QMSS SAMTEC | Alldatasheet
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Technical content
Series: QMSS/QFSS High Speed Shielded Terminal 0.635 mm pitch © 2004 Samtec, Inc. Reviewed by: JET Revision: B Specification: PSQ-005 Approved by: JT Date:2/16/2011 Checked by: JE Page 1
1.0 SCOPE
1.1 This specification covers perform ance, tests and quality requirements for
the Samtec QMSS/QFSS High Speed Socket/Terminal 0.625 mm pitch
2.0 ELECTRICAL
2.1 Dielectric Withstanding Voltage, DWV, per EIA-364-20
2.1.1 900 VAC mated with QFSS
2.2 Insulation Resistance, IR, per EIA-364-21
2.2.1 > 5,000 Meg Ohms --- PASS
2.3 Low Level Contact Resistance, LLCR, per EIA-364--23
2.3.1 27.9 milli Ohms Average - Contact System
2.4 Current Carrying Capacity fo r a 30°C temp rise, CCC, per EIA-364-70
2.4.1 3.4 A (4 Contacts in series) 2.4.2 7.8 A - G ND System, Two Banks
3.0 MATERIALS
3.1 Insulator Material
3.1.1 LCP
3.2 Contact
3.2.1 Copper Alloy with Gold over 50 micro Inches Nickel
4.0 MECHANICAL
4.1 Operationa l Temperature
4.1.1 -55 degrees C to 125 degrees C
4.2 Mating/Unmating forces, per EIA-364-13
4.2.1 22.8/16.7 lbs respectively - Four Banks
4.3 Durability after 100 cycles per EIA-364-2
4.3.1 LLCR change < 15.0 m illi-Ohms (L- plating) --- PASS 4.4 Normal Force at 0.006 inc hes deflection, per EIA-364-04 4.4.1 141.9 gr.
Series: QMSS/QFSS High Speed Shielded Terminal 0.635 mm pitch © 2004 Samtec, Inc. Reviewed by: JET Revision: B Specification: PSQ-005 Approved by: JT Date:2/16/2011 Checked by: JE Page 2
5.0 ENVIRONMENTAL
5.1 Thermal Aging per EIA-364-17
5.1.1 No Evidence of Physical Damage seen --- PASS
5.1.2 Change in Contact LLCR did not exceed +15.0 milli-Ohms (L- plating) --- PASS
5.1.3 Test Conditions
5.1.3.1 105 degrees C 5.1.3.2 250 hours
5.2 Cyclic Humidity per EIA-364-31
5.2.1 No Evidence of Physical Damage seen --- PASS
5.2.2 Insulation Resist ance > 5000 Meg Ohms --- PASS
5.2.3 No evidence of Break down or Arcing when applying 750 VAC
--- PASS 5.2.4 Change in LLCR not to exceed +15.0 milli-Ohms (L- plating) --- PASS
5.2.5 Test Conditions
5.2.5.1 Cyclic 25 degrees C to 65 degrees C for 240 hours,
at 90% to 95% RH
5.2.5.2 Time Condition "B" (240 hours) for Method III,
excluding sub-cycle 7A and 7B
5.3 Thermal Shock per EIA-364-32
5.3.1 No Evidence of Physical Damage seen --- PASS
5.3.2 Change in Signal LLCR did not exce ed +15 mOhm --- PASS
5.3.3 No evidence of Break down or Arcing when applying 700 VAC
5.3.4 Insulation Resist ance > 5000 Meg Ohms --- PASS
5.3.5 Test Conditions
5.3.5.1 # Thermal Cycles: 100
5.3.5.2 Hot Temp: 85 degrees C +3 degrees C/-0 degrees C
5.3.5.3 Cold Temp: -55 degr ees C +0 degrees C/-3 degrees C
5.3.5.4 Dwell/ Configuration: 30 Minutes, Mated and Mounted
5.3.5.5 Hot/Cold Transition: Instantaneous
5.4 Mechanical Shock per EIA-364-27
5.4.1 Change in Signal LLCR did not exce ed +15 mOhm --- PASS
5.4.2 Test Conditions
5.4.2.1 Peak Value: 100 G
5.4.2.2 Duration: 6 milliSec
5.4.2.3 Waveform: Sawtooth
5.4.2.4 Velocity: 11.3 FPS 5.4.2.5 # Shocks/Directi on: 3 Shocks/3 Axes (18 total)
Series: QMSS/QFSS High Speed Shielded Terminal 0.635 mm pitch © 2004 Samtec, Inc. Reviewed by: JET Revision: B Specification: PSQ-005 Approved by: JT Date:2/16/2011 Checked by: JE Page 3
5.5 Mechanical Shock per EIA-364-27
5.5.1 No Evidence of Physical Damage seen --- PASS
5.5.2 No Contact Interruptions greater than 1.0 microSec --- PASS
5.5.3 Test Conditions
5.5.3.1 Test Condition: Test Condition "C"
5.5.3.2 Peak Value: 100 G
5.5.3.3 Duration: 6 milliSec
5.5.3.4 Waveform: Half Sine
5.5.3.5 Velocity: 12.3 FPS 5.5.3.6 # Shocks/Directi on: 3 Shocks/3 Axes (18 total)
5.6 Vibration per EIA-364-28
5.6.1 No Evidence of Physical Damage seen --- PASS
5.6.2 Change in Signal LLCR di d not exceed +15 mOhm --- PASS
5.6.3 No Contact Interruptions greater than 1.0 microSec --- PASS
5.6.4 Test Conditions
5.6.4.1 Test Condition: Test condition V, Letter "B", Random
5.6.4.2 Frequency: 50 to 2000 Hz
5.6.4.3 PSD: 0.04
5.6.4.4 Duration: 2 Hour/Axis, 3 Axes Total
5.6.4.5 G's: 7.56 G rms
5.7 Vibration per EIA-364-28
5.7.1 No Evidence of Physical Damage seen --- PASS
5.7.2 No Contact Interruptions greater than 1.0 microSec --- PASS
5.7.3 Test Conditions
5.7.3.1 Test Condition: B
5.7.3.3 Frequency: 50 to 2000 Hz
5.7.3.4 Duration: 2 Hour/Axis, 3 Axes Total
5.7.3.5 G's:
6.0 MIXED FLOWING GAS, MFG
6.1 Change in Signal LLCR a fter 10 days mated did not exceed
+15 mOhm --- PASS
6.1.1 Test Conditions
6.1.1.1 Temperature: 30 C
6.1.1.2 RH: 70%
6.1.1.3 Chlorine, CL2: 10 ppb
6.1.1.4 Nitr ogen Oxide, NO2: 200 ppb
6.1.1.5 Hydrogen Sulfide, H2S: 10 ppb
6.1.1.6 Sulfur Dioxide, SO2: 100 ppb
Series: QMSS/QFSS High Speed Shielded Terminal 0.635 mm pitch © 2004 Samtec, Inc. Reviewed by: JET Revision: B Specification: PSQ-005 Approved by: JT Date:2/16/2011 Checked by: JE Page 4
7.0 HIGH FREQUENCY PERFORMANCE
7.1 Empirical Boundaries on Perf ormance with Sinusoidal Signals
7.1.1 DV configuration, readi ngs based on 3dB insertion loss frequency.
7.1.2 System Impedance: 50 Ω and 100Ω for Single-Ended and Differential
Pair respectively.
7.1.3 For complete test information, click HERE
7.2 QMSS/QFSS, Single-Ended Signaling
QMSS/QFSS, Single-Ended Signaling Socket Header Mated Height Configuration Signaling Performance QFSS-026-01-L-D-A QMSS-026-11-L-D- A 11mm Standard Single-Ended 6.0 GHz
7.3 QMSS-DP/QFSS-DP Differential Pair Signaling
QMSS-DP/QFSS-DP Differential Pair Signaling Socket Header Mated Height Configuration Signaling Performance QFSS-026-01-L-D-DP-A QMSS-026-11-L-D-DP-A 11mm -DP Differential Pair 7.5GHz For additional information, contact Samtec Signal Integrity Group sig@samtec.com or 1-(800)-726-8329.
Series: QMSS/QFSS High Speed Shielded Terminal 0.635 mm pitch © 2004 Samtec, Inc. Reviewed by: JET Revision: B Specification: PSQ-005 Approved by: JT Date:2/16/2011 Checked by: JE Page 5
8.0 PROCESSING, LEAD-FREE
9.0 PROCESSING, Sn63/Pb37
Series: QMSS/QFSS High Speed Shielded Terminal 0.635 mm pitch © 2004 Samtec, Inc. Reviewed by: JET Revision: B Specification: PSQ-005 Approved by: JT Date:2/16/2011 Checked by: JE Page 6
10.0 Multi Connector Processing Placement Limitations – See Following Figures
10.1 When using multiple connectors on a printed circuit board, care must be
taken to ensure proper alignment and the following figures illustrate the placement limitations for these connectors, but do not take into account the spacing required for additional components, or automatic placement / rework equipment.
10.2 For applications requiring more than two connectors per board, please
contact Samtec’s Interconnect Processing group at ipg@samtec.com
10.3 Multi Connector processing – Constrained Board Alignment
Constrained Board Alignment-multi connectors processed to Boards CTE differences between PCB/fixturing during re-flow must be considered regarding connector locations
Series: QMSS/QFSS High Speed Shielded Terminal 0.635 mm pitch © 2004 Samtec, Inc. Reviewed by: JET Revision: B Specification: PSQ-005 Approved by: JT Date:2/16/2011 Checked by: JE Page 7