  2. The internal charge pump is enabled and allowed
  3. SYSCLK is connected to all of the system
  4. The system runs the ROM application

thus enabling the digital core. the required time, a POR sequence will occur again. clock, and take the appropriate actions whenever it disappears. See the system monitoring section for more information. interface with BelaSigna R262. CHAN_SEL, SPI_SERI/ALPHA_SEL and SWAP_CHAN. LSAD mode, the pins have a weak pull/C0042down to ground. details on the behavior of these GPIO and LSAD pins. operates in slave mode and the slave address is 0x61.

2C protocol is also supported. high speed PCM interface, as well as a high speed UART. the use of these interfaces, should this be required. and Long Term Storage Procedures. Table 15. LONG TERM STORAGE CONDITIONS wards storage in vacuum moisture bag with desiccant and humidity card. Storage in nitrogen cabinet allowed. for the re−flow and the assembly that is being re −flowed. passes at the maximum reflow peak temperature of 260°C. Table 16. RE−FLOW INFORMATION BelaSigna R262 has an average weight of 10.84 mg.

http://onsemi.com PACKAGE DIMENSIONS WLCSP30, 2.233x2.388 CASE 567CT−01 ISSUE A SEATING PLANE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. DIM A MIN MAX 0.84 MILLIMETERS D 2.388 BSC E b 0.24 0.29 eA 0.252 BSC 1.00 ÈÈ ÈÈ D E A B PIN A1 REFERENCE eA A0.05 BC 0.03 C 0.05 C 30X b 123 A B C 0.10 C A C 0.17 0.23

2.233 BSC

eB 0.310 BSC PITCH 0.25 30X DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.504 0.310

0.10 C2X

A2 0.72 REF RECOMMENDED PACKAGE OUTLINE 456 789 D E F G

http://onsemi.com PACKAGE DIMENSIONS WLCSP26, 2.388x2.233 CASE 567CY−01 ISSUE A SEATING PLANE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. DIM A MIN MAX 0.84 MILLIMETERS D 2.388 BSC E b 0.24 0.29 eD 0.252 BSC 1.00 ÈÈ ÈÈ D E A B PIN A1 REFERENCE eD A0.05 BC 0.03 C 0.05 C 26X b 123 A B C 0.10 C A C 0.17 0.23 eE 0.310 BSC PITCH 0.25 26X DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.504 0.31 A2 0.72 REF RECOMMENDED PACKAGE OUTLINE 456 789 D E F G

  1. If no pre −screening of solder paste is used,
  2. The solder mask opening should be >0.3 mm in
  3. The copper pad should have a diameter of
  4. Solder mask thickness should be less than 1 mil

long term reliability over temperature and physical shock. Table 17. ORDERING INFORMATION Specification Brochure, BRD8011/D. of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. BELASIGNA is a registered trademark of Semiconductor Components Industries, LLC.