FP0404 EATON | Alldatasheet

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Technical content

High frequency, high current power inductors

Description

  • High current carrying capacity
  • Low core loss
  • Frequency range up to 2 MHz
  • Inductance Range from 22 nH to 110 nH
  • Current range from 14 A to 40 A
  • 4.0 mm x 4.0 mm footprint surface mount pack- age in 3.0 mm and 4.0 mm heights
  • Ferrite core material

Applications

  • Multi-phase and Vcore regulators
  • Voltage Regulator Modules (VRMs)
  • Server and desktop VRMs and EVRDs
  • Laptop and notebook regulators
  • Data networking and storage systems
  • Graphics cards and battery power systems
  • Point-of-Load modules Environmental Data
  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HALOGEN HFFREE

High frequency, high current power inductors www.eaton.com/electronics Product Specifications Part Number5 OCL1 (nH) ±15% FLL2 (nH) minimum Irms (A) Isat1 (A) Isat2 (A) Isat3 (A) DCR (mΩ) @ +20 °C ±25% K-factor7 FP0404R1-R022-R 22 ±20% 15 19 40 34 32 0.32 ± 15% 2351 FP0404R1-R065-R 65 44 19 24 22 20 0.32 2248 FP0404R1-R080-R 80 54 19 20 18 16 0.32 2248 FP0404R1-R100-R 100 68 19 16 14 13 0.32 2248 FP0404R1-R110-R 110 74 19 14 13 12 0.32 2248 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz (1 MHz for R022), 0.1 Vrms, 0.0 Adc, +25 °C 2. Full Load Inductance (FLL) Test Parameters: 100 kHz (1 MHz for R022), 0.1 Vrms, I sat1, +25 °C 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C underworst case operating conditions verified in the end application. 4. Isat1 : Peak current for approximately 20% rolloff @ +25 °C 5. Isat2 : Peak current for approximately 20% rolloff @ +100 °C 6. Isat3 : Peak current for approximately 20% rolloff @ +125 °C 7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10 -3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak to peak ripple current in Amps). 8. Part Number Definition: FP0404-Rxxx-R FP0404 = Product code and size Rx= DCR indicator Rxxx=Inductance value in μH, R=decimal point -R suffix = RoHS compliant Dimensions (mm) Part Number C max R022-R 3.0 R065-R 4.0 R080-R 4.0 R100-R 4.0 R110-R 4.0 Part marking: Rxxx xxx=inductance value in uH, R=decimal point, wly= date code All soldering surfaces to be coplanar within 0.1 millimeters DCR is measured from paoint “a” to point “b” Do not route traces or vias underneath the inductor Recommended Pad Layout Schematic 4.0 max 4.0 max (R065, R080, R100, R110) (R022) 1.4 ±0.20 1.2 ±0.20 1.4 ±0.30 1.4 ±0.20 1.2 ±0.20 1.4 ±0.30 4.2 4.3 1.7 1.70.9 1.9

High frequency, high current power inductors www.eaton.com/electronics Packaging information (mm) FP0404R1-R022-R Supplied in tape and reel packaging, 1,800 parts per 13” diameter reel Packaging information (mm) FP0404R1-R065-R, R080-R, R100-R, R110-R Supplied in tape and reel packaging, 1,800 parts per 13” diameter reel T emperature rise vs. total loss Direction of feed 4.0 3.0 3.9 2.0 4.0 1.5 dia 1.5 dia 1.75 5.5 12.0 ±0.3 Direction of feed 4.0 4.2 4.1 4.0 2.0 1.5 dia 1.5 dia 1.75 7.5 16.0 ±0.3 Temperature Rise (°C) Total Loss (W) Total Loss (W) Temperature Rise (°C) FP0404R1-R022-R FP0404R1-R065-R, R080, R100-R, R110-R

High frequency, high current power inductors www.eaton.com/electronics Core loss FP0404R1-R022-R 0.0001 0.001 0.01 0.1 100 00001001 0 Core Loss (W) Core Loss vs. Bp-p Bp-p (Gauss) 100KHz 1MHz 500KHz 300KHz 200KHz 0.0001 0.001 0.01 0.1 1000 010 00001 Core Loss (W) 100KHz Bp-p (Gauss) 1MHz 500KHz 300KHz 200KHz Core Loss vs. Bp-p FP0404R1-R065-R, R080-R, R100-R, R110-R

High frequency, high current power inductors www.eaton.com/electronics Inductance characteristics 20% 40% 60% 80% 100% 120% 00 10 20 3045 00 60 70 80 90 01 % of OCL FP0404R1-R022-R Idc (Amps) -40°C +125 °C +100 °C +25°C 20% 40% 60% 80% 100% 120% 05 10 15 20 25 30 35 40 % of OCL Idc (Amps) -40°C +125 °C +100 °C +25°C 20% 40% 60% 80% 100% 120% 501 01 52 02 53 03 5 % of OCL FP0404R1-R080-R Idc (Amps) -40°C +125°C +100°C +25°C 20% 40% 60% 80% 100% 120% 05 10 15 20 25 30 % of OCL FP0404R1-R100-R Idc (Amps) -40°C +125 °C +100 °C +25°C 20% 40% 60% 80% 100% 120% 0246 81 02 14 16 1810 22 24 2 % of OCL FP0404R1-R110-R Idc (Amps) -40°C +125 °C +100 °C FP0404R1-R065-R +25°C

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4373-BU-SB15123 September 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. FP0404 High frequency, high current power inductors Technical Data 4373 Effective September 2017 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C